3D IC Market Share 2023-2028

1
Global 3D IC Market Research and Forecast Report
2023-2028




Author Elena Anderson, Marketing Manager
IMARC Group
Copyright IMARC Service Pvt Ltd. All Rights
Reserved
2019 IMARC All Rights Reserved
2
About IMARC Group
Report Description
The International Market Analysis Research and
Consulting Group is a leading adviser on
management strategy and market research
worldwide. We partner with clients in all sectors
and regions to identify their highest-value
opportunities, address their most critical
challenges, and transform their
businesses. IMARCs information products include
major market, scientific, economic and
technological developments for business leaders
in pharmaceutical, industrial, and high
technology organizations. Market forecasts and
industry analysis for biotechnology, advanced
materials, chemicals, food and beverage, travel
and tourism, nanotechnology and novel processing
methods are at the top of the companys
expertise. IMARCs tailored approach combines
unfathomable insight into the dynamics of
companies and markets with close cooperation at
all levels of the client organization. This
ensures that our clients achieve unmatchable
competitive advantage, build more proficient
organizations, and secure lasting results.
3
Report Description and Highlights
Report Description
Global 3D IC Market Research Report According
to the latest report by IMARC Group, titled 3D
IC Market Global Industry Trends, Share, Size,
Growth, Opportunity and Forecast 2023-2028
the global 3D IC market reached a strong growth
in 2022.  Three-dimensional (3D) integrated
circuit (IC) refers to an umbrella term
representing a manufacturing technology that
involves stacking or integrating different
silicon die, chips and wafers together
vertically. These materials are further combined
into a single package wherein the device is
connected via silicon vias (TSVs) and hybrid
bonding procedures. It also encompasses 3D
wafer-level chip-scale packaging (WLCSP), beam
re-crystallization, solid phase crystallization,
and wafer bonding as standard technologies used
in the stacking process. As compared to
two-dimensional (2D) IC, 3D IC offers higher
speed, minimized footprint, and better functional
density at the same reduced power in a similar
smaller area. Apart from this, it provides higher
bandwidth, flexibility, and heterogeneous
integration, ensures faster signal transitions,
and enables better electrical performances. As a
result, 3D IC finds extensive applications as a
key component in microelectronics, photonics,
logic imaging, optoelectronics, and
sensors. Request Free Sample Report
https//www.imarcgroup.com/3d-ic-market/requestsam
ple
4
Report Description and Highlights
Report Description

Global 3D IC Market Trends The widespread
utilization of 3D IC across industries, such as
aerospace, automotive and communications and
telecom, represents one of the key factors
driving the market growth. In line with this, the
considerable expansion in the electronics
industry on account of the increasing purchase of
various compact and advanced consumer electronics
products with superior functionality, such as
laptops, smartphones, and tablets, is driving the
market growth. Moreover, the rising need for
advanced electronics architecture and integrated
circuits with minimal power consumption
properties, is contributing to the market growth.
This is further supported by the emerging trend
of incorporating ICs and using wafer-level
packaging in miniaturized electronic devices,
such as gaming consoles and sensors.
Additionally, the extensive incorporation of 3D
IC in smart home devices, including security
locks, thermostats, fan controllers, smart smoke
detectors, window sensors, and energy monitors,
is favoring the market growth. They are further
embedded in diverse healthcare devices, such as
small hearing and visual aids and heart monitors.
The escalating consumer awareness regarding the
multiple product benefits, including better
speed, memory, durability, efficiency,
performance, and reduced timing delays, is
propelling the market growth. Furthermore, the
integration of the Internet of Things (IoT) and
artificial intelligence (AI) solutions with
wireless technologies and the advent of advanced
IC packaging systems by manufacturers to improve
product production is impelling the market
growth. Other factors, such as the fueling need
for high-bandwidth memory (HBM) and ongoing
product diversification, are positively
stimulating the market growth. Looking forward,
the market value is projected to reach a strong
growth during the forecast period (2023-2028).
5
Report Description and Highlights
Report Description
Market Summary Type Insights Stacked
3D Monolithic 3D Component Insights
Through-Silicon Via (TSV)
Through Glass Via (TGV)
Silicon Interposer Application Insights
Logic Imaging and Optoelectr
onics Memory MEMS/Sensors
LED Others End User Insights

6
Report Description and Highlights
Report Description
Consumer Electronics Telecommu
nication Automotive Military a
nd Aerospace Medical Devices I
ndustrial Others Regional Insights
North America United Stat
es Canada Asia Pacific
China Japan
India South Kor
ea Australia I
ndonesia Others

7
Report Description and Highlights
Report Description
Europe Germany
France United Kingdom
Italy Spain
Russia Others
Latin America Brazil
Mexico Others
Middle East and Africa Note We are upda
ting our reports, If you want latest primary and
secondary data (2023-2028) with Cost Module,
Business Strategy, Distribution Channel, etc.
Click request free sample report.

8
Report Description and Highlights
Report Description

• Competitive Landscape with Key Players
• MonolithIC 3D Inc. Kindly note that this only repr
  esents a partial list of companies
  the complete list has been provided in the report
• View Full Report with TOC List of Figure
  https//www.imarcgroup.com/3d-ic-market

9
Partial List of Clients
We are the trusted business partners to the
world's leading corporates, governments, and
institutions
A partial List of our Clients
10
Partial List of Clients
We are the trusted business partners to the
world's leading corporates, governments, and
institutions
A partial List of our Clients
11
Report Description and Highlights
Report Description

2019 IMARC All Rights Reserved This
Publication and all its contents unless
otherwise mentioned are copyrighted in the name
of International Market Analysis Research and
Consulting (IMARC). No part of this publication
may be reproduced, repackaged, redistributed or
resold in whole or in any part. The publication
may also not be used in any form or by and means
graphic electronic or mechanical, including
photocopying, recording, taping or by information
storage or retrieval, or by any other form,
without the express consent of International
Market Analysis Research and Consulting
(IMARC). Disclaimer All contents and data of
this publication, including forecasts, data
analysis and opinion have been based on
information and sources believed to be accurate
and reliable at the time of publishing.
International Market Analysis Research and
Consulting makes no representation of warranty of
any kind as to the accuracy or completeness of
any Information provided. IMARC accepts no
liability whatsoever for any loss or damage
resulting from opinion, errors or inaccuracies if
any found this publication. IMARC, IMARC Group
and Global Therapy Insight Series are registered
trademarks of International Market Analysis
Research and Consulting. All other trademarks
used in this publication are registered
trademarks of their respective companies.
12

Contact Us