Title: Digital Integrated Circuits A Design Perspective
1Digital Integrated CircuitsA Design Perspective
Jan M. Rabaey Anantha Chandrakasan Borivoje
Nikolic
The Devices
July 30, 2002
2Goal of this chapter
- Present intuitive understanding of device
operation - Introduction of basic device equations
- Introduction of models for manual analysis
- Introduction of models for SPICE simulation
- Analysis of secondary and deep-sub-micron effects
- Future trends
3The Diode
Mostly occurring as parasitic element in Digital
ICs
4Depletion Region
5Diode Current
6Forward Bias
Typically avoided in Digital ICs
7Reverse Bias
The Dominant Operation Mode
8Models for Manual Analysis
9Junction Capacitance
10What is a Transistor?
11The MOS Transistor
Polysilicon
Aluminum
12MOS Transistors -Types and Symbols
D
D
G
G
S
S
Depletion
NMOS
Enhancement
NMOS
D
D
G
G
B
S
S
NMOS with
PMOS
Enhancement
Bulk Contact
13Threshold Voltage Concept
14The Threshold Voltage
15The Body Effect
16Transistor in Linear
17Transistor in Saturation
18A model for manual analysis
19Current-Voltage RelationsA good ol transistor
20Process Data
21Current-Voltage RelationsThe Deep-Submicron Era
22Velocity Saturation
Constant velocity
Constant mobility (slope µ)
23Velocity Saturation (Computation)
24Perspective
I
D
Long-channel device
V
V
GS
DD
Short-channel device
V
V
V
- V
DSAT
DS
GS
T
25ID versus VDS
Long Channel
Short Channel
26A unified modelfor manual analysis
27Transistor Model for Manual Analysis
28The Sub-Micron MOS Transistor
- Threshold Variations
- Subthreshold Conduction
- Parasitic Resistances
29Threshold Variations
Low
V
threshold
Long-channel threshold
DS
VDS
L
Threshold as a function of
Drain-induced barrier lowering
the length (for low
V
)
(for low
L
)
DS
30The MOS Transistor
Polysilicon
Aluminum
31MOSFET Capacitance Model
32MOSFET Gate Capacitance
33MOSFET DB and SB Capacitance
34Junction Capacitance
35More Process Data
36Problems (2)
37Problems (3)
38Problems (8)
39Problems (17)
40Latch-up