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SFI-4.1

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16 lanes. 50 gigabits per sec. OC-768 with. 25% overspeed. SFI-5 ... Uses 16 lanes at 622 Mbps or faster. SPI-4.1. System Physical Interface Level 4 (SPI-4) Phase 1: ... – PowerPoint PPT presentation

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Title: SFI-4.1


1
SFI-4.1
  • Brian Von Herzen, Ph.D.
  • Xilinx Consultant, www.FPGA.com

2
OIF Electrical Interfaces
  • What are the OIF Electrical Interfaces?
  • SPI-5
  • SFI-5
  • SPI-4.2
  • SPI-4.1
  • SFI-4
  • SPI-3

3
SFI-4
  • SFI-4 (OC-192 SERDES-Framer Interface)
    OIF-PLL-02.0 Proposal for a common electrical
    interface between SONET framer and
    serializer/deserializer parts for OC-192
    interfaces)

4
System Packet Interface Level 5 (SPI-5) OC-768
System Interface forPhysical and Link Layer
Devices
  • SPI-5 connects Physical to Link Layer Devices
  • Fabric interface chips (FIC)
  • Traffic managers
  • Network processing element (NPEs)

5
SPI-5 Signals
  • The SPI-5 interface uses clock forwarding between
  • PHY
  • Link Layer Devices
  • Up to 3.125 Gbps
  • 16 lanes
  • 50 gigabits per sec
  • OC-768 with
  • 25 overspeed

6
SFI-5
  • SERDES Framer Interface Level 5 (SFI-5)
    Implementation Agreement for 40Gb/s
  • Interface for Physical Layer Devices

7
SPI-4.2
  • System Packet Interface Level 4 (SPI-4) Phase 2
    OC-192 System Interface for Physical and Link
    Layer Devices

8
SPI-4.2 Interface for Physical and Link Layer
Devices
  • Uses 16 lanes at 622 Mbps or faster

9
SPI-4.1
  • System Physical Interface Level 4 (SPI-4) Phase
    1
  • A System Interface for Interconnection Between
  • Physical and Link Layer,
  • Peer-to-Peer Entities Operating at 10 Gbps
    (OC-192).
  • 64 Data Signals at
  • 200 MHz

10
SPI-3
  • System Packet Interface Level 3 (SPI-3) OC-48
    System Interface for Physical and Link Layer
    Devices

11
OIF Electrical Standards Benefits
  • Enables Best-In-Class selection of devices that
    interoperate
  • SERDES
  • FEC
  • Framers
  • Traffic Management
  • Fabric Interfaces
  • System vendors can choose their favorite feature
    sets and mix and match components as needed

12
OIF Electrical Standards Benefits (continued)
  • With interoperable standards, vendors can
  • Mix and Match best of breed components
  • Minimize the engineering to connect components
  • Reduce time to market
  • Enable customization using programmable logic for
    key components

13
System Design Example
  • A systems vendor wanting to build an OC-768
    switch with OIF standards can select
  • A customized traffic manager from FPGA Vendor X
  • A framer from ASSP vendor Y
  • A SERDES module from Optical Vendor Z

FPGA Vendor X
Optical Vendor Z
ASSP Vendor Y
14
OIF Electrical Standards Silicon Solutions
  • A variety of Silicon implementation solutions are
    available, including
  • ASSP FPGA
  • ASIC
  • System vendors do not get locked in to a
    proprietary solution
  • OIF-compliant chips interoperate effectively to
    enable best of breed system solutions
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