Mutualtek Technology Index

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Mutualtek Technology Index

• Roger Chang
• 2007,4,14 summary
• URL http//www.arrk.co.th
• URLhttp//www.mutualtek.com.tw

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Index of mutualteks technology

• 1. Wire bonding PCB (COB)
• 2. Thermo , Current power Enhance PCB
• 3. Bending function PCB
• 4. Substrate PCB
• 5. Cavity Substrate PCB
• 6. Embedded passive or organic capacity
  /resistance PCB
• 7. Hybrid PCB

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New Technology develop

• New Technology develop on 2008
• 1. Wafer level package US Patent No
  7,273,768B2
• 2. Transfer embedded PCB Technology
• US Patent 7,297,285 B2
• 3. Method of manufacture a combined multilayer
  circuit
• have embedded chips
• US patent No
• 4. Molded circuit board and method for the same
• US Patent No
• 5. Semi Bending FR4 material develop with NAYA

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1. Wire Bonding PCB

• Al , Au wire bonding surface finished support
• ENIG soft gold 4-20uinch , ENPIG , Plating Soft
  gold 4-80uinch.
• Production on Rigid , Rigid- Flex , Cavity ,
  PCBs design

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Wire Bonding PCB
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2. Thermo , Current power Enhance PCB

• Production on IMS , Heavy copper , heat-sink
  attached and RF ground attached PCBs design

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3.Bending function PCB

• Production on Flex , Multi-Flex , Rigid-Flex ,
  Simi Flex PCBs design

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4. Substrate PCB

• Production on HDI copper filled stack hole ,
  cap plating technology with high Tg , RoHs ,
  Halogen Free material of MCM wire bonding PCBs
  design

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Substrate PCB
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5.Cavity Substrate PCB

• Production on Camera , CCD , CMOS of chip package
  PCBs design

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6.embedded capacity /resistance PCB

• Production on FR4 /3M c-play / Oh-mega ply PCBS
  design

Ohmega-Ply Embeded Resistor
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7.Embedded passive conponent on PCB X- Ray
picture
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8. Hybrid PCB RF application

• Production on Low Dk and High Dk mix combine
  together PCBs design

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New Technology develop in house

• 1.Wafer Level package for low pin count chip of
  Mutual-Pak (MutualTek subsidiary company)who had
  worked with TSMC Taiwan.
• Application on RFID , low density output /input
  chip

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Wafer Bump (Printer) TechnologyUS patent
7,273,768 B2
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New Technology develop in houseUS patent No
7,297,285 B2

• 2. Transfer embedded technology , Interposer
  technology , had patent in Taiwan , China , USA .

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New Technology develop in house

• 3. Semi Flex , FR4 resin material develop , had
  production on 2007 of Camera parts .

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Semi-Flex Technology

• Semi-Flex after Assembly