Fig' 1

1
CHAPTER 5
2
Master Figure
3
Fig. 5.1
LIMITED COMPONENT INTEGRATION
DISCRETE
FULL INTEGRATION
Smart Personal Assistant
Smart Miniaturized Bio Implant
(Courtesy Chosun)
Fully Embedded FUTURE
Cell Phone NEAR FUTURE
Cell Phone TODAY
4
Fig. 5.2

Nanoscale

Nanoscale

Nano-scale


10
10
-
-
20
20

10-20 System
IC
IC
IC
Package
Package
Package
System
Connectors

80
-
90
Connectors

80-90 System
Connectors
System

Milli
-
scale

Milli-scale
Board
Board
Board
Discrete
Discrete
Discrete

Low functional density

Low functional density

Low functional density

Bulky

Bulky

Bulky


Costly
Costly

Costly


Low reliability
Low reliability

Low reliability
5
Fig. 5.3
Active
LNA
Passive
PA
Switch
Simple RF Maybe SoC
CMOS
RF-CMOS or SiGe
RF Front End
No Moores Law
Moores Law Works
6
Fig. 5.4
7
Fig. 5.5
MEMS
BAW
GaAs
RFCMOS
FUTURE
(10X reduction in X, Y and Z)
1000 components/cm2
5 micron lithography
CURRENT
100 components/cm2
50 micron Lithography
PAST
Ceramic thick film
200 microns Lithography
8
Fig. 5.6
Antennas RFIDs
Modeling Simulation
Passive Components

• Capacitors
• Resistors

• Inductors

• Substrate Technologies

Miniaturized Multifunction RF Systems

• Ceramic
• Glass

• Organic
• Silicon

Passive Circuits

• Filters
• Duplexers
• Baluns

• Couplers
• Combiners
• Dividers

Reliability
Switches Passive/ Active
9
Figs. 5.7 a, b
(a)
(b)
10
Figs. 5.8 a, b, c
11
Fig. 5.9
12
Fig. 5.10
13
Fig. 5.11
14
Figs. 5.12 a, b
Folded flexible LCP layer
Thru holes
Shielding metal case
Signal line on M1
(a)
(b)
15
Figs. 5.13 a, b
(a)
(b)
16
Figs. 5.14 a, b
(a)
(b)
17
Figs. 5.15 a, b
(a)
(b)
18
Fig. 5.16
19
Fig. 5.17
20
Fig. 5.18
21
Fig. 5.19
22
Fig. 5.20
Dielectric
23
Fig. 5.21
via
h
d
Ground plane
24
Fig. 5.22
25
Fig. 5.23
26
Fig. 5.24
27
Figs. 5.25 a, b
(a)
(b)
28
Fig. 5.26
29
Figs. 5.27 a, b, c
(a)
(b)
(c)
30
Figs. 5.28 a, b
31
Fig. 5.29
32
Fig. 5.30
Insertion loss
Return loss
33
Fig. 5.31
34
Fig. 5.32
35
Figs. 5.33 a, b, c
(a)
(b)
(c)
36
Figs. 5.34 a, b, c
(a) (b) (c)
37
Fig. 5.35
0
-5
-10
-15
S21
S11
Magnitude (dB)
-20
-25
-30
-35
-40
12 13 14 15 16
17 18
Frequency (GHz)
38
Figs. 5.36 a, b
(a)
(b)
39
Figs. 5.37 a, b
(a)
(b)
40
Fig. 5.38
41
Figs. 5.39 a, b
(a)
(b)
42
Fig. 5.40
43
Figs. 5.41 a, b
44
Fig. 5.42
45
Figs. 5.43 a, b
(a)
(b)
46
Figs. 5.44 a, b, c
(b)
(c)
(a)
47
Figs. 5.45 a, b
(a)
(b)