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Thin Film Growth

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Title: Thin Film Growth


1
Thin Film Growth
  • Lecture 12
  • G.J. Mankey
  • gmankey_at_mint.ua.edu

2
Factors Influencing Film Growth
  • Surface energy.
  • Interfacial energy.
  • Substrate temperature.
  • Interface crystallography.
  • Type of deposition source.
  • Background gas.
  • Surfactants.

3
Surface Energy
  • Bauer (1980s) described film growth in terms of
    surface energy with the relation
  • It states that for layer by layer growth to
    occur, the surface energy of the growing film
    must be less than or equal to the surface energy
    of the substrate minus the interfacial energy of
    the film and substrate.
  • The equation is based on the assumption that the
    substrate temperature is high enough to achieve
    thermodynamic equilibrium.

4
Equilibrium Growth Modes
  • Layer-by layer or Frank-van der Merwe--the film
    grows with only the surface layer having
    fractional coverage at any instant i.e. the
    "interface width" at the film vacuum interface is
    one atomic layer.
  • Island or Volmer-Weber--the film does not "wet"
    the substrate since the Bauer condition is not
    met. The "interface width" of the growing
    surface increases with time.
  • Layerisland or Stranski-Kastranov--After wetting
    the substrate, the film grows in an island mode
    and the interface width increases with time.

5
Metastable Growth Modes
  • Diffusion-limited--the incoming atoms "stick
    where they land" and the film growth is
    characterized by a interface width which
    increases as da where a is the power law exponent
    (1/4 for perfect diffusion-limited growth).
  • Downward funneling--The impinging atoms maintain
    a component of vertical momentum and tend to fill
    in the lower areas of the interface, so the
    interface width saturates at 3-7 atomic layers.

6
Interfacial Energy
  • Some materials have a negative enthalpy of mixing
    with one another--they are miscible.
  • These materials tend to mix strongly at the film
    substrate interface to give a film-substrate
    "interface width" that may extend over many
    atomic layers.
  • One example is transition metals on Si which tend
    to form silicides with varying stoichiometry over
    the vertical interface width.

7
Immiscible Materials
  • An immiscible film-substrate combination will
    generally form an atomically-sharp interface,
    however there are some examples are in the
    literature where the epitaxial strain at the
    interface will change the situation.
  • If the Bauer condition is satisfied, layer or
    layerisland growth will be observed.
  • When the film has a high surface energy compared
    to the substrate, a layer of substrate material
    may segregate to the surface with the film
    sandwiched in the middle.

8
Substrate Temperature
  • The substrate temperature and flux are the
    primary factors that determine the resulting film
    morphology.
  • Low substrate temperatures or high flux rates (gt1
    nm/sec) result in metastable thermodynamic
    phases.
  • Interface mixing and substrate segregation may be
    suppressed for low temperature growth.
  • Details depend on materials properties such as
    melting points, epitaxial mismatch and enthalpy
    of mixing.
  • Atomically smooth films are usually the exception
    rather than the rule.

9
Interface Crystallography
  • If the growing film crystal structure has a
    specific relation to the substrate
    crystallography the film is epitaxial which means
    the film and substrate have an in-plane
    orientation relationship.
  • If the film has the same crystal structure as
    well as the same lattice constant then the film
    is pseudomorphic to the substrate.
  • If only an out of plane relationship is
    maintained then the film is highly textured with
    most of the surface comprised of the same
    crystallographic plane and rotated domains in the
    plane of the film.

10
Deposition Sources
  • Evaporators--the incoming atoms have kinetic
    energies of the order of less than 1 eV--the
    atoms have a small amount of energy to dissipate
    on the growing surface.
  • Sputter sources--the incoming atoms may have
    energies as high as several hundred eV--the
    incoming atoms are likely to mix strongly at the
    interface with the film since their energies are
    sufficient to break bonds in most solids.
  • Pulsed laser deposition--kinetic energies similar
    to evaporators with the incoming atoms often in
    highly excited electronic states or multiply
    ionized states.

11
Background Gas
  • In poor vacuum (gt10-7 mbar) the gas is mostly
    water vapor. The water adsorbed on the surface
    may increase the mobility of surface atoms and
    the oxygen may be incorporated in the growing
    film.
  • Intermediate vacuum (10-9 mbar lt P lt 10-7 mbar)
    the presence of CO and CO2 on the surface may
    dominate the growth process--Look for C to be
    incorporated in the film.
  • The gas may help to stabilize metastable
    phases--see vast literature of Fe/Cu(100) system.

12
Surfactants
  • A surfactant bonds more strongly to the film
    material than the substrate, so the Volmer-Weber
    growth mode may be suppressed.
  • Surfactants are characterized by a "floating out"
    efficiency or capability of the surfactant atoms
    to remain on the surface without being
    incorporated in the film.
  • Surfactants may also significantly alter surface
    morphology to enable the formation of atomically
    smooth films.
  • It is difficult to remove surfactants after they
    have done their job.
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