3D ICS MARKET ANALYSIS | COHERENT MARKET INSIGHTS

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3D ICS MARKET ANALYSIS

• 3D ICs Market, By End-Use Sectors (Consumer
  electronics, Information and communication
  technology, Transport (automotive and aerospace),
  Military, Others (Biomedical applications and
  RD)), by Substrate Type (Silicon on
  insulator(SOI), Bulk silicon), by Fabrication
  Process ( Beam re-crystallization, Wafer bonding,
  Silicon epitaxial growth, Solid phase
  crystallization), by Product (MEMS and Sensor, RF
  SiP, Optoelectronics and imaging, Memories (3D
  Stacks), Logic (3D Sip/Soc), HB LED) and by
  Region (North America, Europe, Asia Pacific, RoW)
  - Size, Share, Outlook, and Opportunity Analysis,
  2020 - 2027

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• The global 3D ICs Market was valued at US
  7,521.4 Mn in 2019 and is forecast to reach a
  value of US 38,252.9 Mn by 2027 at a CAGR of
  22.5 between 2020 and 2027.

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Market Drivers

• Increasing demand for efficient solutions is
  expected to drive growth the global 3D ICs market
  during the forecast period
• High growth of electronics market has
  accelerated innovations such as three-dimensional
  ICs. Since there has been increase in trend of
  mobile, fast, compact, and easy to use of
  products, the global electronics industry is
  witnessing demand for systems with enhanced
  performance, optimized working, and minimal
  response. Similarly, semiconductor chip
  manufacturers are facing various challenges and
  constant pressure to enhance performances, while
  reducing chip sizes. Furthermore, 3D ICs with
  TSVs provide an enhanced electrical performance
  due to the very high number of TSV
  interconnections and short interconnects within
  stacked ICs. Hence, these factors are expected to
  drive growth of the global 3D ICs market during
  the forecast period.

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• Rising adoption of portable devices is expected
  to propel the global 3D ICs market growth over
  the forecast period
• Since 3D ICs provide enhanced memory bandwidth
  and reduced power consumption, they are being
  increasingly used in smartphones and tablets.
  Many players from the semiconductor industry such
  as fabs and foundries are focused on
  heterogeneous integration of chip components to
  enhance user experience, owing to growing
  popularity of smartphones, e-books, and other
  mobile devices. Furthermore, 3D ICs with TSV
  technology allows designers to position stacks of
  memory chips on top of the graphics processor
  chip or on application microprocessors, in order
  to considerably reduce power consumption and
  enhance memory bandwidth. Therefore, these
  factors are expected to propel the market growth
  in the near future.

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• APAC held dominant position in the global 3D ICs
  market in 2019, accounting for 47.3 share in
  terms of value, followed by North America, Europe
  and RoW respectively.

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Market Restraint

• High cost associated and testing issues are
  expected to restrain growth of the global 3D ICs
  market during the forecast period
• There are several issues related to 3D ICs such
  as thermal effects, which in turn, affect the
  reliability and resiliency of interconnects in 3D
  circuits. Examination of thermal issues in 3D
  integration is compulsory to evaluate the thermal
  robustness of various 3D design options and
  technology. 3D ICs offer various advantages
  however, these advantages come with considerable
  disruption in wafer fabs and at a very high cost.
  For instance, Xilinx, Inc. offers Virtex-7 FPGA
  VC709 connectivity kit with a price of around US
  4,995. Therefore, these factors are expected to
  restrain growth of the market during the forecast
  period.

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• Lack of foundries and assemble houses is expected
  to hinder the global 3D ICs market growth over
  the forecast period
• Manufacturing of 3D ICs requires fully
  functional foundries with skilled personnel to
  operate. Currently, there is a lack of adequate
  foundries and skilled professionals to
  manufacture 3D ICs, especially in emerging
  economies such as Philippines, Brazil, Africa,
  and Indonesia. Thus, these factors are expected
  to hinder the global 3D ICs market growth over
  the forecast period.

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Market Opportunities

• Advent of big data analytics can present
  lucrative growth opportunities
• Majority of companies generate a vast amount of
  data from their business operations. Furthermore,
  many organizations use government data, external
  data from social media and other public sources
  of data to supplement the internal data. Storage,
  processing, and transfer of this data are the key
  challenges faced by these companies. Furthermore,
  in big data analytics, processors and memory are
  crucial IC components. 3D IC plays a key role in
  combining these two components and provides
  speed, high bandwidth, and lowers power
  consumption.
• Collaborations among market players can provide
  business opportunities
• Major companies in the market are focused on
  collaboration activities, in order to gain a
  competitive edge and enhance the market presence.
  For instance, in September 2013, TSMC
  collaborated with Cadence Design Systems Inc. to
  manufacture a 3D IC reference flow that
  facilitates innovative 3D stacking. In May 2013,
  STATS ChipPAC Ltd. collaborated with Qualcomm
  Technologies Inc. and ASTAR Institute of
  Microelectronics to deliver technology building
  blocks for low lost interposers used in 2.5D/3D
  ICs.

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Market Trends

• Multi-chip packaging is a major trend
  Multi-chip packaging is one of the emerging
  trends in the 3D integrated circuit market. In
  multi-chip packaging, a large number of
  transistors are packed into a single 3D
  integrated circuit. This approach enables better
  interaction among the processor and memory
  hence, this type of packaging is essential for
  memory enhanced applications. Multi-chip
  packaging is one of the crucial developments that
  would drive the growth of the 3D ICs market in
  the near future.
• IntSim is another major trend IntSim is a
  computer-aided design tool used to simulate 2D
  and 3D integrated circuits. This open-source tool
  can be used for forecasting 2D or 3D chip power,
  a number of metal levels, die size, and best
  possible sizes of metal levels depending on
  several design parameters and technology. Using
  this tool, users can study scaling trends and
  minimize chip designs.

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Global 3D ICs Market - Impact of Coronavirus
(Covid-19) Pandemic

• Due to Covid-19 pandemic, many industries
  witnessed significant shift in their business.
  There is significant impact on the growth of 3D
  ICs market. As manufacturing operations are
  temporarily suspended across many countries to
  contain the coronavirus. There is shortage of 3D
  ICs in the market caused by less production of 3D
  ICs.  Many manufacturing companies such as
  Samsung, Xiaomi, OPPO and LG Display have
  suspended their manufacturing operations in
  China, India, South Korea and in European
  countries. For instance, in May 2020, OPPO
  Company has shut down its operations in Noida as
  six employees test coronavirus positive.
  Additionally, due to this pandemic, the demand
  for these 3D IC integrated devices is exacerbated
  by lockdown imposed in several countries.

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Competitive Section

• Key players operating in the global 3D ICs
  market are Taiwan Semiconductor Manufacturing
  Company, Ltd., MonolithIC 3D Inc., XILINX, Inc.,
  Elpida Memory, Inc. (Micron Technology, Inc.),
  The 3M Company, Ziptronix, Inc., STATS ChipPAC
  Ltd., United Microelectronics Corporation, and
  Tezzaron Semiconductor Corporation.

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