Solderability Test Equipment from Sasinno

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Presented by sasinno
Solderability Test Equipment from Sasinno
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Manual operation consumes huge time and requires
undivided attention for a prolonged period.
Handling massive projects relying solely on
manual operation can be a costly mistake, you do
not wish to afford. Solderability testing is
about evaluating the solderability of wires,
terminations and other things (including lead) or
an electronic component.
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What does the testing serve?
Opt for equipment that comes in complete
adherence with all current standards observed in
the industry. The testing helps to avail of a way
by which we can determine the solderability of
system package terminations.
Popular Testing Methods
These are supposed to be paired with some other
surface employing PB-free solder. Two popular
methods are there that are adopted to test the
solderabilitySurface Mount Process Simulation
Test and Dip Look Test.
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Surface Mount Process Simulation Test
We perform surface mount simulation testing via
screen printing a specific solder mixture
(paste-like consistency) onto the surface of a
ceramic plate.
Dip and Look method
We perform dip and look solderability testing by
exposing the electronic components to 0-8 hours
of steam conditioning constantly. Post this steam
conditioning phase, the terminations of the
components are immersed in the solder mixture in
a controlled way.
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Important Features and Configurations to Look for

• Look for suitable solderability test equipment
  that can cater to your solderability testing
  requirements in the best way possible.

• Table-top or bench-top equipment features a
  modular compact design that does not consume
  extra space around unnecessarily.

• The equipment should come installed with a
  user-friendly interface in full English so that
  the operator can easily manage its usage.

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Sasinno Bld 1, Hua Ke Bao Chuang, Industry Zone,
Shi Da Road Daling Shan Town,DongGuan, China Zip
code 523825 Ph. no 0769-85303739 Business mail
sales_at_1clicksmt.com
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