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VEI Meeting Stuttgart

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T1/T2 and T3/T4 are packaged together. Switch consists of 4 pairs ... Status LEDs for current direction and fault indication. AIEG. Physical Technology Center ... – PowerPoint PPT presentation

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Title: VEI Meeting Stuttgart


1
VEI Meeting - Stuttgart 9/22/99
2
Smart Post Bread Board
12v
36v
T1/T2
T3/T4
3
Basic construction
  • T1/T2 and T3/T4 are packaged together
  • Switch consists of 4 pairs of 9 m? 70V FETs
  • Vias on FR4 board provide thermal path for FETs
  • Copper lugs serve as electrical connection as
    well as heat sink

4
Smart Post Inputs
  • Alternator status
  • Ignition status
  • Park status
  • Post voltage
  • Post current

5
Smart Post Outputs
  • Direction of current flow through DC/DC converter
  • DC/DC converter on/off
  • Note These are both open collector outputs.
    Once the form of the control required to direct
    operation of the DC/DC converter is defined,
    these outputs can be modified.

6
Additional I/O capability
  • 12V and 36V battery temperature
  • Power feed for battery temperature sensors
  • 12V auxiliary power output
  • Ground output
  • Status LEDs for current direction and fault
    indication

7
Software Development Strategy
  • Utilizes rapid control strategy prototyping tools
  • State models are graphically input to the PC
  • Program generates code, which is downloaded to
    central control module
  • Smart post microprocessor acts as drone to
    central control module

8
Routinized Control Strategy Development
  • Create control strategies with graphical modeling
    tools

9
Advantages to Software Strategy
  • Allows software and hardware debugging to be
    de-coupled
  • Allows real time modifications to code via
    manipulation of state model
  • Modules are vehicle worthy, allowing multiple
    iterations of code to be tested

10
Central Controller Module
11
Smart Post Bread Board Thermal Analysis
Room Temperature Results Rise over ambient
20.0 C P 0.5 watt
12
Smart Post Bread Board Thermal Analysis
Elevated Temperature _at_ 105C Rise over
ambient 30 C P 1.0 watt TjC max150 C
13
How will production modules differ?
  • Optimal thermal performance requires bare die
    construction
  • Production FETs will need to be about 1 m?
  • Interconnects will need to add about 1 m?
  • T3/T4 should be packaged in the DC/DC converter.
  • Production location of T1/T2 not defined
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