Repair Centers, from a Bonder

1
Repair Centers, from a Bonders point of view

• Reported by
• Salvatore Costa
• Università di Catania and INFN Sezione di
  Catania

2
General remarks
At the Bonding WG Meeting of 08 June 2004 we
discussed the criteria to send a Module to the
new official Repair Centers, from a Bonders
point of view.

• General remarks
• We perceive these centers more as debug places
  where teams of dedicated people study in deeper
  detail Modules with non-trivial problems, so that
  normal production can continue at the usual rate.
• Strictly speaking, trivial mechanical Module
  bonding failures should not be matter for these
  Centers a) there is nothing to study b) bonding
  centers (operators) are either able to repair
  them right away or, if they cant, then most
  likely the debug centers cant either.
• To repair damage to APV-PA bonds (typically
  caused by handling accidents), we would like the
  official procedure to be sending Module back to
  the Hyb bonding place.
• For all other cases, which means a variety of
  electrical misbehaviors that may or may not be
  related to bonding problems, report the problem
  and let the experts at the Center decide if
  they think they want to study that Module
  following the report procedure that will be
  decided here.
• Criteria in detail
• Based on type of failure, see next slide ?

3
Criteria in detail

• Trivial bond failure detected during bonding or
  at post-bonding inspection
• Wire wont stick
• Bond pops up (lift off)
• Foot is misplaced and causes a short somewhere
• We repair these right away as usual if we can
  and/or list as unbonded the strips that are such
  as a result of the failure or of the repair
  action.
• Trivial (bond) failure detected during
  post-bonding ARCS or LT tests
• Pinhole (caused by bonding/handling accident or
  pre-existing and either undetected in Sensor test
  or on untested Sensor)
• Short (caused by bonding/handling accident or by
  misplaced foot)
• Open (bond popped up)
• Same action.
• Non-trivial electric failure detected with ARCS
  at any (?) stage (pre-bonding, post-bias-pre-reado
  ut-bonding, post-bonding or LT tests which dos
  not exhibit a clear link to bonding
• Increased LV current
• Anomalous IV
• We post the problem for the debug Center to
  consider they ask for the module at their
  discretion.
• Non-trivial electric failure detected during
  post-bonding ARCS or LT tests, which might be
  traced back to a bonding failure
• Example pseudo-pinhole At post-bonding ARCS
  test, a PHL- (likely pinhole) is found. We pull
  the readout bond as prescribed for pinholes but
  the test keeps saying PHL-, so the Hyb ch is
  damaged. Since it was OK at ARCS test on arrival
  perhaps we killed it with bonding (seen in some
  TIB centers).