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Plasma CVD Carbon Nanotubes CNTs

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Carbon nanotubes are one of the most fascinating material in recent ... All other SWNT are chiral, chiral angle. q = sin-1 [m(3)1/2/ 2(n2 nm m2)1/2] 8/25/09 ... – PowerPoint PPT presentation

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Title: Plasma CVD Carbon Nanotubes CNTs


1
Plasma CVD Carbon Nanotubes (CNTs)
  • Michael .A. Awaah
  • Elec 7730 Advanced Plasma Processing for
    Microelectronic Fabrication
  • Instructor Dr. Y. TZENG
  • Fall 2003

2
Outline
  • CNTs
  • CNTs Properties
  • Mechanical Properties
  • Electrical Properties
  • Growth of CNTs
  • Application

3
Questions
  • Why are carbon nanotubes so strong
  • What re the current limitation in CNT VLSI
    fabrication

4
Carbon Nanotubes (CNTs)
  • Carbon nanotubes are one of the most fascinating
    material in recent years, since they show
    exceptional electronic and mechanical properties
    that have triggered an ever stronger effort
    towards application.
  • The possibilities are promising and range from
    nanotube composite materials, nanoelectronics,
    scanning microscope probes, chemical and /or
    biological sensors, to cold electron sources.

5
CNTs
  • Nanotubes have a unique property in that their
    electronic behavior (semiconducting or metallic)
    is determined by their structure, which also
    determines to a great extent the overall
    properties of devices as wide ranging as field
    effect transistors, flat panel displays, or
    chemical sensor
  • This implies a precise of nanotube diameter and
    chirality for molecular electronics.

6
Helicity and sp2 bonding
7
Single-walled nanotubes (SWNT)
8
Types of SWNT
9
Types of SWNT
  • Cna1 ma2
  • m is zero for all zigzag SWNT
  • mn for all armchair nanotubes
  • All other SWNT are chiral, chiral angle
  • q sin-1 m(3)1/2/ 2(n2 nm m2)1/2

10
CNTs Properties
  • Electrical properties depends on geometry of
    nanotube
  • Roughly 2/3 are semiconductors and 1/3 are
    metallic in random growth
  • Tremendous current carrying capability
  • 1 billion Amps/cm2
  • Excellent heat conductor
  • twice as good as diamond

11
CNTs Properties
  • High strength
  • much higher than high-strength steel
  • Youngs Modulus 1 Pa (DWNT) and 1.25 TPa (MWNT)
    ( Steel 230 Gpa)
  • High Aspect Ratio 1000 10,000
  • Density 1.3 1.4 g/cm3
  • Maximum Tensile Strength 30 Gpa
  • Thermal Conductivity 2000 W/m.K ( Cu has 400
    W/m.K)

12
Thermal Property of CNT
13
Nanotube Conductance
  • Semiconducting when (m, n) indices
  • m n ? 3 integer
  • The rest are metallic
  • Carbon Nanotubes are intrinsically p-type
    semiconductors.

14
CNT Conductance Variation
15
Quantum Effect
  • Conductance appears to be ballistic over micron
    scales, even at room temp.
  • Ballistic, no dissipation , very high current
    densities are possible
  • Frank et al., Science 280, 1744(1998)

16
Electron Field Emission From CNTs
  • Low turn-on electric field and threshold electric
    field
  • High field enhancement factor
  • High current density
  • High current stability, low degradation rate

17
Synthesis of carbon nanotubes
  • There are three commonly means by which carbon
    nanotubes are synthesize
  • Laser ablation
  • Arc-discharge method
  • Chemical vapor deposition (CVD)

18
Arc-discharge method
19
Laser ablation
20
CVD
  • CVD synthesis is achieved by taking a carbon
    species in the gas phase and using an energy
    source , such as plasma or a relatively heated
    coil, to import energy to a gaseous carbon
    molecule
  • The energy source is used to crack the molecule
    into a reactive radical species
  • Carbon nanotubes are formed if proper parameters
    are maintained

21
Plasma CVD
  • Plasma CVD has an advantage of low temperature
    synthesis over thermal CVD
  • Carbon nanotubes can be synthesized on soda lime
    glass.
  • The power supplies for discharge of plasma are
    DC and High Frequency
  • RF(13.56 MHz) and Microwave (2.47 GHz) are
    typical of high frequency applied are both
    electrodes.

