Listing 823.

1

• Listing 823.
• GPON/EPON the next generation of broadband
  optoelectronics system on a chip

2
GPON on a Chip

• GPON/EPON the next generation of broadband
  optoelectronics system on a chip
• Optical networking.
• Use of proven semiconductor fabrication
  technology to build a low cost, integrated
  electrical and optical system on the same IC chip
  (GPON).

3
Market

• Primary market is manufacturing of electrical
  and/or optical network communication components.
• This is a global opportunity as high-speed
  networks are being installed all over the world.

4
Market Growth

• Significant global growth for the PON technology
  is predicted in the next five years.
• Worldwide market for GPON electronics -- optical
  network terminals (ONTs) and optical line
  terminals (OLTs) -- will be worth 4.7 billion in
  2011, up from about 1.3 billion this year.

5
Major players

• Verizon
• Ericsson AB
• Alcatel-Lucent
• France Telecom
• Nokia Siemens Networks
• Cisco
• Intel
• PacketFront

6
Problem Solved by the Technology

• Integration between optical and electronics-based
  systems by using a single device.
• Today the connectivity is made through specially
  made couplers and components that have relatively
  higher losses, more expensive to manufacture, and
  are less reliable.

7
How the Technology Solves the Problem

• A proven semiconductor manufacturing processes
  and methodologies, which are very precise,
  reliable, and at a lowest cost of manufacturing.

8
Technology Deployment

• Delivered to the manufactures via systems and
  processes used by semiconductor manufacturing
  companies.
• The products will be sold to the network content
  providers.

9
Competitive Advantage

• Significant cost savings.
• Lower cost resulting from fewer components.

10
Development Platform

• Manufactured with semiconductor processing tools.

11
Development Status

• Near prototype stage.  
• Optical coupler is ready for production,
  detectors and filters are off the shelf, the
  laser diode needs to be reconfigured, gratings on
  the silicon substrate need optimization.

12
Intellectual Property Ownership

• The I.P. belongs to the seller, a large U.S.
  semiconductor manufacturing materials company.
• There are no known liens or encumbrances.

13
Patent Status

• U.S. Patents Pending
• 1. Patterning 3-D Features in a Substrate. 2.
  Optical Coupling to IC Chip.
• 3. Multiplexed Optical Sub-Assembly.
• 4. Wafer Level Alignment of Optical Elements.
• Patent information provided upon request.  

14
Productization

• The existing development team is in Silicon
  Valley, USA.
• Some engineering resources would be required to
  complete the development.
• The team and know-how are available from the U.S.

15
Deal Structure Sought

• The deal structure envisaged is the sale of this
  technology asset.
• Acquisition in 3 parts
• Initial acquisition.
• Payment triggered when patents are issued.
• Royalties on product sales
• 3-5 Royalties

16
Frequently Asked Questions And Answers

• Why is the developer of this technology listing
  this technology?
• Although the developer is a Fortune 500 company,
  it supplies semiconductor manufacturers and does
  not have existing channels to bring this product
  to market.

17
Follow Up

• Please refer to Tynax listing number 823 with
  regard to this opportunity.
• Inquiries should be directed to
• Moshe Sarfaty
• moshe.sarfaty_at_tynax.com

18

• Thank You