SEMICONDUCTOR PPt - PowerPoint PPT Presentation

About This Presentation
Title:

SEMICONDUCTOR PPt

Description:

P-n junction diode and other semiconductor – PowerPoint PPT presentation

Number of Views:5820
Slides: 49
Provided by: hemantc251
Tags:

less

Transcript and Presenter's Notes

Title: SEMICONDUCTOR PPt


1
Review of Semiconductor Physics, PN Junction
Diodes and Resistors
  • Semiconductor fundamentals
  • Doping
  • Pn junction
  • The Diode Equation
  • Zener diode
  • LED
  • Resistors

2
What Is a Semiconductor?
3
Semiconductors
  • A material whose properties are such that it is
    not quite a conductor, not quite an insulator
  • Some common semiconductors
  • elemental
  • Si - Silicon (most common)
  • Ge - Germanium
  • compound
  • GaAs - Gallium arsenide
  • GaP - Gallium phosphide
  • AlAs - Aluminum arsenide
  • AlP - Aluminum phosphide
  • InP - Indium Phosphide

4
Crystalline Solids
  • In a crystalline solid, the periodic arrangement
    of atoms is repeated over the entire crystal
  • Silicon crystal has a diamond lattice

5
Crystalline Nature of Silicon
  • Silicon as utilized in integrated circuits is
    crystalline in nature
  • As with all crystalline material, silicon
    consists of a repeating basic unit structure
    called a unit cell
  • For silicon, the unit cell consists of an atom
    surrounded by four equidistant nearest neighbors
    which lie at the corners of the tetrahedron

6
Whats so special about Silicon?
  • Cheap and abundant
  • Amazing mechanical, chemical and electronic
    properties
  • The material is very well-known to mankind
  • SiO2 sand, glass

Si is column IV of the periodic table Similar to
the carbon (C) and the germanium (Ge) Has 3s² and
3p² valence electrons
7
Nature of Intrinsic Silicon
  • Silicon that is free of doping impurities is
    called intrinsic
  • Silicon has a valence of 4 and forms covalent
    bonds with four other neighboring silicon atoms

8
Semiconductor Crystalline Structure
  • Semiconductors have a regular crystalline
    structure
  • for monocrystal, extends through entire structure
  • for polycrystal, structure is interrupted at
    irregular boundaries
  • Monocrystal has uniform 3-dimensional structure
  • Atoms occupy fixed positions relative to one
    another, butare in constant vibration about
    equilibrium

9
Semiconductor Crystalline Structure
  • Silicon atoms have 4 electrons in outer shell
  • inner electrons are very closely bound to atom
  • These electrons are shared with neighbor atoms on
    both sides to fill the shell
  • resulting structure is very stable
  • electrons are fairly tightly bound
  • no loose electrons
  • at room temperature, if battery applied, very
    little electric current flows

10
Conduction in Crystal Lattices
  • Semiconductors (Si and Ge) have 4 electrons in
    their outer shell
  • 2 in the s subshell
  • 2 in the p subshell
  • As the distance between atoms decreases the
    discrete subshells spread out into bands
  • As the distance decreases further, the bands
    overlap and then separate
  • the subshell model doesnt hold anymore, and the
    electrons can be thought of as being part of the
    crystal, not part of the atom
  • 4 possible electrons in the lower band (valence
    band)
  • 4 possible electrons in the upper band
    (conduction band)

11
Energy Bands in Semiconductors
  • The space between the bands is the energy gap, or
    forbidden band

12
Insulators, Semiconductors, and Metals
  • This separation of the valence and conduction
    bands determines the electrical properties of the
    material
  • Insulators have a large energy gap
  • electrons cant jump from valence to conduction
    bands
  • no current flows
  • Conductors (metals) have a very small (or
    nonexistent) energy gap
  • electrons easily jump to conduction bands due to
    thermal excitation
  • current flows easily
  • Semiconductors have a moderate energy gap
  • only a few electrons can jump to the conduction
    band
  • leaving holes
  • only a little current can flow

13
Insulators, Semiconductors, and Metals (continued)
Conduction Band
Valence Band
Conductor
Semiconductor
Insulator
14
Hole - Electron Pairs
  • Sometimes thermal energy is enough to cause an
    electron to jump from the valence band to the
    conduction band
  • produces a hole - electron pair
  • Electrons also fall back out of the conduction
    band into the valence band, combining with a hole

pair elimination
pair creation
hole
electron
15
Improving Conduction by Doping
  • To make semiconductors better conductors, add
    impurities (dopants) to contribute extra
    electrons or extra holes
  • elements with 5 outer electrons contribute an
    extra electron to the lattice (donor dopant)
  • elements with 3 outer electrons accept an
    electron from the silicon (acceptor dopant)

