Advantages of Thermoelectric separation PCB

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Advantages of Thermoelectric separation PCB

• sqpcb.com

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Thermoelectric separation in printed circuit
boards (PCBs) offers a range of advantages,
particularly in high-performance and
high-reliability applications where efficient
heat management is crucial.
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Specifications
 Base Material FR4/CEM3/CEM1/FR1/HighTG/LF/HF/Hig
h frequency/Al base/Cu base - Max Board Size1L
1800800mm2L 1200600mm?4L 1200600mm -
Copper thickness1-12OZ  - Min line / space
3/3mil - Surface treatmentHASL,OSP,ENIG,Immersio
n Tin,Immersion Ag,Au plating - Lead time 1-3
days trial order,5-7 days for normal
order  - ShipmentDHL/Fedex/UPS/TNT/EMS/AIR/SEA
ect,Follow customers requirements - SMD SMT DIP
Component Assembly
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Here are some key advantages

• Enhanced Heat Dissipation
• 2. Improved Energy Efficiency
• 3. Increased Component Density
• 4. Enhanced Reliability and Longevity
• 5. Reduced Need for Additional Cooling Systems
• 6. Optimized Performance in High-Temperature
  Environments
• 7. Enhanced Efficiency for Power Electronics
• 8. Lower Risk of Thermal Expansion and Damage

These advantages make thermoelectric separation a
valuable technology in PCBs, especially in
advanced applications where thermal management is
vital for operational stability and efficiency.
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• Contact Us
• Shenzhen Shuoqiang Electronics Co.,Ltd.
• Address Flool1,Building2,Road17,Xin'erzhuang
  village, Shajing, China, Shenzhen
  city,Guangdong,China,518000
• Call 86 136 0306 3656
• URL https//sqpcb.com