Panel Level Packaging Market

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Panel Level Packaging Market - Forecast(2022 -
2027)
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• Panel Level Packaging Market Size is forecast to
  reach 3.5 billion by 2026, at a CAGR of 18.5
  during 2021-2026. Panel Level packaging (PLP) is
  one of the latest packaging trends in
  microelectronics. Besides technology developments
  towards heterogeneous integration, larger
  substrates formats also are targeted. In
  addition, manufacturers are increasingly driving
  their suppliers to provide panel -processing
  tools and materials to allow them to bring
  wafer-level precision to package processed on
  panel substrates. This packaging is used in the
  packaging of field programmable gate array
  (FPGA), CPU/GPU, power management IC module,
  baseband, and others.

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• Key Takeaways
• Consumer Electronics sector is expected to
  witness a highest CAGR of 19.9 the forecast
  period, as this segment is powering a new wave of
  developments in electronic packaging.
• Panel Level Packaging market in Asia-Pacific
  region held significant market share of 35.5 in
  2020. With the presence of several significant
  vendors in the power electronics market, which
  are actively investing for the development of
  advanced panel-level packaging technology is
  driving the market growth.
• According to Semiconductor Industry Association
  (SIA), memory, logic, analog, and MPU related
  semiconductor products accounts for more than 80
  of the total sales in the semiconductor industry

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By Distribution Channel- Segment AnalysisFan-out
Panel Level Packaging segment is expected to hold
significant share of 51 in 2020. Several
packaging houses are implementing panel-level
fan-out, a low-density technology that promises
to lower the cost of fan-out. Fan-out Panel Level
Packaging segment is expected to be essential for
future applications on 5G, AI, Biotech, Advanced
Driver- Assistance System (ADAS), smart city, and
IoT related products. In addition ability to
develop advanced packing and testing services and
secure customer relations serve as major factors
which are diving the market growth in the
forecast period. Fan-out Panel Level Packaging
segment finds large-scale applications in the
consumer electronics sector to design ultra-thin
portable devices such as smartphones, smart
watches, and laptops as they offer
high-performing, energy-efficient, thin, and
small form factor packages. 
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• Panel Level Packaging Market
•  Industry Outlook
• Amkor Technology, Inc
• Deca Technologies
• Lam Research Corporation
• ASE Group
• Siliconware Precision Industries Co., Ltd.
• Fraunhofer Institute for Reliability
• Micro integration IZM
• Taiwan Semiconductor Manufacturing Company
• Shinko Electric Industries Co, Ltd.

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Panel Level Packaging Market - Forecast(2022 -
2027)Learn More About the Report _at_
https//www.industryarc.com/Research/Panel-Level-
Packaging-Market-Research-509499
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• You Can Customize the Report as Per Your Need.
  We have included Some Customization Options
• Company Profile
• Analyst Briefing
• Data Tables
• Key Contacts
• Free Customization
• Purchase Full Report _at_ https//www.industryarc.com
  /purchasereport.php?id509499

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For More Details Contact Venkat
Reddy Contact (1) 970-236-3677 Email
sales_at_industryarc.com Connect with us on LinkedIn
_at_ http//www.linkedin.com/company/industryarc
Contact (1) 970-236-3677
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