Bridging Theory in Practice

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Bridging Theory in Practice

• Transferring Technical Knowledge
• to Practical Applications

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Semiconductor Manufacturing
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Semiconductor Manufacturing
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Semiconductor Manufacturing

• Intended Audience
• Electrical engineers with a desire to learn more
  about how semiconductor components are
  fabricated, packaged, and tested
• Topics Covered
• How are semiconductor components fabricated?
• How are semiconductor components packaged?
• How are semiconductor components tested?
• Expected Time
• Approximately 30 minutes

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Semiconductor Manufacturing

• How are semiconductor components fabricated?
• How are semiconductor components packaged?
• How are semiconductor components tested?

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Semiconductor Manufacturing

• How are semiconductor components fabricated?
• How are semiconductor components packaged?
• How are semiconductor components tested?

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Semiconductor Fabrication

• Semiconductor components are fabricated typically
  from one of several different processes
• While suppliers might use various names, the
  processes themselves vary little between
  companies
• Power MOSFET processes
• Bipolar processes
• Combination processes using two or more of the
  above

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Power MOSFET Process

• Power MOSFET processes are for discrete power
  transistors and integrated logic/power devices
• Power MOSFET transistors are intended for high
  current and/or high voltage operation. They have
  a unique construction which allows them to
  operate under extreme conditions.

Gate
Source
Source
n
n
p
n epi
n substrate
Drain
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Bipolar Process

• Bipolar processes are for discrete bipolar
  transistors, high-performance analog functions,
  and very high speed devices
• Bipolar processes traditionally allow for more
  precise analog design and high speed operation
  (consuming more power)

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Combination Process

• Often, different processes are combined to
  provide a higher level of system integration on a
  single chip
• Bipolar CMOS BiCMOS
• Bipolar CMOS Power MOS Smart Power or
  "BCD"

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Combination Process

• Often, different processes are combined to
  provide a higher level of system integration on a
  single chip
• CMOS PowerMOS Vertical MOS

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Semiconductor Fabrication
p epi
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Semiconductor Manufacturing

• How are semiconductor components fabricated?
• How are semiconductor components packaged?
• How are semiconductor components tested?

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Basic Semiconductor Package
Leadframe
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Basic Semiconductor Package
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Basic Semiconductor Package
Wire
Solder Ball
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Basic Semiconductor Package
Body Epoxy
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Semiconductor Packaging

• Semiconductor packages can be classified into two
  groups
• Industry standard packages
• Widely used by multiple suppliers
• Often proven (old) technology
• Proprietary packages
• Package may be used by one or only a few
  suppliers
• Often a new technology which has not yet been
  embraced by the semiconductor industry

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Semiconductor Packaging

• Next, packages can be classified into power and
  small signal packages
• Power packages
• Designed to extract the maximum amount of heat
  from the die
• Wide variation in design styles
• Typically have low pin counts
• Small signal packages
• Designed for minimum cost and foot-print size
• Little variation in design styles
• Typically have high pin count options

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Power Packages
Rthjc 26C/W
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Small Signal Packages
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Semiconductor Manufacturing

• How are semiconductor components fabricated?
• How are semiconductor components packaged?
• How are semiconductor components tested?

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Testing Development

• As the semiconductor is being designed, a
  thorough test algorithm is being developed to
  verify the device meets all functional and
  parametric requirements
• When the first components are manufactured, they
  are submitted for analysis with the new test
  algorithm to determine if the component needs to
  be improved before production begins

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Production Testing

• When a component is released to production, the
  test algorithm is reviewed
• Some tests may be eliminated and/or modified for
  production purposes if the supplier can verify
  the devices functionality through other tests and
  guard-banding
• Prototype Tests for Rdson Maximum (?)
• IDS 1A, Vsupply 12V, Tj 25C 0.10
• IDS 1A, Vsupply 12V, Tj 125C 0.17
• IDS 4A, Vsupply 18V, Tj 25C 0.08
• IDS 4A, Vsupply 18V, Tj 125C 0.14
• Production Tests for Rdson Maximum (?)
• IDS 4A, Vsupply 12V, Tj 25C 0.10

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Why Are Some Tests Eliminated for Production
Devices?

• The test itself may be destructive
• The test may be a subset of other tests
• The test may require manual intervention
• The test may require additional hardware
• The test may take too long
• Production testers cost millions of dollars and
  require an extremely high level of up-keep
• Suppliers want to minimize the level of testing
  required to ensure a customers high quality
  expectation while shipping an affordable component

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Semiconductor Manufacturing
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Thank you!

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