Semiconductor & IC Packaging Materials Market 2019

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MarketsandMarkets Presents
Semiconductor IC Packaging Materials Market
Poise 26 Billion in 2019
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The report defines and segments
the "Semiconductor IC Packaging Materials
Market by Types (Organic Substrates, Bonding
Wires, Lead frames, Ceramic Packages, and so on),
Packaging Technologies (SOP, GA, QFN, DFN, and
others), and Geography - Regional Trends
Forecast to 2019" with an analysis and forecast
of revenues of types such as organic substrates,
bonding wires, leadframes, encapsulation resins,
and so on) individually. Along with this, the
revenue of materials by types such as packaging
technologies, and geography are also
discussed. Browse gtgt 70
data tables 32 figures
183 slides and in-depth TOC on
Semiconductor IC Packaging Materials Market 
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It also identifies the driving and restraining
factors for the semiconductor and IC packaging
materials market with an analysis of trends,
opportunities, burning issues, and winning
imperatives. The market is segmented and the
revenue has been forecasted on the basis of major
regions such as North America, Asia-Pacific,
Europe, and Rest of the World (ROW). Furthermore,
the market is segmented and revenues are
forecasted on the basis of major packaging
technologies of semiconductor and IC packaging
materials in various electronic components such
as consumer electronics, flat panel displays, and
others. Semiconductors ICMajor market for
packaging materials The semiconductor and IC
packaging materials market is segmented into
following types organic substrates, bonding
wires, leadframes, encapsulation resins, and
others. Each type of semiconductor and IC
packaging material has its own properties and
applications. These individual packaging
materials have application-specific demands that
are differentiated by placement, cost, and
efficiency. Organic substrates are used as base
materials in semiconductor applications and
manufacturing. Encapsulation resins are
comparatively the latest and are especially
designed to protect and insulate electronic
components from external threats. The use of
these semiconductor and IC packaging materials
increases the efficiency of their applications.
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The semiconductor IC packaging materials
market to reach 26 million by 2019 The market
for semiconductor and IC packaging materials in
terms of revenue is expected to reach 26 million
by 2019, growing at a CAGR of 4.5 from 2014 to
2019. Asia-Pacific dominated the semiconductor
and IC packaging materials market revenues in
2013. Asia-Pacific is expected to remain the
major by 2019, growing at a CAGR of 5.0 from
2014 to 2019. ROW is expected to be the fastest
growing markets, growing at a CAGR of 3.5 from
2014 to 2019. Europe and North America are
estimated to grow at a slower CAGR of 3.0 and
3.2 respectively from 2014 to 2019, owing to the
rising consumption in the Asia-Pacific region,
where end-user markets of semiconductor and IC
packaging materials are growing steadily.
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Asia-Pacific alone accounted for more than 68
of the semiconductor IC packaging materials
revenues in 2013 Asia-Pacific is the largest
semiconductor and IC packaging market, with major
developments in China, Japan, Taiwan, and South
Korea. Asia-Pacific alone accounted for 68 of
the semiconductor and IC packaging materials
revenue in 2013. This region is expected to
dominate the market by 2019, with advanced
technological developments in electronic
packaging materials for end-users. Asia-Pacific
is expected to remain the major semiconductor and
IC packaging market by 2019, with high
investments in emerging applications due to
growing population and demand.
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