Printing Materials with a Stamp

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Printing Materials with a Stamp

• Matt Meitl
• January 20, 2005

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Microcontact printing of alkanethiols
master
pour prepolymer
PDMS stamp
ink with alkanethiol
thiol in ethanol
print against gold film
release stamp
Kumar et al, Appl. Phys. Lett. (1993) Michel et
al, IBM J. Res. Dev. (2003)
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Stamping other materials
Polymers (Harvard 1999) (MIT 2000) (LAP
Sweden 2000) (Dresden 2001) (Max-Planck 2002)
(Korea 2002) (KAIST 2004)
Biomolecules (IBM Zurich 1998-) (Purdue 2002)
(Japan 2003) (Germany 2004)
Nanomaterials (Rochester 2004) (UIUC 2004)
Small Polar molecules (notably IBM Zurich 2003)
Metals (Harvard 1996) (IBM Zurich 2003) (Bell
Labs/UIUC 2002-04)
Inorganic Semiconductors (UIUC 2004-05)
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Nanotransfer printing (nTP)
PDMS stamp
PVD Au
octane dithiol
GaAs
Remove stamp
Loo et al, JACS (2002) Zaumseil et al, Nano
Lett. (2003)
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Nanotransfer printing of 3-d Au structures
PDMS stamp
GaAs
corrugated Au film
Zaumseil et al, Nano Lett. (2003)
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3-d printing continued
6 µm
Zaumseil et al, Nano Lett. (2003) Menard et al,
Langmuir (2004)
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Cold-welded Au nano-channel stack by nTP
Stamp
Multilayer Au
Zaumseil et al, Nano Lett (2003)
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SWNT printing onto SiO2, PET
SiO2
(i) Cast PDMS Stamp
(ii) Ink Stamp with SWNT
PET
(iii) Contact Print
SiO2
(iv) Remove Stamp
Meitl et al, Nano Lett. (2004)
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SWNT printing on a capillary tube
Roll curved substrate on inked stamp.
Meitl et al, Nano Lett. (2004)
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Printing onto biological substrates
SWNT on the back of a Ladybug!
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Printing Silicon
i.
ii.
SiO2
Etch SiO2
Patterned SOI
Anchored µS-Si
Pick-up with stamp
iv.
iii.
PDMS stamp
Print onto receiving substrate
Meitl et al, in preparation.
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Printing with Au adhesive
PDMS
Au
µS-Si
Receiving substrate
µS-Si
Meitl et al, in preparation.
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Paper or Plastic?
µS-Si chips on Au on paper
On mylar, Au removed
Meitl et al, in preparation.
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µS-Si on a roller stamp
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Adhesiveless printing of Si onto
150 µm
2
GaAs
Amorphous Si
Meitl et al, in preparation.
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Adhesiveless multilayer Silicon printing
Meitl et al, in preparation.
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Acknowledgements

• Professor John Rogers and students, specifically
  Jana Zaumseil Etienne Menard
• Professor Michael Strano and Monica Usrey
• Professor Ralph Nuzzo and Keon Lee
• Beckman ITG, DARPA Macroelectronics Program, MRL
  Microfabrication Facilities and CMM, DoE, Fannie
  and John Hertz Foundation, Beckman Institute,
  UIUC MatSE

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Thank you!

• --matt

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Break away
Anchor
Anchor
µS-Si
µS-Si removed
25 µm
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Cleavable inks I Mica
Transfer-printed mica on oxidized wafer. Note
bumps on mica. May be PDMS residue may be
bubbles in mica. May be induced by cleaving
maybe not
Mica
79 nm
Mica
36 nm
SiO2 (probably)
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Cleavable inks II HOPG
Transfer-printed HOPG.
1.5 nm
3.5 nm
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Cleavable inks III MoS2
Transfer-printed MoS2.
11 nm
½ µm
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Polymer adhesive mediated microstructure transfer
printing
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Stampzilla
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Peel and Pop Delamination
peel
peel
Pop!
When the flexed stamp is mostly delaminated
(expanse of contacted area thickness of stamp),
the stamp begins to delaminate very quickly (pops
off). (stored elastic energy bond energy?)
Every delamination begins with a peeling action.

• The pop doesnt happen with rigid
  (glass-backed) stamps.
• In the region underneath the pop action, the
  pick-up power of the delamination is greater
  than in the region under the peeling action.
• The faster the peeling action, the greater the
  pick-up power. There is a rate dependence in the
  adhesive force.
• Can we understand/exploit/engineer this effect?
  Special stamp geometries/patterns/chemistries?