PICMG Europe

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PICMG Europe
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PICMG Organization

• Over 10 years in existence
• Over 500 member companies
• Headquarter in USA
• Local offices in Europe, Japan, China

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PICMG Specifications

• Series 1 - Passive backplane
• Series 2 - CompactPCI
• Series 3 - AdvancedTCA
• Others - a.o. MicroTCA

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PICMG Specifications

• Series 1 - Passive backplane

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PICMG Specifications

• Series 1 - Passive backplane Specifications
• 1.0 R2.0 PCI ISA Card Edge Connector for
  Single Board Computer
• 1.1 R1.02 PCI-PCI Bridge Board for Single
  Board Computer
• 1.2 R1.0 Embedded PCI-X
• 1.3 R1.0 System Host Board PCI Express

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PICMG Specifications

• Series 2 - CompactPCI ?

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Compact PCI

• What is CompactPCI ?
• Characteristics
• Industries where CompactPCI is used
• Available specifications
• Specifications under development
• The role of PICMG
• The role of PICMG Europe
• Benefits of CompactPCI

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What is CompactPCI?
The Basic Idea

• If the PCI bus is used everywhere in
• the office environment, why not
• adopt it for the non-office market?

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What is CompactPCI?
Use off-the-shelf PCI technology to make rugged,
passive backplane computers
Standard Silicon
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Based on PCI bus

• Benefits of the PCI Bus
• High performance
• Very large software support
• Low cost because of mass
• volume production
• Fully adopted by the industry
• Completely processor independent
• Allows a short development time for a complete
  system

• BUT it lacks topics like
• A rugged form factor
• Long term availability of components
• Enough slots for industrial controllers with a
  large number of IOs

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Characteristics of CompactPCI

• A mechanical formfactor based on the Eurocard
  format of 3U or 6U
• An 8 slots passive backplane
• An IEEE frontpanel (fully compatible with the EMC
  requirements)
• An injector/ejector mechanism for easy insertion
  or removal of a board
• A specific CPCI connector based on a 2mm hard
  metric connector (IEC 1076-4 spec)

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Mechanical Form Factor
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CompactPCI Connector
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Keying Mechanism
Front panel key
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8 slots passive backplane

• 8 Slots Max without bridge
• 1 System slot (CPU)
• 7 Peripheral slots
• (Bus masters, intelligent or dumb slaves)
• Staged pins for hot swap
• Fully characterized through simulation

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8 slots passive backplane
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All components at a glance
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Industries where CompactPCI is used

• Telecom high growth per year
• Industrial controllers growth of 50 per year
• Military systems COTS approach
• Transport equipment outsourcing
• Medical
• Image processing

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Computer Telephony

• The best of two worlds in a professional system

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Complementary CT bus

• CompactPCI (J1/J2) bus
• Computer bus (Asynchronous bus, 132 MB/s, 33 MHz)
• CPU, Networking mass storage functions, Windows
  NT support
• Computer Telephony bus (J4/J5)
• Telephony data (voice, fax, )
• Large number of slots for vocal plug-in adapter
• Secondary bus ensures Real time data exchange
• PCI is burst/packet oriented (Async)
• Telephony data requires constant flow

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Hot Swapping

• Staged pin
• Sequencing the operation

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Hot Swapping
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CompactPCI Layered Specifications
H.110 Telephony
High Availability
Hot Swap
Multi-Processing
CompactPCI Core Specification
IEC-61076-4-101 2mm Connector
IEEE 1101.1/.10/.11 Mechanicals
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Benefits of CompactPCI

• More suitable for severe environments with shocks
  and vibrations, thanks to the
• CPCI 2 mm hard metric connector
• The CompactPCI 8 slots passive backplane.
• A total system approach till 99.999
• Lots of opportunities to extend the system

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Benefits of CompactPCI

• Fully compatible with the PCI spec 2.0 ensures
  SOFTWARE compatibility
• High performance
• Processor independent
• Low cost

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Benefits of CompactPCI

• Leading edge technology
• Software support
• ITS NOT JUST A BUS, ITS A COMPLETE SYSTEM
  APPROACH

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CompactPCI is fully compatible with PCI Spec 2.0
6U CPU board
CompactPCI passive backplane
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PICMG Specifications

• Series 2 - CompactPCI ? specifications
• 2.0 R3.0 CompactPCI Core
• 2.1 R2.0 CompactPCI Hot Swap
• 2.2 R1.0 VME64x on CompactPCI
• 2.3 R1.0 PMC on CompactPCI
• 2.4 R1.0 IP on CompactPCI
• 2.5 R1.0 CompactPCI Computer Telephony

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PICMG Specifications

• Series 2 - CompactPCI ? specifications
• 2.7 R1.0 CPCI 6U Dual System Slot
• 2.9 R1.0 CPCI System Management
• 2.10 R1.0 CPCI Keying of CPCI Boards
  Backplanes
• 2.11 R1.0 CPCI Power Interface
• 2.12 R2.0 CPCI Hot Swap Infrastructure Interface
  
• 2.14 R1.0 CPCI Multi Computing

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PICMG Specifications

• Series 2 - CompactPCI ? specifications
• 2.15 R1.0 CPCI PCI Telecom Mezzanine/Carrier
  Card
• 2.16 R1.0 CPCI Packet Switching backplane
• 2.17 R1.0 CPCI StarFabric
• 2.18 R1.0 CPCI Serial RapidIO
• 2.20 R1.0 CPCI Serial Mesh Backplane
• EXP.0 R1.0 CPCI Express EXP.0

