MOCVD of Alternative Materials

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MOCVD of Alternative Materials

• Smuruthi Kamepalli
• Jeff Fournier
• April 2009

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Introduction

• Primarily our effort focuses on Chemical vapor
  deposition of thin films of new materials which
  are conformal in nature and provide the ability
  to fill small pores.
• Conformal thin films can be utilized in more
  flexible and competitive device structures.
• MOCVD
• Plasma-enhanced MOCVD
• ALD
• Plasma-assisted ALD

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In house capabilities

• Thin film growth - Single wafer multiple chamber
  CVD System
• State of the art tool capable of accommodating up
  to 8 wafers and incorporates a great deal of
  flexibility to deposit a wide range of materials.
  
• MOCVD chamber
• Chamber utilized for the deposition of barrier
  layers, contacts, and other thin films.
• Stainless steel Process chamber with water-cooled
  chamber walls
• Showerhead assembly with temperature controlled
  fluid channel with 3 radial reactant injection
  zones
• High-speed susceptor rotation
• Susceptor capable of temperatures up to 800C

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CVD Cluster Tool
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Cluster tool with three process chambers
MOCVD chamber PECVD chamber Sputter
etch chamber
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• PECVD chamber
• Chamber utilized for deposition or pre/post
  plasma treatment of films.
• Water cooled showerhead assembly and heated
  chamber walls.
• Organometallic precursor sources and delivery
  system
• System contains dual MO source delivery systems
  to accommodate a total of six MO source
  containers-3-bubbler input and 3 liquid MO
  sources through direct inject. Showerhead
  assembly with temperature controlled fluid
  channel with 3 radial reactant injection zones
• Non-rate limited ALD type pulsed-deposition
  capability

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Precursor Chemistry

• Organometallic Precursors
• Compounds, which possess direct bonds between
  metal and carbon.
• The chemistry lab is equipped to perform
  synthesis and characterization of metal-organic
  precursors.

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Requirements For Precursor

• High vapor pressure
• Stable (low contamination)
• Low decomposition temperature for thermal
  pyrolysis
• Low thermal stability of precursor
• Compatibility with other precursors used in
  deposition
• Stable for storage
• Easy to synthesize