Polyset Company

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Polyset Company

• Microelectronic Applications The Genius is in
  the materials

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Key Features (uncured)

• Viscosity _at_ 25ºC 20,000 cps ? semisolid
• Color - clear, water white
• Long shelf life _at_ 25ºC (catalyzed or uncatalyzed)
• Soluble in alcohols, ketones, acetates, aromatics
  or aliphatics
• Can be cured by heat or light (UV,E.B.,laser)
• High rate of polymerization (heat or light)

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Key Features (uncured)

• Can be dual cured (heat and light)
• Percentage of conversion - very high
• Rate of conversion - very high
• Low temperature cure is possible 120ºC
• Snap cure possible 15 sec _at_ 175ºC
• Typical thermal cure cycle
• (1-2 hrs. _at_ 150-165ºC)
• Photodefineable versions available (250 365 nm)

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Key Features (cured)

• No Tg, slowly degrades at T gt 400ºC
• Excellent thermal stability, up to 350ºC
• Can be exposed processed _at_ 400ºC for short time
  period
• CTE is very stable to 300ºC, 55 5 ppm. (
  0-300ºC)
• Storage modulus is flat to 300ºC, 2.5 0.02 GPa
  (0-300ºC)
• Minimal change in mechanical, electrical and
  optical properties at or after exposure to high
  temp. (300ºC).
• Very low moisture absorption at room or higher
  temp
• (.001-1)
• Excellent chemical solvent resistance

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Key Features (Electrical/Mechanical)

• Very low, stable dielectric (k 2.45)
• Very low leakage, lt 10-8 A/cm2_at_ 2 MV/cm
• C-V/TVS plots imply no serious Cu ion drift rate
• Hardness and Modulus compare favorably to other
  materials
• Low thermal stress for on wafer/thin-film
  applications
• Low cure shrinkage
• lt 0.2
• Very good adhesion to Cu, Al, SiO2 and other
  substrates

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Summary A multitude of applications

• Polyset materials are ideal for integration to
  dual damascene interconnect scheme in a variety
  of applications, including, but not exclusively
• Low-k dielectric
• Diffusion barrier layers
• Etch Stop/Hard Mask
• CMP Stop
• Adhesion promoters