Battery Cover

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20038 BATTERY COVER
David Deng
2005/05/29
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Contents

1. Plastic Material Introduction --------------------
   ------------------------------------------- 3
2. Product Model Introduction------------------------
   ---------------------------------- 4
3. Cooling System Design -----------------------
   ---------------------------------------- 5
4. Feed System Design ------------------------
   ----------------------------------------6
5. Analysis Indication --------------------------
   -------------------------7
6. Processing Conditions -------------------------
   --------------------------------8
7. Analysis Results ---------------------------
   ----------------- 927
8. Conclusions Suggestions -----------------------
   --------------------------------------- 28

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Material introduction
PP POLYPROPYLENES CM1171 Taiwan PP
VI(245)84 OCT-08-2002 JUL93
1. Conductivity 0.170000 W/m/
deg.C 8. Ejection
temperature 93.000000 deg.C 2.
Specific heat 3100.000000 J/kg/
deg.C 9. Min. melt temperature
200.000000 deg.C 3. Melt density
774.7500000 kg/cu.m
10. Max. melt temperature 280.000000
deg.C 4. Max. shear stress 0.260000 MPa
11. Min. mold
temperature 20.000000 deg.C 5.Max. shear
rate 24000.000000 1/s
12. Max. mold temperature 80.000000
deg.C


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Product model introduction
Thickness distribution is not even. Min. wall
thickness is about 0.64mm, Max. wall thickness is
about 5.00mm. As shown below the plot, the blue
is the thinner region, and the red is the
thicker region(include injection and cooling
system).
210
51
87
Max. contour dimension(mm)
Thickness distribution
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Cooling System Design
Cooing network
Ø10
Cooling system have 20 circuits. Core have 12
circuits and cavity have 8 circuits.
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Feed System Design
Gate location
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Ø 5
Gate
Ø 8
Ø 4.15
16
2.2
124
2
The mold is cold feed system, two cavities, one
banana gate. The dimension of the gate is shown
in top plot.
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Analysis Indication

• Moldflow CAE analysis includes Flow,Cooling and
  Warp results,aimed to optimize the feed system,
  the cooling system of the mold.

8
Processing Conditions
Packing profile
Filling Conditions
MPa
Mold temperature 50.00 deg.C Melt
temperature 230.00 deg.C Injection time ?
3.8 sec Total Volume (cavity) 170.00
cu.cm Part Volume 165.00
cu.cm Sprue/runner/gate volume 5.00 cu.cm Total
Weight 137.4 g Runner Weight? 3. 5
g Circuit Inlet Temp 25.0 deg.C
30
10
s
Pressure MPa Time sec 30
0.0 30
10.0
Cooling Conditions
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Gate Analysis Results\
Best Gate Location
The best gate location lie in the marked region.
It is difficult to design mold, so cant be
accepted in fact.
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Flow Analysis Results\
Fill Time
Fill time is about 3.8sec, and the filling
pattern is satisfied. The marked region is filled
last.The below plot is the scene of filling
99(V/P switch over).
Click for animation
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Flow Analysis Results\
Fill Time
Fill time is about 3.8sec, and the filling
pattern is satisfied. The marked region is filled
last.The below plot is the scene of filling
99(V/P switch over).
Click for animation
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Flow Analysis Results\
Injection Pressure
Max. injection pressure is 33 Mpa (V/P switch
over).
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Flow Analysis Results\
Injection Pressure
The pressure drop in runner system is about
24MPa, which is 72.7 of injection pressure. The
below plot is the pressure distribution of
filling 99(V/P switch over).
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Flow Analysis Results\
Flow Front Temperature
Gate
The flow front temperature is from 221 to 230.6
deg.C, and the distribution is not very uniform.
The minimum temperature is shown in the marked
region.Pay attention to the weldlines in this
area.
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Flow Analysis Results\
Weld Lines
Main weld lines are shown as red lines.
Pay more attention to the weldlines in this area.
Gate
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Flow Analysis Results\
Air Traps
Air traps locations are shown by small pink
balls. Most of them lie in the last filling or
the interface area, so can be vented easily.
Gate
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Flow Analysis Results\
Sink Index
Pay attention to the Sink Mark in marked region.
Gate
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Flow Analysis Results\
Clamp Force
Clamp Force Centroid locates in the center of
mold.
Clamp Force(Max.61.3Ton)
Variation curve of pressureclamp force in cycle
time shown by above figure.
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Cool Analysis Results\
Coolant Temp
Coolant temp difference is very small,so the
number of circuits is enough.
Temp difference(Max.0.23 deg.C)
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Cool Analysis Results\
Temp (part)
The distribution of temp is not very
uniform. Pay more attention for the cooling in
marked region.
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Cool Analysis Results\
Temp (part)
Pay more attention for the cooling in marked
region.
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Cool Analysis Results\
Frozen Time(part)
Click for animation.
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Cool Analysis Results\
Frozen Time(part)
The frozen time is non-uniform. The frozen time
of most area is about 23 S, 6.1S in gate area.
Pay more attention for the cooling in marked
region.
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Cool Analysis Results\
Frozen Time(gate)
The frozen time of gate is about 6.45S,less than
the frozen time of most area in the part,which
will do harm to packing. Design larger gate.
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X Deflection
Warp Analysis Results
The X direction belongs to natural shrinkage
basically.
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Y Deflection
Warp Analysis Results
Deflection in Y direction is shown in the left
plot, belongs to natural shrinkage basically.
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Z Deflection
Warp Analysis Results
Deflection in Z direction is uniform.
0.58
0.41
0.42
Gate
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ConclusionsSuggestions

• From the above analysis
• Some weld lines maybe affect the strength of
  molding part, and air traps are vented easily.
• The packing effect is the main cause of sink
  mark,deflection. Deflection is very
  uniform,improve packing will get small
  deflection.
• The distribution of temp is not very uniform.
• Suggestions
• To use baffle,bubbler and inserts to improve
  cooling effect.
• To design larger gate.