Quick Turn PCB Manufacturer

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WELCOME TO EFPCB.COM
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IC Substrate The Base for Integrated Circuit
Packaging
Laminate substrates, lead frames, bonding wire,
encapsulating materials, underfill, die-attach
materials, WLP (Wafer-Level Packaging)
dielectrics, and WLP plating chemicals are among
the most common materials used in integrated
circuit packaging. These materials are used to
shield and link IC chips to external devices such
as printed circuit boards (PCBs), as well as
to provide thermal control and support. Read our
full blog CLICK.
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Get Into the Deep Insights of Semiconductor Test
Board
Semiconductor test boards, often called probe
cards or test fixtures, are critical equipment in
the semiconductor industry for testing and
verifying integrated circuits (ICs) and other
semiconductor devices. These boards allow you to
electrically connect the devices under test
(DUTs) to test equipment such as automated test
equipment (ATE) and semiconductor test systems.
Check more information about our product CLICK.
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Probe Card PCB is A Significant Aspect of
Semiconductor Wafer Test System
In general, the probe card is considered
disposable, and maintenance is essential to
ensure its performance and usefulness. Overload
and the deposition of debris from the wafer's
binding material on the probe's tips or probe
needles can cause resistance to increase and
hinder correct readings. Read our full blog for
more CLICK.
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The Importance and Standard of Via on PAD
Technology for PCB
in high-speed digital circuits, in order to
ensure the integrity of the signal, it is
necessary to strictly control the impedance of
the signal. Through the design of the Via on PAD,
the grounding via can be introduced at a specific
position to realize the reference plane switching
of the signal, so as to adjust the impedance of
the signal and meet the requirements of
high-speed signal transmission. Get more
information check our blog CLICK.
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Our Organization
Our Milestones
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