Title: FAST AND ACCURATE MODELING OF
1FAST AND ACCURATE MODELING OF EMBEDDED PASSIVES
IN MULTI-LAYER PRINTED CIRCUITS USING NEURAL
NETWORK APPROACH Q.J. Zhang, M.C.E. Yagoub,
X. Ding Dept of Electronics, Carleton
University, Ottawa, Canada R. Goulette, R.
Sheffield, and H. Feyzbakhsh Nortel Networks,
Ottawa, Ontario, Canada
2- Dr. Qi-jun Zhang
- Professor
- Department of Electronics,
-
- Carleton University,
- 1125 Colonel By Drive
- Ottawa, ON., K1S 5B6
- Phone 613-520-5778
- Email qjz_at_doe.carleton.ca
3 Acknowledgement This NCMS / AEPT Consortium
work is performed under support of the U.S.
Department of Commerce, National Institute of
Standards and Technology, Advanced Technology
Program, Cooperative Agreement Number
70NANB8H4025.
4Outline
- Introduction
- Neural Network Modeling
- Training of Neural Models
- Neural Models of Passive Devices
- Examples
- Conclusion
5Features
- New approach to modeling of high frequency
effects of embedded passive components in
multilayer printed circuits based on artificial
neural networks. - Training data generated by EM simulators
- Models are trained to learn the S-parameters of
the passives versus physical and geometrical
parameters. - Models are fast and represent the EM based
information of the components. - Models can be used for efficient design of
high-frequency circuits and systems.
6 Multilayer Perceptrons
(MLP) Structure
(Output) layer L
(Hidden) layer l
(Hidden) layer 2
(Input) layer 1
xn
7Input-output Computation of a Neural Network
Model
2
2
1
1
8Neural Net Training
Objective to adjust W such that minimize
(y - d)2 W x
S
9 Training Error dpk is the kth element of
dp where dp represents the measured/simulated
output y for the input xp, TR is the index set
of training data. is the kth
output of the neural network xp is the input
sample w is the weight vector
10Neural Network Computation process xi is
the ith input to the neural network, Nl is the
number of neurons in layer l, is the
output of ith neuron of lth layer,
represents weight of the link between jth neuron
of l-1th layer and ith neuron of lth layer,
is the bias parameter of ith neuron of lth
layer, L is the total number of layers.
is a sigmoid function for the layers and
linear function for the output layer.
11 Training Validation Process
12Embedded Resistor Neural Model
Embedded Resistor
Neural Model Representing EM Behaviors
13Embedded Capacitor Neural Model
Embedded Capacitor
Neural Model Representing EM Behaviors
14General Steps in 3-D EM Data Generation
.OPEN EM SIMULATOR .OPEN PROJECT . EXECUTE THE
FOLLOWING STEPS
- . DRAW the Structure
- . ASSIGN Materials for 3-D Objects
- . ASSIGN Boundaries for 2-D Objects
- . SELECT Frequency Range, Accuracy...
- .SOLVE
- .POST PROCESSOR Edit and Save Solution
.CLOSE EM SIMULATOR
15EM-Based Neural Network Training Process
16EXAMPLES OF NEURAL MODELS OF EMBEDDED
RESISTORS
17EM-Based Neural Network Training Process
EM Simulators (Sonnet Lite Ansoft-HFSS)
S-Parameters (Training Data)
EM Based Neural Models
NeuroModeler
18Embedded Resistor ( L W )
Length 8 mils Width 8 mils Resistivity 100
W /square
R
W
er
L
19Comparison of S-parameters of the Embedded
Resistor for L W
Original EM data () EM based neural model
(__)
20Embedded Resistor ( L 4W )
R
W
er
L
Length 32 mils Width 8 mils Resistivity 100
W /square
21Comparison of S-parameters of the Embedded
Resistor for L 4 W
Original EM data () EM based neural model
(__)
22Embedded Resistor ( W 4L )
Length 8 mils Width 32 mils Resistivity 100
W/square
R
er
W
L
23Comparison of S-parameters of the Embedded
Resistor for W 4L
Original EM data () EM based neural model
(__)
24Conclusion
- A neural network approach for modeling embedded
passives in multilayer printed circuits have been
presented. - The models can be obtained by learning the data
from electromagnetic simulators. - The technique takes into account the 3-D EM
effects in embedded passives during modeling and
simulation of high-frequency circuits and
systems. - It helps making the design of multilayer printed
circuits more accurate and efficient,
contributing to overall reductions in design
cycles.