Global Thermal Management Technologies Market Forecast 2017 - 2022

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Global Thermal Management Technologies Market
Forecast 2017 - 2022
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Summary

• The global market for thermal management products
  should reach 6.3 billion by 2022 from 4.7
  billion in 2017 at a compound annual growth rate
  CAGR of 6.0, from 2017 to 2022.
• Report Includes
• An overview of the global market for thermal
  management in semiconductor microchips
• Analyses of global market trends, with data from
  2016, estimates for 2017 and projections of
  compound annual growth rates (CAGRs) through 2022
• Analyses of the market types of substrate
  material, properties of substrate material,
  end-user industries, product type, and region
• A look in to the market drivers, such as
  renewable energy, automotive industry, consumer
  appliances, and light-emitting diodes
• Profiles of the major companies in the industry

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• Thermal management is the term used to describe
  the array of materials, technologies and
  problem-solving tools that manufacturers apply to
  regulate the unwanted heat caused by the normal
  functioning of an electronic system.
• Thermal management occurs at different nodes of
  an integrated circuit (IC).
• An integrated circuit can be of three types
  memory chip, microchip or microprocessor chip,
  and logic chip.
• The microchip is a semiconductor wafer that is
  made, layer by layer, on a metal wafer substrate
  of the semiconductor material on which thousands
  to millions of tiny transistors are arranged to
  perform many functions and processes.

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• Microchips are also made to perform many
  arithmetic and logic operations, and memory
  operations and for special purposes such as
  analog-to-digital conversion, bit slicing, and
  gateways.
• This report categorizes thermal management
  technologies used in microchips into six product
  segments heat sinks, fans and blowers, fan
  sinks, heat pipes, cold plates, and others
  (thermoelectric, pumped liquid).
• These segments have been chosen because they are
  established technologies and represent revenue
  markets of significant size.
• Thermal management interface materials are
  products that stand between a heat sink and the
  device to be cooled.
• Their function is to improve the thermal transfer
  in the joint between the heat sink and the device
  to be cooled by increasing or securing the area
  of contact between the two surfaces.
• In some cases, the interface performs the job of
  the heat sink.
• This role has become increasingly common in
  several applications in which, due to the height
  or weight constraints of the system, a
  conventional hardware heat sink is not feasible.

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Study Goals and Objectives

• The report aims to provide an analysis of the
  most recent developments and current trends in
  global thermal management in the microchip
  marketplace. Specific objectives are
• To identify thermal management technologies and
  products with the greatest commercial potential
  in the near term to middle term (2016 to 2022)
• To analyze the key drivers that will shape the
  market for thermal management technologies and
  products over the next five years
• To estimate the current and future demands for
  thermal management technologies and products
• To ascertain the companies that are best
  positioned to meet these demands because of
  proprietary technologies, strategic alliances, or
  other advantages

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Related Reports

• Global Thermal Management Detailed Analysis
  Report 2017-2022
• Global Thermal Management Market Research Report
  2017-2022 by Players, Regions, Product Types
  Applications
• Global and United States Thermal Management
  In-Depth Research Report 2017-2022
• Global and Europe Thermal Management Market -
  Analysis and Outlook to 2022
• 2017-2022 Global and Japan Thermal Management
  Market Analysis Report

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Full Reports
Global Thermal Management Technologies Market
Forecast 2017 - 2022
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