22
Plasma CVD apparatus
23
Plasma CVD Nanotubes
  • Carbon nanotubes are grown on the metal particles
    by glow discharge generated from high frequency
    power
  • Reaction is supplied to the chamber during the
    discharge
  • A substrate is placed on the grounded electrode

24
Plasma CVD Nanotubes
  • The reaction gas is supplied from the opposite
    plate
  • C2H2, CH4, C2H4, C2H4,, CO gases are used for
    synthesis carbon nanotubes
  • Catalytic metal, such as Fe, Ni, and Co are used
    on a Si, SiO2 , or glass substrate using thermal
    CVD or sputtering

25
SEM, TEM, AFM, STM
26
EELS Images of CNTs
27
Space elevator
28
CNTFET transistor
29
TUBFET
30
Intramolecular CNTFET Inverter
31
TUBFET
32
Nanotube single electron transistor
33
Conclusion
  • Carbon nanotubes
  • exceptional potential to replace Silicon based
    semiconductor
  • Tremendous current carrying capability
  • 1 billion Amps/cm2
  • Excellent heat conductor
  • twice as good as diamond
  • High strength
  • much higher than high-strength steel

34
Conclusion Ctd
  • Potential 50A gate length , THz switching speed
  • The possibilities of CNT are promising and range
    from nanotube composite materials,
    nanoelectronics, scanning microscope probes,
    chemical and /or biological sensors, to cold
    electron sources.

35
Questions
  • Strong SP2 bond
  • CNT VLSI drawbacks
  • Large scale replacement, parallel fabrication
    techniques
  • Lithography require for source, gate, drain etc

36
Reference
  • 1 P. J Harris, Carbon Nanotubes and Related
    Structures, Cambridge Press, (Cambridge,
  • London, 1999)
  • 2 M. S. Dresselhaus, G. Dresselhaus, and P. C.
    Ecklund, Science of Fullerenes and
  • Carbon Nanotubes, AP, (New York, 1996)
  • 3 H. O Pierson, Handbook of Chemical Vapor
    Deposition, Noyes, (Norwich, 1999)
  • 4 M. Yudasaka, R. Kikuchi,T.Matsui, Y Ohki, S
    Yoshimura, and E. Ota, Appl. Phys. Lett.

37
Reference
  • 67, 17 (1995).
  • 5 Z. F. Ren, Z. P. Huang, D. Z. Wang, J. G. Wen,
    J. W. Xu, J. H. Wang et al., Appl. Phys.
  • Lett. 75, 8 (1999).
  • 6 M. Yukasaka, R. Kikuchi, Y. Ohki, E. Ota, and
    S. Yoshimura, Appl. Phys. Lett 70, 14
  • (1997).
  • 7 C. J. Lee, D. W. Kim, T. J. Lee et al., Appl.
    Phys. Lett 75, 12 (1999).
  • 8 S. B. Sinott, R. Andrews, D. Quian et al.,
    Chem. Phys. Lett. 315, (1999).)

38
Reference
  • 9 Z. F. Ren, Z. P. Huang, J. W. Xu, J. H. Wang et
    al., Science. 282, 1105 (1998).
  • 10 T. Reuckes, K. Kim, E. Joselevich et al.,
    Science 289, 94 (2000).
  • 11Y. C. Choi, Y. M. Shin, B. S. Lee, et al.,
    Appl. Phys. Lett. 76, 16 (2000).
  • 12 Y. Y. Wei, Gyula Eres, V. I. Merkulov et al.,
    Appl. Phys. Lett 78, 10 (2001).
  • 13 M. Ohring, The Matrials Science of Thin Films,
    AP, (New York, 1992)
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