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PICMG Specifications

• Series 3 -

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ATCA the basis

• ATCA - Advanced Telecommunication Computer
  Architecture

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AdvancedTCA at a Glance

• Much larger field replaceable units (FRU)
• 8U height / 1.2 HP / 280 mm depth
• 3 times the component area of double Eurocard
• Can use higher components
• Can use more / bigger I/O connectors

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AdvancedTCA at a Glance

• Two physically separated transport networks
• Base interface compatible to PICMG 2.16
• Fabric interface full mesh backplane routing,
  can use
• 1000 Base-CX / XAUI (PICMG 3.1)
• InfiniBand (PICMG 3.2)
• StarFabric (PICMG 3.3)
• PCI Express Advanced Switching (PICMG 3.4)

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AdvancedTCA at a Glance

• Integrated intelligent shelf management concept
• Redundant IPMI with electronic keying, power
  cooling management
• Redundant DC power concept

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AdvancedTCA Board Mechanicals
600 mm cabinet
Rear Access Door
Front Access Door
385 mm faceplate-to-faceplate
280 mm
25 mm
5 mm
5 mm
90 mm
75 mm
25 mm
25 mm
70 mm
90mm Optical Cabling/ Air Plenum
75mm Metallic Cabling/ Air Plenum
Up to 4 standard AMCs
Rear panel IO Interconnect
Front Board (8U x 280 mm) (140 in2)1.2 pitch
322.25 mm (12.697)
Zone 2
Rear Module (8U x 70 mm x 1.2) (35 in2)

• Zone 2
• Synch. Clocks
• Update Channels
• Fabric Interface
• Base Interface

• Zone 1
• Power
• Management

Z1
Backplane
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ACTA Peripheral Mngt.
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ATCA Shelf Mngt.
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PICMG Specifications

• Series 3
• 3.0 R2.0 ATCA Base Specification
• 3.1 R1.0 ATCA Ethernet/Fibre Channel
• 3.2 R1.0 ATCA InfiniBand
• 3.3 R1.0 ATCA StarFabric/Advanced Switching
• 3.4 R1.0 ATCA PCI Express/Advanced Switching
• 3.5 R1.0 Serial RapidIO for AdvancedTCA Systems

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PICMG Specifications

• Series 3
• Supporting Specifications
• SFP.0 R1.0 System Fabric Plane Format
• SFP.1 R1.0 Internal TDM

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Other PICMG Specifications

• Advanced Mezzanine Card
• MicroTCA
• COM Express
• HPM

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Advanced Mezzanine Card
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AMC

• Advanced Mezzanine Card Specification for high
  speed modules
• AMC.0 is core spec
• Target interfaces include PCI Express, Advanced
  Switching, Serial RapidIO, and Gigabit Ethernet
• Includes system management and hot swap support

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Other PICMG Specifications

• Advanced Mezzanine Card
• AMC.0 R2.0 Advanced Mezzanine Card Base
• AMC.1 R1.0 PCI Express and Advanced Switching on
  AMC
• AMC.2 R1.0 Ethernet Fabric to AMC
• AMC.3 R1.0 Advanced Mezzanine Card Extension for
  Storage

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Other PICMG Specifications

• MicroTCA
• MTCA.0 R1.0 MicroTCA Base Specification

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MicroTCA

• Based on AdvancedMC (AMC)
• Provides AMC functionality on a
  common backplane (no carrier board)

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MicroTCA spec incl.

• Backplane mounted AMC mounting connector
• Backplane topology and design guidelines
• ATCA compatible system management scheme
  including shelf FRU support
• Power Supply and distribution requirements
• Timing requirements
• Test support requirements
• Redundancy guidelines
• Cooling requirements
• Cable management requirements
• Regulatory requirements (NEBS, Safety, EMC, ESD,
  etc.)

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MicroTCA Basics
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MicroTCA System
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MicroTCA
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MicroTCA Enclosures
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MicroTCA Enclosures
On a panel
and pico on a panel
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MicroTCA System
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MicroTCA Design Goals

• Complementary to AdvancedTCA
• Full conformance with the AMC.0 Module definition
• Favorable cost, size, and modularity
• Target low start-up costs
• Scalable reliability and bandwidth
• Modular and serviceable
• Standardized Shelf management implementation
  compatible with AdvancedTCA

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MicroTCA Design Goals

• Backplane bandwidth SerDes _at_ 140 Gb/s
• Backplane topologies Star, Dual Star, Mesh
• Scalable system reliability from .999 to .99999
• Support any/all AdvancedMC-defined form factors
• Hot Swap/plug-and-play support
• Support for extended temperatures (40 to 65
  degrees)
• Life span eight years

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Conclusions MicroTCA

• Build on existing technology for the
  telecommunication industry
• Provides a basis for flexible, scalable,
  ruggedized, low cost controller platforms
• With high availability and remote maintenance /
  system management
• Provides also low cost communication controllers

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Other PICMG Specifications

• COM Express
• COM.0 R1.0 COM Express Module Base
  Specification

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Other PICMG Specifications

• HPM
• HPM.1 R1.0 Hardware Platform Management
• IPM Controller Firmware Upgrade Specification

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PICMG Europe

• To support
• the usage and supply of productsconforming to
  the
• PICMG specifications in Europe

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PICMG Europe

• Marketing Collateral
• Product guides
• Access to standards
• Newsletters i.c. with CPCI Systems Magazine
• Website logo, description, listings, links
• PR Campaigns
• Tradeshows/seminar program

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Information

• PICMG EuropePO Box 3009, NL-4200 EA Gorinchem,
  
• The Netherlands
• Tel. [phone]
• Fax .[phone]

http//www.picmgeu.org
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• An organization to join!
• Questions ?