Backplane and Mechanical Challenges for VPX

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Backplane and Mechanical Challenges for VPX
Justin Moll Director of Marketing, Elma Bustronic
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Topics
Mechanical Overview Challenges VPX Chassis
Cooling Power VPX Backplane Design Testing
VPX
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VPX Design Challenges

• Challenges
• Higher power switch cards (VPX can be up to 768 W
  per slot!) bring both power and cooling
  challenges.
• Routing requires highly skilled backplane design.
  Layer counts need to be managed.
• High degree of flexibility experience a must
• Power and system management issues.

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Modular System Platforms

• Must balance
• Cooling
• EMC
• Space limitations
• Application requirements acoustic noise,
  power/pluggability/maintenance, shock/vibration,
  IO/cabling, etc.
• How?
• Experience
• Modularity
• Simulation/Testing

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Modular System Platforms
A modular chassis design allows a wide range of
VPX and other backplanes to be used in several
chassis types. This includes 19 rackmount,
portable, desktop, and Rugged COTS/ATR designs.
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Design for Cooling Forced Air

• Forced Air Cooling
• Higher CFM fans
• Air baffles
• More air intake/exhaust
• Caveats
• Must watch static pressure thermal simulation
• Must balance cooling with space constraints, EMC