16
Improving Conduction by Doping (cont.)
  • Phosphorus and arsenic are donor dopants
  • if phosphorus is introduced into the silicon
    lattice, there is an extra electron free to
    move around and contribute to electric current
  • very loosely bound to atom and can easily jump to
    conduction band
  • produces n type silicon
  • sometimes use symbol to indicate heavier
    doping, so n silicon
  • phosphorus becomes positive ion after giving up
    electron

17
Improving Conduction by Doping (cont.)
  • Boron has 3 electrons in its outer shell, so it
    contributes a hole if it displaces a silicon atom
  • boron is an acceptor dopant
  • yields p type silicon
  • boron becomes negative ion after accepting an
    electron

18
Epitaxial Growth of Silicon
  • Epitaxy grows silicon on top of existing silicon
  • uses chemical vapor deposition
  • new silicon has same crystal structure as
    original
  • Silicon is placed in chamber at high temperature
  • 1200 o C (2150 o F)
  • Appropriate gases are fed into the chamber
  • other gases add impurities to the mix
  • Can grow n type, then switch to p type very
    quickly

19
Diffusion of Dopants
  • It is also possible to introduce dopants into
    silicon by heating them so they diffuse into the
    silicon
  • no new silicon is added
  • high heat causes diffusion
  • Can be done with constant concentration in
    atmosphere
  • close to straight line concentration gradient
  • Or with constant number of atoms per unit area
  • predeposition
  • bell-shaped gradient
  • Diffusion causes spreading of doped areas

top
side
20
Diffusion of Dopants (continued)
Concentration of dopant in surrounding atmosphere
kept constant per unit volume
Dopant deposited on surface - constant amount per
unit area
21
Ion Implantation of Dopants
  • One way to reduce the spreading found with
    diffusion is to use ion implantation
  • also gives better uniformity of dopant
  • yields faster devices
  • lower temperature process
  • Ions are accelerated from 5 Kev to 10 Mev and
    directed at silicon
  • higher energy gives greater depth penetration
  • total dose is measured by flux
  • number of ions per cm2
  • typically 1012 per cm2 - 1016 per cm2
  • Flux is over entire surface of silicon
  • use masks to cover areas where implantation is
    not wanted
  • Heat afterward to work into crystal lattice

22
Hole and Electron Concentrations
  • To produce reasonable levels of conduction
    doesnt require much doping
  • silicon has about 5 x 1022 atoms/cm3
  • typical dopant levels are about 1015 atoms/cm3
  • In undoped (intrinsic) silicon, the number of
    holes and number of free electrons is equal, and
    their product equals a constant
  • actually, ni increases with increasing
    temperature
  • This equation holds true for doped silicon as
    well, so increasing the number of free electrons
    decreases the number of holes

np ni2
23
INTRINSIC (PURE) SILICON
  • At 0 Kelvin Silicon density is 510²³
    particles/cm³
  • Silicon has 4 valence electrons, it covalently
    bonds with four adjacent atoms in the crystal
    lattice
  • Higher temperatures create free charge carriers.
  • A hole is created in the absence of an
    electron.
  • At 23C there are 10¹º particles/cm³ of free
    carriers

24
DOPING
There are two types of doping N-type and P-type.
  • The N in N-type stands for negative.
  • A column V ion is inserted.
  • The extra valence electron is free to move about
    the lattice
  • The P in P-type stands for positive.
  • A column III ion is inserted.
  • Electrons from the surrounding Silicon move to
    fill the hole.

25
Energy-band Diagram
  • A very important concept in the study of
    semiconductors is the energy-band diagram
  • It is used to represent the range of energy a
    valence electron can have
  • For semiconductors the electrons can have any one
    value of a continuous range of energy levels
    while they occupy the valence shell of the atom
  • That band of energy levels is called the valence
    band
  • Within the same valence shell, but at a slightly
    higher energy level, is yet another band of
    continuously variable, allowed energy levels
  • This is the conduction band

26
Band Gap
  • Between the valence and the conduction band is a
    range of energy levels where there are no allowed
    states for an electron
  • This is the band gap
  • In silicon at room temperature in electron
    volts
  • Electron volt is an atomic measurement unit, 1 eV
    energy is necessary to decrease of the potential
    of the electron with 1 V.

