PCB Market Analysis 2015-2020 with Industry Chain Structure, Competitive Landscape

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Global PCB Industry Report, 2015-2020
View Complete Report _at_ http//www.rnrmarketresearc
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report.html
Published By -gt Research In China No. of Pages -gt
191
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Global PCB Industry Report, 2015-2020

• The report focuses on the following aspects
• Global PCB Market and Status Quo of the Industry
• Global Downstream Markets of PCB
• Mobile Phone PCB Trends
• Tablet PC/Laptop Computer/Automotive PCB Trends
• Ranking of Global and Chinese PCB Vendors
• Study of Major Global and Chinese PCB Vendors

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Global PCB Industry Report, 2015-2020
Global PCB Vendors 1. ZDT2. TTM3. Unimicron4.
COMPEQ5. Tripod Technology6. HannStar Board7.
Nan Ya PCB8. Chin-Poon Industrial9. Gold
Circuit Electronics10. MEIKO11. ATS12.
CMK13. IBIDEN14. T.P.T15. DAEDUCK
16. SIMMTECH17. LG INNOTEK18. SEMCO19.
Unitech20. Dynamic21. Ellington22. WUS Printed
Circuit23. Shennan Circuit24. Kinwong25.
Fastprint26. Founder PCB27. Wuzhu
Technology28. ISU PETASYS29. KBC
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Global PCB Industry Report, 2015-2020
Global Top10 HDI Vendors in 2015 by Revenue
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Global PCB Industry Report, 2015-2020
Major Points from Table of Contents 1 Global PCB
Market and Industry 2 Global Downstream Markets
of PCB 3 Global PCB Vendors 4 PCB Vendors
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Global PCB Industry Report, 2015-2020
Global PCB market was valued at USD57 billion in
2015, a 4.4 decline from 2014, largely due to
1) depreciation of Japanese yen, euro, and NTD
against the dollar 2) stagnation in saturated
mobile phone market, continuous decline in PC
market, and a plunge in tablet PC market. The
sluggish demand from downstream markets has
extended to 2016 and it is expected there will be
no substitute for smartphone to drive PCB market
until the year 2020. Global PCB industry is
projected to keep shrinking in 2016 with a market
size of USD55.3 billion (a 3.0
contraction). Automotive PCB market is the
biggest highlight. Global automotive PCB market
size was USD5.28 billion in 2015 and is expected
to grow by 8.3 to USD5.72 billion in 2016 and by
8.2 to USD6.19 billion in 2017, primarily
because of impetus of millimeter-wave radar to RF
board, of connected vehicle to multi-layer board,
and of chassis electronization to metal
substrate. The biggest change in PCB industry in
2017 will be wider application of substrate like.
According to Apples suppliers, iPhone 7S/8 to be
launched in 2017 will see some substantial
upgradings in specification with substrate-like
HDI replacing commonly-used HDI so as to
massively import System in Package (SiP)
technology with the aim of modularizing
sub-system.
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Global PCB Industry Report, 2015-2020
Compared with traditional HDI, the biggest change
in the specification of substrate-like HDI is the
line space/width on circuit board which moves
toward fine pitch in order to work properly with
SiP technology. Particularly, the line
space/width must be miniaturized below 35
micrometers. In such case, traditional PCB HDI
process cannot meet technical requirements on
fine pitch, and large sums of money are needed to
upgrade manufacturing equipment and re-explore
production processes. By contrast, IC substrate
vendors can easily produce such PCB, showing
overwhelming superiority. According to Apples
suppliers, for iPhone 7S/8 to be launched in
2017, the original one large traditional HDI
board will be disassembled into four small
substrate-like HDI boards, thus not only speeding
up import of SiP technology but also freeing up
more space for larger battery capacity. Apple has
asked suppliers to send samples in the third
quarter, attracting IC substrate vendors
including Ibiden, Kinsus, and Unimicron to
scramble for orders. However, it now seems that
Kinsus, a key SiP board supplier for Apple, has
the best chance of winning substrate-like HDI
order, and ASE Group is likely to grab SiP
packaging testing order.
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Global PCB Industry Report, 2015-2020
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