2019 Global Semiconductor Packaging Materials Industry

1
Global Semiconductor Packaging Materials Market
2015-2019
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• Published February 2015
• Single User PDF US 3000
• Corporate User PDF US 4500

2
Global Semiconductor Packaging Materials Market
2015-2019

• Semiconductor packaging materials comprise
  metals, plastic, and ceramic components. They not
  only protect the IC on the semiconductor die, but
  also interconnect the die and the PCB. They
  protect the die from external mechanical impacts
  and corrosion, and also act as an electrically
  conductive interconnects with excellent signal
  propagation properties. Excessive heat in the
  circuits is dissipated through heat spreaders.
  Packaging components vary in dimensions and
  functionality.
• Analysts forecast the Global Semiconductor
  Packaging Materials market to grow at a CAGR of
  4.33 percent over the period 2014-2019.
•  
• Covered in this Report
• The Global Semiconductor Packaging Materials
  market can be divided into seven segments based
  on the type of product Organic Substrates,
  Bonding Wires, Leadframes, Encapsulation Resins,
  Ceramic Packages, Die Attach Materials, and Other
  Semiconductor Packaging Materials. The key
  consumers of these packaging materials are the
  Electronics Industry, the Semiconductor Industry,
  and the Automotive Sector.
• Global Semiconductor Packaging Materials Market
  2015-2019, has been prepared based on an in-depth
  market analysis with inputs from industry
  experts. The report covers the APAC region, North
  America, and Europe it also covers the Global
  Semiconductor Packaging Materials market
  landscape and its growth prospects over the
  coming years. The report also includes a
  discussion of the key vendors operating in this
  market.

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3
Global Semiconductor Packaging Materials Market
2015-2019

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• Key Regions
• APAC
• Europe
• North America
•  
• Key Vendors
• Alent
• BASF
• Henkel
• Hitachi Chemical
• Kyocera
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4
Global Semiconductor Packaging Materials Market
2015-2019

• Other Prominent Vendors
• Beijing Doublink Solders
• Beijing Kehua New Chemical Technology
• Cheil Industries
• Diehl Metall
• Duksan Hi-metal
• DuPont 
• Dynacraft
• Evergreen Semiconductor Materials
• Guangdong Rongtai
• Heesung Metal
• Heraeus
• Honeywell Electronic Materials
• Ibiden
• Indium
• IQE

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5
Global Semiconductor Packaging Materials Market
2015-2019

• KCC
• LG Innotek
• Lintec
• Lord
• Mitsui High-Tec
• MK Electron
• Nanya PCB
• Ningbo Dongsheng IC
• Nippon Micrometal
• Nitto Denko
• Poongsan
• Samsung Techwin
• Shanghai Sinyang Semiconductor Materials
• Shin-Etsu Chemical
• Shinko
• Sumitomo Metal Mining
• Tanaka Denshi Kogyo
• Tatsuta Electronic Materials
• Xiamen Yonghong Electronics

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6
Global Semiconductor Packaging Materials Market
2015-2019

• Key Market Driver
• Surge in Sales of Smartphones and Smart Devices
•  
• Key Market Challenge
• High Dependency on Performance of Semiconductor
  Equipment Industry
•  
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•  
• Key Market Trend
• Popularity of Redistributed Chip Packaging
• Key Questions Answered in this Report
• What will the market size be in 2019 and what
  will the growth rate be?
• What are the key market trends? 
• What is driving this market?
• What are the challenges to market growth?

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7
Global Semiconductor Packaging Materials Market
2015-2019

• Who are the key vendors in this market space?
• What are the market opportunities and threats
  faced by the key vendors?
• What are the strengths and weaknesses of the
  key vendors?
•  
• Explore Report on Advanced Materials Market.
•  
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  391 5441 for further information on Global
  Semiconductor Packaging Materials Market
  2015-2019 report OR for any other market
  research and intelligence needs you may have for
  your business.

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