27
Impurities
  • Silicon crystal in pure form is good insulator -
    all electrons are bonded to silicon atom
  • Replacement of Si atoms can alter electrical
    properties of semiconductor
  • Group number - indicates number of electrons in
    valence level (Si - Group IV)

28
Impurities
  • Replace Si atom in crystal with Group V atom
  • substitution of 5 electrons for 4 electrons in
    outer shell
  • extra electron not needed for crystal bonding
    structure
  • can move to other areas of semiconductor
  • current flows more easily - resistivity decreases
  • many extra electrons --gt donor or n-type
    material
  • Replace Si atom with Group III atom
  • substitution of 3 electrons for 4 electrons
  • extra electron now needed for crystal bonding
    structure
  • hole created (missing electron)
  • hole can move to other areas of semiconductor if
    electrons continually fill holes
  • again, current flows more easily - resistivity
    decreases
  • electrons needed --gt acceptor or p-type material

29
COUNTER DOPING
  • Insert more than one type of Ion
  • The extra electron and the extra hole cancel out

30
A LITTLE MATH
  • n number of free electrons
  • pnumber of holes
  • ninumber of electrons in intrinsic
    silicon10¹º/cm³
  • pi-number of holes in intrinsic silicon 10¹º/cm³
  • Mobile negative charge -1.610-19 Coulombs
  • Mobile positive charge 1.610-19 Coulombs
  • At thermal equilibrium (no applied voltage)
    np(ni)2 (room temperature
    approximation)
  • The substrate is called n-type when it has more
    than 10¹º free electrons (similar for p-type)

31
P-N Junction
  • Also known as a diode
  • One of the basics of semiconductor technology -
  • Created by placing n-type and p-type material in
    close contact
  • Diffusion - mobile charges (holes) in p-type
    combine with mobile charges (electrons) in n-type

32
P-N Junction
  • Region of charges left behind (dopants fixed in
    crystal lattice)
  • Group III in p-type (one less proton than Si-
    negative charge)
  • Group IV in n-type (one more proton than Si -
    positive charge)
  • Region is totally depleted of mobile charges -
    depletion region
  • Electric field forms due to fixed charges in the
    depletion region
  • Depletion region has high resistance due to lack
    of mobile charges

33
THE P-N JUNCTION
34
The Junction
?
The potential or voltage across the silicon
changes in the depletion region and goes from
in the n region to in the p region
35
Biasing the P-N Diode
THINK OF THE DIODE AS A SWITCH
Forward Bias Applies - voltage to the n region
and voltage to the p region CURRENT!
Reverse Bias Applies voltage to n region and
voltage to p region NO CURRENT
36
P-N Junction Reverse Bias
  • positive voltage placed on n-type material
  • electrons in n-type move closer to positive
    terminal, holes in p-type move closer to negative
    terminal
  • width of depletion region increases
  • allowed current is essentially zero (small
    drift current)

37
P-N Junction Forward Bias
  • positive voltage placed on p-type material
  • holes in p-type move away from positive terminal,
    electrons in n-type move further from negative
    terminal
  • depletion region becomes smaller - resistance of
    device decreases
  • voltage increased until critical voltage is
    reached, depletion region disappears, current can
    flow freely

38
P-N Junction - V-I characteristics
  • Voltage-Current relationship for a p-n junction
    (diode)

39
Current-Voltage Characteristics
THE IDEAL DIODE
Positive voltage yields finite current Negative
voltage yields zero current
REAL DIODE
40
The Ideal Diode Equation
41
Semiconductor diode - opened region
  • The p-side is the cathode, the n-side is the
    anode
  • The dropped voltage, VD is measured from the
    cathode to the anode
  • Opened VD ? VF
  • VD VF
  • ID circuit limited, in our model the VD cannot
    exceed VF

42
Semiconductor diode - cut-off region
  • Cut-off 0 lt VD lt VF
  • ID ? 0 mA

43
Semiconductor diode - closed region
  • Closed VF lt VD ? 0
  • VD is determined by the circuit, ID 0 mA
  • Typical values of VF 0.5 0.7 V

44
Zener Effect
  • Zener break down VD lt VZ
  • VD VZ, ID is determined by the circuit.
  • In case of standard diode the typical values of
    the break down voltage VZ of the Zener effect -20
    ... -100 V
  • Zener diode
  • Utilization of the Zener effect
  • Typical break down values of VZ -4.5 ... -15 V

45
LED
  • Light emitting diode, made from GaAs
  • VF1.6 V
  • IF gt 6 mA

46
Resistor in an Integrated Circuit
47
(No Transcript)
48
(No Transcript)
Write a Comment
User Comments (0)
About PowerShow.com