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Digital Testing: BoundaryScan Design

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Traditionally: use of bed or nails. Expensive. Fragile ... To test connectivity between the ICs on the board. Europe 1985: Joint Test Action Group ... – PowerPoint PPT presentation

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Title: Digital Testing: BoundaryScan Design


1
Digital Testing Boundary-Scan Design
  • Samiha Mourad
  • Santa Clara University

2
Objectives of The Chapter
  • Traditional Board Testing
  • Problems in testing PCB
  • The origin of B-Scan
  • Boundary-Scan architecture
  • How does it work
  • Modes of Operations
  • External and internal testing
  • TAP Controller registers Instruction set
  • BSDL

3
PCB Testing
  • Traditionally use of bed or nails
  • Expensive
  • Fragile
  • Increase gate/pin ratio limit accessibility
  • Fine trace between pins
  • See trends in next slide

4
Trend in IC Growth
Hand held ICs pin count
Trace Distance
m
1000
m
PCB
100
m
m
m
10
m
ICs
m
1
m
70 80 90
Year
5
Why is Boundary-Scan?
  • Originally 1985
  • DFT technique for board testing
  • To test connectivity between the ICs on the board
  • Europe 1985 Joint Test Action Group
  • USA 1990 IEEE 1149.1 Standard
  • Very widely used at present

6
Boundary Scan Architecture
  • A test access port (TAP) and 4 to 5 extra pins
  • Test Data Input (TDI)
  • Test Data Output (TDO)
  • Test Clock TCK
  • Test Mode Select (TMS)
  • Group of registers
  • Instruction reg (IR)
  • Data reg (DR) Bypass, Boundary-Scan Reg, ID Reg
  • TAP Controller

7
What is Boundary-Scan?
  • This DFT technique developed originally for PCB
  • Each I/O of the ICs on the board are registered
    through a special Boundary-Scan flip-flops scan
    cell (BSC) is attached to all PI/PO of the chips
    on the board
  • The results of the test are scanned out by
    connecting all the BSCs (boundary-scan register,
    BSR) in one daisy chain
  • A test access port (TAP)
  • Four extra pins
  • 16-state FSM Boundary-scan controller to manage
    the test data
  • Follows standard IEEE 1149.1
  • This DFT technique is independent of the scan
    design

8
Traditional Board Testing
9
Boundary-scan Architecture
10
Test Access Port Registers
Data Registers
(DR)
MUX 1
MUX 2
11
Boundary-Scan Cell
  • Used at the input or output pins

12
Bypass Register
  • Used to bypass the corresponding chip
  • The flow of the test data is as indicated by the
    heavy lines in the figure to the right
  • A one flip-flop register
  • Received the data from TDI and at the Capture DR
    state

13
Instruction Register
  • All the IRs of the IC are connected in a chain
  • The appropriate instructions are shifted in
    serially
  • The individual instructions are captured in
    parallel

14
Instruction Register
15
TAP Controller
  • Responds to TMS signals at the positive edge of
    TCK
  • Controls the data and the instructions
  • Resets after five consecutive TMS

16
The Instruction Set
  • Three mandatory instructions
  • BYPASS, EXTEST AND SAMPLE/PRELOAD
  • Optional instructions
  • IDCODE, INTEST, RUNBIST, CLAMP, HIGHZ
  • Public and private instructions
  • Private instructions need not be documented
  • The instructions loaded through the chip TDI
  • shifted in IR during Shift-IR state

17
Instruction Scan
18
Data Scan
19
Modes of Operation
  • Normal Tap controller idle in Test-logic-Reset
  • select of MUXes of BSCells held low
  • External Testing (EXTEST)
  • Shift DR, (TDI) Update DR (latch at output)
  • Capture DR(at the output), Shift DR (through TDO)
  • Testing internal logic (INTEST)
  • Shift DR, (in data) Update DR (apply to internal
    logic)
  • Capture DR(at the output), Shift DR (through TDO)
  • Test the BSCAN Register

20
External Testing
  • The input BSC represents all such cells for the
    circuit
  • The output BSC is also a representative of all
  • The test signal is applied at the input and
    latched at the hashed flip-flops
  • The output signal is should now e visible at the
    input of another cell

(c)
21
External Testing
  • The output form the first cell will appear on the
    input of another cell (logic 2)
  • Then the results are scanned out through the
    boundary scan chain

22
Testing Internal Logic
  • Use of an optional instruction, INTEST
  • The test is applied through TDI
  • Then shifter out as in the case of EXTEST

23
Capture the Stimulus
  • Shift-DR shift stimuli through TDI
  • Stimuli intended for the internal logic
  • Update-DR apply the stimuli to the internal logic

24
Capture Response Data
  • Capture-DR capture the respond at the output
    pins of the IC
  • Shift-DR Shift out the results through the BSR
    toward TDO

25
Boundary-Scan Language (BSDL)
  • Initiated by Hewlett Packard in 1990
  • Based on VHDL

26
Cost of Boundary-Scan Design
  • Extra hardware, cells, pins
  • Delays
  • Lack of software tools
  • Standard is not fixed
  • lack of compatibility
  • Increase design time
  • Advantages
  • the silicon cost is lower
  • available automatic tools
  • the DFT is appropriate for concurrent engineering
  • the DFT is used in debugging in addition to
    testing
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