environmental aspects

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Halogen free material- Technical necessity
or marketing campaign
Dr. M. Cygon Isola AG October 2000
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Main components of base materials
Copper foil
Glass fabric
Thermosets
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Brominated epoxy resin
Br
CH3
Br

2
-C-
-OH
HO-
CH3
Br
Br
DGEBA
TBBA
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Hazardous substances (EACEM list)
Antimony and its compounds Arsenic and its
compounds Beryllium and its compounds Cadmium and
its compounds Chromium(VI) and its
compounds Cobalt and its compounds Lead and its
compounds Mercury and its compounds Metal
carbonyl Organic tin compounds Selenium and its
compounds Tellurium and its compounds Thallium
and its compounds Asbestos Cyanide Benzene Phenol
(monomer) Toluene Xylene Polycyclical aromatic
hydrocarbons
CFCs and halons (substances that destroy the
ozone layer) Acrylonitrile (monomer) DMA
(N,N)-dimethyl acetamide NMA (N)-methylacetamide D
MF (N,N)-dimethyl formamide NMF (N)-methyl
formamide Diethylamine Nitrosamide Nitrosamine Eth
ylene glycol ether and acetale Phthalates
(all) Formaldehyde (monomer) Hydrazine Picric
acid Halogenated aromatic hydrocarbons (general
prohibition)
PBD, polybrominated diphenyls PBDE,
polybrominated diphenyl ether PCD,
polychlorinated diphenyls PCT, polychlorinated tri
phenyls Pentachlorophenol Dioxins Dibenzofurans H
alogenated aliphatic hydrocarbons Epichlorhydrin
(monomer) Vinyl chloride (monomer) PVC and PVC
mixtures
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PCDD- and PCDF-Kongenere with 2,3,7,8-Chlorine
substitution pattern
Chlorine
Seveso-Toxin
Oxygene
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Waste treatment
- Recycling not possible due to glass
reinforcement and thermoset epoxy - Copper
recycling possible - Thermo-treatment possible,
if proper flame retarder - Waste uncritical
for repository, after copper removal
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Environmental aspects on base material cannot be
converted to PCBs!
Solder metal Resist Devices Service print Ni/Au
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Do we really need flame retarded laminates for
all applications?
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Base materials without flame retarders
Grade G-10 G-11 PD BT CE Gigaver
UL-Rating HB HB V-1 V-1 V-1 V-1
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Which compounds can be used to obtain a flame
retardent effect ?
nitrogen compounds phoshorous compounds halogen
compounds (chlorine, bromine) hydrates (Al(OH)3
xH2O, Mg(OH)2 xH2O)
Additives
Reactive components
melamines phosphates polybrominated
biphenyls) polybrominated diphenyl
ethers) brominated phthalimides hydrates ) can
form dioxins and dibenzofurans
tetrabromobisphenol A EP-phosphoric acid
esters multifunctional amino-compounds
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Mechanism of Flame Retarders
HALOGENES
R-H X
R HX
H2O X
HX OH
X HALOGENES
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Mechanism of Flame Retarders
PHOSPHOROUS COMPOUNDS
DEHYDRATION
-CH2-CH2-
H3PO4 C

-H2O
ORGANIC COMPOUND
CARBON
PHOSPHOROUS ACID
GLASS-LIKE POLYPHOSPHOROUS ACID
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Mechanism of Flame Retarders
HYDRATES
280oC
Al2O3 x3 H2O
2 Al(OH)3 xH2O
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Halogen free base material
SC - VO 351 (FR-2)
IN
OUT
BROMINATED ADDITIVE
PHOSPHOROUS/NITROGENE ADDITIVE
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Halogen free base material
IN
OUT
REACTIVE BROMINATED EPOXY RESIN
REACTIVE PHOSPHOROUS MODIFIED EPOXY RESIN
NITROGENE HARDENER
DICY HARDENER
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Halogen free base material
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FE
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Outlook
a) markets

- halogen free PCBs are interesting for the
auto- motive industry due to the motor vehicle
regulation
- electronic for telecommunication will use
halogen free PCBs for marketing reasons
- with TBBA flame protected PCBs will be use
furthermore in quantities
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Outlook
b) materials
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