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Towards the limits of conventionnal MOSFETs

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RTP spike anneal 1050 C. Gate length down to 16nm. ULIS 2003 Udine 20-21/03/03. Limits : ... ultra steep halo profile (improved annealing process, B or In halo ... – PowerPoint PPT presentation

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Title: Towards the limits of conventionnal MOSFETs


1
Towards the limits ofconventionnal MOSFETs
G. BERTRAND1, S. DELEONIBUS1, B PREVITALI1,G.
GUEGAN1, X. JEHL2, M. SANQUER2, F. BALESTRA3
2
OUTLINE
  • CMOS challenges
  • Device fabrication
  • Limits in terms of
  • Short Channel effects
  • Performances
  • Transport
  • Charge from CMOS to SET-MOS
  • Conclusion

3
CMOS challenges
Possibilities of Conventional MOSFET?
4
Device fabrication
  • Conventional MOSFET architecture- 1.2nm SiO2
    gate oxide
  • - In situ doped polysilicon Gate
  • - Channel non intentionnaly adjusted
  • but Super Halo SH (only BF2 halos)
  • or Non super Halo NSH (B II BF2 halos)
  • - As extensions
  • - 30nm nitride spacers
  • - As HDD Source and drain
  • - RTP spike anneal 1050C
  • Gate length down to
    16nm

5
Limits short channel effects (SCE)
Electrical characteristics
V
1.5V
-3
10
d
V
50mV
d
-5
10
Lot 6893 P18B
  • Field Effect transistor down to Lg16nm

Channel B 5keV
(A)
14
-2
LDD 1.5 10
cm
-7
10
D
I
13
-2
Halo 3.10
cm
tilt 22
L
29nm
g
-9
10
L
16nm
g
-11
10
-0,5
0
0,5
1
1,5
W10µm
V
(V)
G
6
Limits short channel effects (2)
  • Below 40nm, SCE not efficiently controlled
    whatever transistor architecture
  • spacer length (30 to 40nm)
  • halo dose (1-4.1013cm-2)
  • LDD dose (0.8-2.1014cm-2)

Large punchtrough current below 40nm
Need for - Thinner gate oxide -
Improvement of halo efficiency
7
Limits SCE (3) Halos efficiency
Large B diffusion (TEDF)
Halos BF2 15-25keV
8
Limits Ion/Ioff
High Rsd Low IonOptimum SCE Ioff control
Medium Rsd High IoffOptimum Ion
  • Despite large Rsd (1200 ?.µm), Ion up to 900
    µA/µm
  • Optimum Rsd / SCE trade-off hard to perform
    with such conventionnal architecture and
    technique

9
Limits transport (1)
  • No velocity overshoot
  • Quasi ballistic transport r with T
    but r0.5-0.6 whatever Lg lt 100nm

10
Limits transport (2)
  • Impact at room temperature

Low field mobility degradation due to halo
overlapmostly in the case of efficient SCE
control
11
Limits from CMOS to SET-MOS (1)
  • Lg CMOS SET

12
Limits from CMOS to SET-MOS (2)
gt 50 oscillations _at_1.7K (0.5 to 1.4V)
- Periodicity Related to Channel Geometry
// F. Buf et al results IEDM 2001on non
overlap Gate/Extension structure
Importance of Rsd in Coulomboscillation
observation
13
Limits from CMOS to SET-MOS (3)
  • Observable oscillations from 20K up to 75K
  • à minimal gate length
  • à high charging energy
  • Aperiodic oscillations
  • Large W (10µm)
  • Enable SET- MOS
  • operating temperature
  • closer to room temperature if W is
    reduced

14
Conclusions
  • Realization of conventional ultimate nMOSFET
  • à functional devices physical gate length
    down to 16nm
  • à electrical characteristics with good
    performance
  • Limits With conventional As extension BF2
    halos architecture - difficult to control
    SCE below 40nm - limits low field mobility
    and non stationary transport
  • Bulk à Need for thinner gate oxide (SCE
    control) à Need for ultra steep halo
    profile (improved annealing process, B or In
    halo dopant instead of BF2, epitaxial SiCx
    diffusion barrierVLSI 02)
  • Alternatives low doped FDSOI, DGMOS.
  • From CMOS to SET-MOS
  • - Conventional MOSFET could operate as SET at
    temperature below 4.2K
  • - Promising results have been shown for 77K SET
    operation
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