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Title: Fabrication of Nanoscale BLM Biosensors


1
Fabrication of Nanoscale BLM Biosensors
  • Tadahiro Kaburaki (Cornell)
  • MR Burnham (Wadsworth Postdoc)
  • M.G. Spencer (Cornell PI)
  • James Turner (Wadsworth PI)
  • Xinquin Jiang (Cornell)

2
Presentation Contents
  • Objectives
  • Background
  • Fabricated devices
  • Signal Processing
  • Current Goals

3
Objectives
  • Fabrication of a stable platform for transducing
    signals through artificial BLMs
  • Allow for the most stable BLM possible
  • Analysis of BLM impedance characteristics
  • Including signals produced with proteins
  • Packaging of a sensor with analytic capabilities
    on-chip

4
BLMs
Bilayer Lipid Membranes
  • Composed of a hydrophilic polar head and
    hydrophobic non polar tail
  • 5nm thickness with .5nm2 area / lipid molecule
  • BLMs have high resistances and high capacitances

An Artist's conception of ion channels in a lipid
bilayer membrane (taken from Hille, B., 1992.
Ionic Channels of Excitable Membranes. Sinauer,
Sunderland, Massachusetts.)
5
Why use a BLM/protein system?
  • Biosensors based on natural receptors (proteins)
    with BLMs provide a sensitive and selective
    method of sensing chemical species (ions or
    molecules)
  • Upon binding with analytes, transport proteins
    change their transport behavior across BLMs
  • These types of sensors are unique in that they
    have molecular recognition as well as signal
    tranduction properties.

6
Electrochemical Impedance Spectroscopy (EIS)
  • A small amplitude sinusoidal voltage is applied
    across the device
  • The frequency dependant impedance is measured as
    a magnitude and phase angle

electrodes
device
7
Electrochemical Impedance Spectroscopy (EIS)
8
Electrochemical Impedance Spectroscopy (EIS)
9
Electrochemical Impedance Spectroscopy (EIS)
  • Every circuit element has a transfer function
  • Transfer functions are used to derive the
    resistance and capacitance of the system

Component Current Vs.Voltage Impedance
resistor E IR Z R
inductor E L di/dt Z jwL
capacitor I C dE/dt Z 1/jwC
10
Electrochemical Impedance Spectroscopy (EIS)
  • The most basic circuit model utilized is
  • This circuit has a function of

Zel
11
Electrochemical Impedance Spectroscopy (EIS)
  • Assuming some knowledge of the circuit structure,
    a transfer function can be derived and the
    circuit parameters can be extracted.

12
Electrochemical Impedance Spectroscopy (EIS)
  • Unfortunately, these systems can be far more
    complicated due to a variety of other parasitic
    interactions
  • A primary source of these complications is the Si
    substrate itself which is highly conductive.
    This presents a low conductance, high capacitance
    pathway when combined with the membrane.

13
Electrochemical Impedance Spectroscopy (EIS)


14
Fabrication Requirements
  • Hold a stable membrane
  • Smooth and clean surface
  • Preferably oxide surface
  • Porous surface
  • Allow for signals to be passed through
    membrane/proteins
  • Pore size should be small to increase the
    stability of suspended region and prevent lipids
    from forming conformally to the surface

15
Fabrication Requirements
  • Measure signals with a high S/N ratio
  • Need a high resistance, low capacitance substrate
  • Prevents capacitive coupling, capacitive signal
    leakage
  • High resistance allows for signals to be measured
    only through the membrane area
  • Good electrode placement
  • i.e. Ag/AgCl electrodes for Cl- measurement

16
Porous alumina substrates
  • Designed by Xinquin Jiang (Spencer group)
  • Utilizes porous alumina formed

17
Porous Alumina Substrate Fabrication
  • Use LPCVD (Low Pressure Chemical Vapor
    Deposition) to coat a 4 DSP (Double sided
    polish) wafer with Silicon Nitride

Si
Si3N4
18
Porous Alumina Substrate Fabrication
  • Etch a 180 micron x 180 micron square window on
    the backside of the substrate

19
Porous Alumina Substrate Fabrication
  • Use KOH as a wet etchant to etch through the Si
    substrate
  • KOH preferentially etches lt100gt crystal plane,
    resulting in a V-groove

20
Porous Alumina Substrate Fabrication
  • Evaporate a thin layer of Al onto the front side
    of the substrate

Al
21
Porous Alumina Substrate Fabrication
  • Anodize the aluminum
  • Al(metal) Al2O3

22
Porous Alumina Substrate Fabrication
  • Etch the backside to remove the Si2N3

23
Porous Alumina Substrate Fabrication
  • Alumina film characteristics can be adjusted by
    use of phosphoric acid and anodization conditions

24
Porous Alumina Substrate Fabrication
  • BLM can then be deposited

25
Signals obtained from this system
  • Our results are comparable to state of the art
    systems
  • The results do require some amount of
    interpretation
  • This is because the systems on which the BLMs
    reside are not identical.

26
  • Si substrates have a much lower resistance and
    higher capacitance than quartz substrates

Sample AREA Impedance Impedance Impedance
0.1 Hz 1 Hz 10 Hz
Quartz plus oxide 88 mm2 46.25 GO 14.02 GO 1.67 GO
Silicon, N-type 0.005-0.02 O-cm 88 mm2 1.51 MO 173 kO 21.32 kO
Silicon plus oxide 88 mm2 559.6 MO 53.58 MO 5.66 MO
Silicon/Nitride/Alumina (no H2PO4 etching) 88 mm2 25.21 MO 4.197 MO 494 kO
Silicon/Nitride/Alumina (no H2PO4 etching) 12.6 mm2 18.91 MO 3.85 MO 503 kO
Silicon/Nitride/Alumina (H2PO4 etch 20 min) 88 mm2 1.63 MO 133 kO 25.02 kO
Silicon/Nitride/Alumina (H2PO4 etch 20 min) 12.6 mm2 3.26 MO 488.5 kO 72.32 kO
27
Proposed Structure
  • Change of Silicon substrate for SiO2
  • Difficulty in etching through the wafer
  • HF wet etch is isotropic
  • Dry etching of SiO2 has a maximum rate of
    100nm/minute which is 5000 minutes for a 500um
    wafer.

28
Proposed Structure
  • Cut 100um diameter holes in a quartz substrate
    with a micromachining laser

Quartz
29
Proposed Structure
  • Cut 100um diameter holes in a quartz substrate
    with a micromachining laser

30
Proposed Structure
  • Anodize the aluminum
  • Al(metal) Al2O3

31
Proposed Structure
  • Coat the surface with a polymer (polyimide or
    adhesive wax)

32
Proposed Structure
  • Adhere the Si and quartz surfaces (hot press)

33
Proposed Structure
  • Dry etch the Si wafer (Bosch etch process) at a
    rate of 1um/minute. Dry etch polymer (RIE)

34
Proposed Structure
  • BLM can then be deposited

35
The Next Step
  • Addition of proteins
  • The proteins are the mechanism by which the
    environment is actually measured
  • Measurements will be made at a single frequency
    that is chosen to maximize sampling while
    remaining in the resistive regime
  • Optimally this frequency will be in the kHz range

36
  • Hirano from Nihon University used a patch clamp
    to measure current openings from a single
    gramicidin protein in response to different
    concentrations of ferritin avidin

37
  • Opening percentage vs. FA concentration

38
Conclusion
  • We have developed a system to hold membranes at a
    high resistance over a patterned substrate
  • Current readings are feasible and should generate
    readable results due to the larger number of
    measurement proteins

39
Wadsworth Center (State of NY)
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