Simulation of Particle Incoporation during Electrocodepostion Process

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Simulation of Particle Incoporation during
Electrocodepostion Process

• David Allen Wong, Dr. Jan Talbot, and Dr. David
  Abramson
• University of California, San Diego and Monash
  University
• June 25, 2008- July 4, 2008

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Background Proposal

• Electrocodeposition is the process in which
  nanoparticles are absorbed and plated into a
  metal film
• The growth of an electrodeposited film along the
  electrode is controlled by the local current
  density affected by the presence of an insulating
  particle during electrocodeposition
• The objective of this research is to simulate the
  incorporation of a particle by the growing metal
  film for primary, secondary, and tertiary current
  distributions.

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Progress

• Met with Dr. Malin Premaratne to discuss basis of
  COMSOL and project
• Installed COMSOL Version 3.3 onto labtop from
  Clayton campus
• Reviewed past research done by Jaesung Lee and
  Dr. Talbot
• Started organizing equations for primary,
  secondary, and tertiary current distributions

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Future Work

• Work through Introduction to Multphysics
  Minicourse
• Study basis of COMSOL (i.e. finite-element method
  and level set method)
• Determine which module to use in COMSOL and begin
  designing simulation

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Adventures in Australia! _
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CHEERS!