Simulation of Particle Incoporation during Electrocodepostion Process

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Simulation of Particle Incoporation during
Electrocodepostion Process

• David Allen Wong, Dr. Jan Talbot, and Dr. David
  Abramson
• University of California, San Diego and Monash
  University
• August 4, 2008-August 15, 2008

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Background Proposal

• Electrocodeposition is the process in which
  nanoparticles are adsorbed and plated into a
  metal film
• The growth of an electrodeposited film along the
  electrode is controlled by the local current
  density affected by the presence of an insulating
  particle during electrocodeposition
• The objective of this research is to simulate the
  incorporation of a particle by the growing metal
  film for primary, secondary, and tertiary current
  distributions.

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Progress

• Understood basics of finite element method and
  level set method
• Created Geometry and Mesh for Electrocodeposition
  Simulation
• Successfully entered equations into level set
  method module

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COMSOL Screenshoots of the drawn geometry and
level set method
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COMSOL Screenshot of level set method and arrow
plot at time0
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Future Work

• Summarize work to date into poster, Powerpoint
  presentation, and research paper
• Try fixing simulation by editing and changing
  boundary conditions
• Wrap up with saving all necessary files and
  simulations to bring back to UCSD for future work

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Adventures in Australia! _
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Olympics as seen in Australias Newspaper
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CHEERS!