China RoHS Compliant Solutions from Xilinx

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China RoHS Compliant Solutions from Xilinx
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China RoHS

• China RoHS China promulgated the Management
  Methods for the Control of Pollution from
  Electronic Information Products in early 2006
• This law requires companies to identify and
  verify the concentration of hazardous
  substances in electronic information products
  sold within China
• Hazardous substances are defined as the six EU
  RoHS substances (lead, mercury, hexavalent
  chromium, cadmium, PBBE and PBDE)
• Phase 1 governs identification of hazardous
  substances
• Effective March 1, 2007
• Phase 2 governs verification of hazardous
  substances
• No date has been set as of early 2007 for Phase 2

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China RoHS Phase 1

• Applicability to Xilinx
• Based on definitions and the scope of China RoHS,
  all Xilinx integrated circuits (i.e., FPGA, CPLD,
  etc.) are electronic information products and
  will be affected beginning March 1, 2007

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China RoHS Phase 1

• Product Marking Article 4 of the Marking
  Standard SJ/T11364-2006 states
• With respect to the electronic information
  products that are purchased for manufacturing.
  Suppliers need not provide the aforementioned
  marking, but shall supply to the purchaser all
  necessary information required for marking.
• As such, Xilinx components will NOT be marked

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Disclosure

• Information Disclosure Detailed material
  declarations are currently available online
• http//www.xilinx.com/system_resources/lead_free/i
  ndex.htm

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Xilinx Components

• Disclosure Tables Xilinx has also developed
  China RoHS compliant disclosure tables for
  electronic information products that have lead
  above the maximum concentration limits
  established in SJ/T11365-2006
• At Xilinx, this only applies to
• Standard Integrated Circuits
• BGA Flip Chips that are EU Compliant by Exemption
  (Package Codes FFG and BFG)
• Additional information is available upon request
  at spec_control_at_xilinx.com