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QUARTIC Frontend Electronics

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QUARTIC Frontend Electronics. Lars Holm, Jim Pinfold, Jan Schaapman the QUARTIC Group ... Phase 2: The amplifier and CFD will be replaced by custom electronics ... – PowerPoint PPT presentation

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Title: QUARTIC Frontend Electronics


1
QUARTIC Frontend Electronics
  • Lars Holm, Jim Pinfold,
    Jan Schaapman the QUARTIC Group
  • Associated Group (GASTOF)
  • University of Louvain Krzysztof Piotrzkowski

René Magritte Empire of Light
2
Frontend Electronics Development
  • The frontend electronics work will proceed in
    three phases
  • Phase 1 Planned for next test beam starting
    March 7th it includes
  • An amplifier (Hamamatsu, Ortec, Phillips)
  • An ORTEC CFD
  • A Phillips TDC (7186)
  • Phase 2 The amplifier and CFD will be replaced
    by custom electronics
  • Phase 3 The commercial TDC will be replaced by
    a custom board based on the CERN HPTDC
    http//micdigital.web.cern.ch/micdigital/hptdc/)
  • The aim is 10ps resolution overall - this could
    be achieved by 30 ps time resolution per Quartic
    element measurement (assuming we are not affected
    by coherent noise)

James L Pinfold
Manchester 2006
1
3
Phase 1
  • The ORTEC 934 Quad Constant-Fraction 100- MHz
    Discriminator is a single-width NIM module with 4
    channels. Time resolution 50ps
  • The Phillips TDC has
  • 16 channels
  • 12 bit dynamic range
  • Resolution down to 25 psec/count

James L Pinfold
Manchester 2006
2
4
Phase 2 (1)
  • New boards from Alberta and Louvain
  • The Alberta board contains both the amplifier and
    the CFD
  • We are aiming at 20 ps?30ps resolution with the
    CFD
  • Each board has 4 channels
  • The first prototype should be available at the
    end of Feb. 07

James L Pinfold
Manchester 2006
3
5
Phase 2 (2)
O U T P U T T O H P T D C
input
CFD
Shaping
Phillips BGA2717 wideband amp Chips are used
used in the input configuration of the CFD.
2 Analog Devices ADCMP582 comparators (10ps
jitter) are used, one for the threshold
acceptance and the 2nd sensing the CFD zero
xing
James L Pinfold
Manchester 2006
4
6
Phase 3 (1)
  • Move to the HPTDC based solution
  • Our approach to the TDC implementation is based
    on the ALICE ToF boards (NIMA 533 (2004)
    178182)
  • We have 3 board types one for AMP-CFD and two
    for the TDC (a master board and slave boards)
    to reduce noise

James L Pinfold
Manchester 2006
5
7
Phase 3 (2)
  • Some information on the CERN HP-TDC chip
  • 32 ? channels/chip? Size2.72.7 cm2 ?
  • External clock40MHz?Synchronized to bunches.
  • Internal clock 40MHz / 160 MHz / 320 MHz
    internal
  • Time resolution Typical values 0.72 bin RMS (17
    ps) very high resolution mode
  • To get high resolution we need to gang 4 channels
    thus a 32 channel chip goes to a 8 channel chip
  • Variation with temperature Maximum 100ps change
    with 10 Deg. change of IC temperature.
  • Cross talk Maximum 100 ps
  • Dynamic range
  • 22 bit very high resolution mode.
  • Double pulse resolution Typical 5 ns. Guaranteed
    10ns

James L Pinfold
Manchester 2006
6
8
Phase 3 (3)
ALICE Prototype ToF Card
  • Initial idea is to have a small VME slave card
    using 4 HPTDC chips each with 32 channels and
    containing a FPGA
  • The master card is based on its ALICE
    counterpart. At present the ALICE card contains
    an on board clock a FPGA, DSP, 2FIFOs Flash
    memory
  • Lab bench tests and test beam results show that
    a 20 ps resolution has been achieved.

James L Pinfold
Manchester 2006
7
9
Radiation Testing
  • The electronics will be mounted in an area with
    moderately high radiation levels 15? 100
    Gry/year
  • The HPTDC chip has been reported to be radiation
    tolerant to the 30 krad total dose level (300
    Gry) (http//www.nikhef.nl/toms/lhcb/otfe/lhcb-20
    01-13.pdf)
  • At present it seems wise to design rad hard
    electronics for the FP420 region, rather than
    rely on shielding
  • Obviously a program of radiation testing will be
    required

James L Pinfold
Manchester 2006
8
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