Step by Step Process of BGA Reballing - PowerPoint PPT Presentation

About This Presentation
Title:

Step by Step Process of BGA Reballing

Description:

Esanyog - laptop repairing shop and BGA repairing servicesin Pune and Pimpri Chinchwad – PowerPoint PPT presentation

Number of Views:126

less

Transcript and Presenter's Notes

Title: Step by Step Process of BGA Reballing


1
Step by Step Process of BGA Reballing
2
Introduction
  • Reballing means changing all the Soldered Balls
    on Chip Ball Grid Array Circuit, there are a lot
    of different reasons why we need to reball a
    Chip.
  • Reballing mainly runs on the computer, laptop,
    and game console motherboards, the reason behind
    this problem is the video graphics chip. It may
    be unbelievable, but your device's Video Chip is
    the most unfortunate chip to get the most broken
    soldered joints, and in most cases needs repair.
  • In fact, as well as video chips, there are a lot
    of BGA circuit chips on the market, which need to
    be reballing when they break or fail.
  • Esanyog have solutions for all your BGA rework
    and repair needs. We have a state-of-the-art BGA
    rework system and staff of engineers and
    operators with deep knowledge and experience in
    the complex process of BGA rework.
  • We offer a wide range of services including
    removal, replacement and recovery of BGA parts.
    Modification of circuit pattern design at X-ray
    inspection BGA site. Repair of lifted or missing
    BGA pads. Solder mask repair at BGA site

3
Ball Grid Array, BGA rework
  • It is not easy to rebuild a board containing BGA
    If you suspect that the BGA is defective, it is
    possible to remove the device.
  • This is achieved by locally heating the device to
    the underlying solder.
  • In the BGA rework process, heating is often
    achieved.
  • This includes a jig with an infrared heater, a
    thermocouple for the monitor and a vacuum device
    to lift the package.
  • Care must be taken to heat and remove only the
    BGA. Contact information

4
BGA Repair
  • The removed BGA can be replaced with a new one.
    Occasionally, it may be possible to repair or
    repair a removed BGA.
  • This BGA repair may be an attractive proposition
    if the chip is known to be an expensive device
    that will operate once removed.
  • This BGA repair can be done using some small
    off-the-shelf solder balls that are manufactured
    and sold for this purpose.
  • Sanyog Electronics has extensive experience in
    both repairing and replacing failed BGA
    connections

5
Steps for BGA Reballing
  • Step 1 Deball the Device
  • Apply a water soluble paste flux using a
    syringe and apply a ball of the device with a
    gloved finger. Remove the solder ball using the
    appropriate blade tip or temperature setting
    based on the solder ball alloy. Use a soft-solder
    to ensure that the pad is flat and remove any
    remaining solder. Move the blade up and down
    without sweeping the bottom of the part to
    scratch the mask or lift the pad of the part.
  • Step 2 Clean Deball part
  • Remove flux residue from the bottom of the
    Devar section using isopropyl alcohol and a non
    electrostatic induction wipe to clean the Deball
    part
  • Step 3 Apply water soluble paste flux
  • Examine the device to make sure that the
    mask or lift pad is not scratched on the bottom
    of the device. Apply water soluble paste flux to
    the bottom of the part. Spread with a soft brush
    until the uniform thickness is at the bottom of
    the part.

6
Step 4 Place the perform ball on top Place the
perform ball on top of a flat heat-resistant
surface, such as a flat ceramic plate. Make sure
that the performs are aligned with the device
pattern. Make sure you have the correct solder
alloy solder ball attached to the device. Step
5 Carefully place the device on top of the
preform Carefully place the device on top of the
BGA recall preform, making sure that the
orientation of the pattern is correct. Step 6
Square up the device to the perform Use square
brackets or other measures to "square" the
preform to a BGA Step 7 Reflux Place the
"sandwich" structure of the preform and equipment
into a Reflux oven or other heat source. Make
sure that the proper temperature setting is
made. Step 8 Wipe out Preform While still warm,
remove the preform from the device. Make sure
that all balls have moved to the device. Please
wipe with water and a soft brush. Re-inspect the
scratches on the mask or lifted pad. Step 9
Check Reballed equipment Examine the reballed
device by expanding it to the criteria you have
in mind.
7
Contact Us
  •  Shop No 15,Harshal Heights, Opp.Gavde Petrol
    Pump, Pimpri-Chinchwad Link Rd, Pune, Maharashtra
    411033

8
Thank You!
Write a Comment
User Comments (0)
About PowerShow.com