AP210 converters and applications

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AP210 converters and applications

• Giedrius Liutkus, LKSoft

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AP210 Overview
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AP210 Domain (Electronic Assembly Interconnect
and Packaging design)
Printed Circuit Assemblies
Packaged Part
Product Enclosure
Package
Die
Die
Interconnect Substrate
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AP210 Progress 1/2

• Published as IS in 2001.
• Minor revision is going to be published this
  year.
• JWG9 under TC184/SC4 is leading the development.
• They were driven by converters and real usage of
  AP210 IS.
• Common agreement achieved on what should be in
  TC1 and what is out of scope.

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Changed in AP210 since IS

• Added AIC 521
• More specific product definitions added
  (footprint, land pattern, template definition,
  stratum ...)
• Restructuring hierarchy trees of assembly
  component, component feature (separating physical
  and laminate types)
• Editorial, semantic and syntax changes (mainly in
  mapping)

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AP210 training class

• It was organized in PDES Inc. March, 2002.
• Recording of presentations was performed.
• The full overview of AP210 provided in 3 days
  sessions.
• Some real examples analyzed.

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Available Tools

• Boeing AP210 (3D) viewer.
• LKSoft AP210-Book.
• GeorgiaTech tools (XaiTools, stackup editor)
• Converters
• IDF
• CircuitCAM (Gerber, ODB , )
• Eagle
• VHDL (early prototype).
• Connectivity checker.
• Mentor (according DIS)

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Boeing AP210 viewer
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STEP-Book

• It uses JSDAI and standard schemas for meta
  information (like AP203, AP210 etc.).
• It allows to import part21 file or open existing
  repository and automatically start STEP-Book for
  particular AP.
• Currently it is mainly VIEWER.
• It supports basic editing functionality and
  intent is to improve to the EDITOR.

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AP210Book 1/2

• PDM
• PCB, PCA views (both Usage and Design)
• Functional views
• Parts, Packages
• Functional and physical networks, connectivity
• Templates, components, features
• Technologies (passage, stratum, manufacturing)

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AP210-Book 2/2

• Material characteristics
• 2D and 3D geometry (relationship between 2D and
  3D designs)
• Passages (plated, unplated, blind etc.)
• Rules, requirements
• Analytical models
• Export PCB data to the GERBER format

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AP210Book future plans

• Use server-client architecture.
• Thin book.
• Using SVG.
• Use VRML for 3D
• Interaction between various APs (AP203, AP214,
  AP209, AP233, AP220).

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Step-Book technique 1/2

• The way AP data should be displayed is stored in
  XML.
• Semantics for XML is defined in few DTDs.
• XML is parsed and GUI is generated automatically.
  
• External plug-ins can be easily attached.
• XML can be changed even during runtime !

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STEP-Book Technique 2/2
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STEP-Book Technique 2/2
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Combining 2D and 3D 1/2

• 1st scenario Take full 3D model of some physical
  unit (e.g. package, PCB, PCA) from AP203/214 and
  paste into existing model of AP210 which holds
  e.g. 2D layout information.
• 2nd scenario identify shape aspects (terminals,
  orientation features etc.) from 3D model and made
  links to features in AP210.

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Combining 2D and 3D 2/2

• 3rd scenario Take 3D shape for other purposes
  than design from other sources (e.g. thermal,
  vibration analysis)

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AP210 Converters
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EAGLE lt-gt AP210 1/3

• Eagle is a powerful and robust low cost system
  (shareware version available too).
• Eagle is developed by CadSoft Computer GmbH.
• Converter is developed using JSDAI API.
• 3 000 worldwide users.
• Free web service is established for conversion.

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EAGLE lt-gt AP210 2/3

• Combined PCB and PCA information.
• Functional networks, thermal reliefs, constraint
  areas.
• Includes connectivity converter, which assures
  the integrity of all the connectivity
  information.
• Multi-layer stack-ups (stratums).
• Delivers some added value (data enhancement).

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EAGLE lt-gt AP210 3/3
EAGLE
AP210 (PCB)
AP210 (PCA)
Gerber
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VHDL lt-gt AP210 (prototype) 1/2

• Structural description of the design (netlist or
  schematic).
• Bus, array ports.
• Behavioral (stimulus, simulation etc.) paradigm
  is out of scope for converter.

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VHDL lt-gt AP210 (prototype) 2/2
ENTITY simple IS PORT (a,b,c,dIN BIT g OUT
BIT) ENDsimple ARCHITECTURE structural OF
simple IS COMPONENT nand_gate PORT (a,b IN
BIT y OUT BIT) END COMPONENT SIGNAL e,f
BIT BEGIN g1nand_gate PORT MAP(a,b,e) g2nand_g
ate PORT MAP(c,d,f) g3nand_gate PORT
MAP(e,f,g) ENDstructural
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Future converters

• Zuken Visula lt-gt AP210
• Mentor PCB lt-gt AP210

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Lessons from converters 1/2

• AP210 in most cases is much richer than any
  proprietary format.
• Data enhancement is needed.
• In the areas AP210 is weaker (by purpose) it is
  possible to use external references.
• It is essential to orient implementation of
  converters towards ARM.
• Library conversion is problematic.

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Lessons from converters 2/2

• AP210 should be treated as central database
  format.
• Naming convention is slightly different in
  different formats.
• Most of formats in ECAD area are graphic
  oriented.

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Layout connectivity

• AP210 converters and applications

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Requirements in PCA
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Physical_connectivity_definition
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Requirements PCA-gtPCB

• Requirements from PCA are usually delegated to
  be implemented in PCB layout.
• But it could also be implemented directly in PCA
  (e.g. routed component)

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PCB Usage view
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Part_connected_terminals_definition
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Implementation PCB UV -gt PCB DV

• Requirements specified in PCB usage_view (by
  part_connected_terminal_definition) are
  implemented in PCB design_view (by
  Physical_network).

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PCB Design_view
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Physical_network
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Join_relationship
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Layer_connection_point
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Join_relationship-gtStratum_feature
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Stratum_feature