Future of Chemical Mechanical Planarization Market

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MarketsandMarkets Presents
Chemical Mechanical Planarization Market worth
4.94 Billion by 2020
http//www.marketsandmarkets.com/Market-Reports/ch
emical-mechanical-planarization-market-205609310.h
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• According to a new market research report on
  the "Chemical Mechanical Planarization Market by
  type (Equipment consumables), Application(IC
  manufacturing, MEMS NEM, Optics and Others),
  Technology (Leading edge, More Than Moores, and
  Emerging), and Geography (North America, Europe,
  APAC and RoW) - Global Forecast to 2020", the
  market is expected to grow at a CAGR of 6.83
  between 2015 and 2020, and reach 4.94 Billion by
  2020.
• Browse 81 market data Tables and 70 Figures
  spread through 148 Pages and in-depth TOC on
  "Chemical Mechanical Planarization Market -
  Global Forecast to 2020"

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• The chemical mechanical planarization is a
  critical process technology step in the
  semiconductor wafer fabrication process. In this
  process step, the top surface of the wafer is
  polished or planarized to create a flawless flat
  surface that is essential to make faster and more
  powerful semiconductor devices with the aid of
  chemical slurry mechanical movements. The CMP
  tool is comprised a rotating platen, slurry, pad,
  holding ring, brush, and pad conditioner. The
  mechanical element of this system applies
  downward pressure to a wafer surface, while the
  chemical reaction increases the material removal
  rate. The value chain of the CMP market consists
  of different players, including semiconductor
  material suppliers, CMP integrated solution
  providers, semiconductor wafer suppliers,
  semiconductor device manufacturers, slurry pad
  manufacturers, technology solution providers, and
  CMP equipment manufacturers.
• The global CMP market was worth USD 3.32 Billion
  in 2014, and it is expected to reach USD 4.94
  Billion by 2020, at an estimated CAGR of 6.83
  from 2015 to 2020. Though the CMP market is at
  the mature stage, it still continues to evolve
  depending on the end users. The industry is being
  forced to adopt much innovation in process
  technologies and applications as a result,
  different CMP processes have been evolved with
  technology nodes and newer applications such as
  MEMS, advanced packaging, and advanced
  substrates. The growing demand for consumer
  electronic products, increasing need of wafer
  planarization, and increasing use of
  micro-electro-mechanical systems (MEMS) is
  driving the global CMP market.

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• This CMP consumables market is dominated by major
  market players such as Cabot Microelectronics
  Corporation (U.S.), Fujimi Incorporated (Japan),
  and Dow Electronic Materials (U.S.).The CMP
  regional market is mainly dominated by
  Asia-Pacific, followed by North America and
  Europe. The Asia-Pacific region accounted for the
  largest market share of 67 and is expected to
  grow at the highest CAGR of 7.40 during the
  forecast period, followed by North America. The
  countries in Asia-Pacific region such as Taiwan,
  South Korea, Japan, and China are investing more
  in semiconductor manufacturing to meet the
  increasing demand for consumer electronic
  products. This detailed market research study
  provides detailed qualitative and quantitative
  analysis of the global chemical mechanical
  planarization market. It provides a comprehensive
  review of major market drivers, restraints,
  opportunities,, challenges, and key issues in the
  market. Competitive scenario and market share of
  the top players have been discussed in detail.
  The top players of the industry are profiled in
  detail with their recent developments and other
  strategic industry activities.
• Some of the major companies profiled in the
  report are Applied Materials, Inc. (U.S.), Ebara
  Corporation (Japan), Cabot Microelectronics
  Corporation (U.S.), Dow Electronic Materials
  (U.S.), and Fujimi Incorporated (Japan).

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