NASA Workmanship Standards

1
NASA Workmanship Standards

• Technical Committee Meeting
• March 30-31, 1999
• Ames Research Center

2
Status of NASAs Standards

• NASA-STD-8739.3, Soldered Electrical Connections
  (and NAS 5300.4(3M), Surface Mount Technology
  Although there have not been any NTS Improvement
  Proposal forms sent to HQ for these documents,
  events regarding IPCs J-STD-001 and requests for
  Single Process Initiatives suggest its time to
  reaffirm our commitment to maintaining a
  soldering standard suitable for NASAs unique
  operating environment. To that end, a proposed
  draft prepared by Mark Strickland (MSFC) that
  merges NASA-STD-8739.3 and NAS 5300.4(3M) into
  one document will be reviewed in detail later in
  this meeting.

3
Status of NASAs Standards (contd)

• NASA-STD-8739.4, Crimping, Interconnecting
  Cables, Harness, and Wiring. Submissions have
  been received via NTS Improvement Proposal forms
  for this standard. The comments were distributed
  by email last week and will be addressed during
  this meeting.
• NASA-STD-8739.5, Fiber Optic Terminations, Cable
  Assemblies, and Installation. This newest NASA
  Technical Standard has not generated any comments
  from the user community (somewhat of a surprise).
  There are no plans to address this standard
  during this meeting.

4
Status of NASAs Standards (contd)

• NASA-STD-8739.7, Electrostatic Discharge Control.
  As discussed in the last meeting at SSC, this
  standard has several areas that could use
  improvement. However, with the pending release
  of the ESD Association standard (expected in June
  or July, 1999), it was agreed that it was
  impractical to expend any effort on this standard
  when its probable cancellation is so near.
• NAS 5300.4(3J-1), Staking and Conformal Coating
  of Printed Wiring Boards and Electronic
  Assemblies. This standard remains in use in its
  current form, although several students have
  asked why potting and bonding are not included.

5
Status of Industry Standards

• IPC/J-STD-001. Revision C was voted into
  Interim Finaldraft at Long Beach meetings
  3/17-18/99. Although there were several changes,
  few, if any, address the issues that concern
  NASA. This is not a fault of J-STD-001, rather
  it reflects the low percentage niche market NASA
  comprises.
• This committee should consider approving its use
  for all ground systems that do not involve a
  flight-type environment or for specific flight
  projects where using unproven manufacturing
  processes is an acceptable risk.

6
Status of Industry Standards (contd)

• IPC-3710 3711. These documents will provide a
  crimp and cable fabrication specification
  (IPC-3710) and acceptability standard (IPC-3711).
  To ensure continuity between the documents, they
  will be constructed as one document and separated
  prior to publication.
• The relationship between these documents is
  similar to that of J-STD-001 (IPC-3710) and
  IPC-A-610 (IPC-3711).
• NASA experience is being relied upon heavily for
  establishing the Class 3 requirements for these
  documents.
• Appears promising to replace NASA-STD-8739.4.

7
Status of Industry Standards (contd)

• IPC just awarded a contract to develop and IPC
  sanctioned rework and repair certification
  program. Course will be based on existing IPC
  rework and repair standards, with defaults to
  J-STD-001 for overall processes.
• There has been no feedback on NASAs adoption of
  IPC printed wiring board specifications IPC-6011
  IPC-6012.

8
Status of Industry Standards (contd)

• ESD Association Draft Standard DS20.20. This
  committee met February 5-6, 1999, at Charlotte,
  NC, to disposition comments received against the
  current draft.
• Seven comments were too late to be discussed in
  Charlotte. These will be dispositioned by the
  committee via email/telecon in anticipation of a
  June/July release date.
• Will be recommended as an unconditional
  replacement for NASA-STD-8739.7.
• International Electrotechnical Commission (IEC)
  is considering ceasing their efforts to create an
  international ESD standard and using DS20.20.