L0 Electronics Installation

1
L0 Electronics Installation

• System Electronics Overview
• Low Voltage
• Filter design
• High Voltage
• RTD-Carbon Fiber Temperature Monitoring
• Filter design
• Readout
• Prep Work Summary

2
System Electronics

• The L0 Upgrade electronics consist of 4 systems.
• Isolated Low Voltage Power Supply
• Wiener PS-Filter-Fuse Panel-PS Interlock-CAN bus
  interface
• High Voltage Power Supply
• HV crate-Fanout Chassis (2 units)
• RTD Temperature Monitoring
• RTD-Flex-Filter-32AWG-26AWG-Controller
• Readout
• Junction Card-Twisted pair cable-Adapter Card

3
Isolated Low Voltage System
4
Components installed
5
LV Power Supply Filter

• Sigma10 noise 5-7 ADC counts.
• 5 turns on ferrite core of power cable reduced
  noise to 3-3.5 cts.
• Filter design in progress-need to shield from
  magnetic field.
• Shielding box (filter) will be mounted under fuse
  panel in cathedral area.

counts
channel
counts
channel
6
Filter plans

• Design prototype to test at SiDet
• 2 quadrants per chassis

7
LV PS work remaining

• Prep work remaining
• Design and test filter
• Operating parameters in EPICS database
• Test CAN bus interface via GUI in Control Room
• Work remaining in Collision Hall (3 days)
• Install filter in cathedral
• Cable Plant
• 12 twisted pair 10AWG cables
• fuse panel? filter
• filter?gauge change panels on horseshoe
• 12 twisted pair 22AWG cables
• gauge change panels ? AC.

8
High Voltage System

• 1st crate (L0) with 48 pods and power supply
  tested and installed in the 100 test stand at
  SiDet.
• Pods modified to accommodate lower current.
• 2nd 48 pod crate (SMT) load tested and ready for
  installation.
• Prep work
• Order HV cables.
• Work remaining in MCH (2-3 days)
• Install 2 HV crates-1st from SiDet, 2nd in house.
• Install 2 Fanout chassis.
• Install 48 SHV cables from pods to Fanout
  chassis.
• Remapping of Inner H-disk channels.
• Redistribute fanout for additional 48 channels.
• Work remaining in Collision Hall
• None

9
RTD system

• Monitors carbon fiber structure temperature.
• Testing at SiDet has uncovered noise coupling
  into the readout from RTD flex circuits.
• 32 AWG cable shielding tied to isolated ground at
  AC removed noise.

Hirose
36 conductor
36 conductor
x8
8
1
10
Filter SPICE Model
Controller
Controller
FILTER
RTD
11
Filter Response

• Model illustrates gt60dB attenuation.
• Rs need to be tweaked to accommidate Controller
  capability.
• Studies underway to determine maximum lead R.
• Ready to layout prototype board.

40mV
-60dB -74dB
5mV
1KHz
12
RTD System

• Prep work
• Design, test, and manufacture filter
  card-shielding scheme.
• How much lead resistance can Controller tolerate?
• Latest studies show the Controller can handle 3K
  Ohm per lead. Channel variations are linear and
  can be calibrated out as was done with the
  current SMT.
• Will just a filter work, a cable shield, or a
  combination of both?
• FilterCs need a connection to detector ground in
  the vicinity of the junction card ring. Not clear
  how this connection will be made.(Perhaps
  34?26AWG card is easier place to put filter.)
• ShieldRequires a connection to L0 isolated
  ground. This can be done at the horseshoe but
  need to be careful..returns are quadrant specific
  due to LV distribution scheme. Leads to another
  issue34?26AWG boards. Current design has one per
  end. Will probably have to go to two due to
  location of isolated gnd connection points.This
  translates into installing 2 cables from the gap
  to Controller electronics.

13
RTD System

• Work remaining in Collision Hall
• Connect RTD flex circuits to filter cards
  (Hirose).
• Install 2 (probably 4) 32?26 AWG boards on
  horseshoe.
• Connect 32 AWG cables.
• Install Controller cable from horseshoe to
  Controller rack on platform.

14
Readout-Junction Card
Junction Card and Twisted pair cable 6 per ring
12 per end
Junction Card Mounting Ring 2 rings per end
15
Readout-Junction Card

• Work in Collision Hall
• Connect digital jumper cable from detector to
  Junction card.
• Mount junction card.
• Test channel, complete first tier ring of 6 on
  each end.
• Install second tier mounting ring.
• Mount remaining 6 junction cards, test.

16
Readout-Adapter Card

• Work in Collision Hall
• Remove 24 old ACs and standoffs.
• Install 12 new ACs and mounts 3 per quadrant.
• Route 48 twisted pair cables from junction cards
  to ACs.
• Connect cables twisted pair (4/cd), power(4/cd),
  clock (16/cd), 80 conductor (2/cd).
• Test L0 DAQ channel (2/card).

Adapter Card Installed on Horseshoe
17
Horseshoe Positions

• Positions for the temperature monitoring gauge
  change panels, LV gauge change panels, and
  Adapter Cards were determined based on the
  existing DAQ cable map.
• Every effort has been made to minimize the number
  of cable moves required to integrate L0 into the
  current system.
• Since the Outer and Inner H-disk low mass cables
  are combined on one old AC, it is necessary to
  move half of the Inner H-disk low mass cables
  (48). The open channels will be used for L0.

18
RTD board position dependant on filter design
Sector 1 Low Mass Moves Open Positions for
Sector 1 44B2 to 35C1 44,
45, 46, 52 45C2 to 36B1 46C2
to 36C1 52C2 to 43C1 Sector 2 Low Mass
Moves Open Positions for Sector 2 29B2
to 22C1 29, 30, 31,
37 30C2 to 23B1 31C2 to 23C1
37C2 to 28C1 Sector 6 Low Mass
Moves Open Positions for Sector 6 57C2
to 50C1 57, 58, 59,
65 58C2 to 51B1 59C2 to 51C1
65C2 to 56C1
NorthEast S1 45,46 S2 30,31 S6 57,58
LV AWG D
AC
19
AC
LV AWG D
Sector 3 Low Mass Moves Open Positions for
Sector 3 16C2 to 09C1 16,
17, 18, 24 17C2 to 10B1
18C2 to 10C1 L0 Prototype
in 16, 17 24C2 to 15C1 Sector 4 Low
Mass Moves Open Positions for Sector 4
02C2 to 11C1 02,
03, 04, 05 03C2 to 76C1
04C2 to 77B1
05B2 to 77C1 Sector 5
Low Mass Moves Open Positions for Sector 5
70C2 to 63C1 70,
71, 72, 78 71C2 to 64B1 72C2
to 64C1
78C2 to 69C1
NorthWest S3 16,17 S4 02,03 S5 70,71
20
Sector 3 Low Mass Moves Open Positions for
Sector 3 36C2 to 28C1 36,
37, 38, 46 37C2 to 29C1 38C2
to 30C1 46C2 to 35C1 Sector 4 Low Mass
Moves Open Positions for Sector 4 51C2
to 43C1 51, 52, 53,
59 52C2 to 44C1 53C2 to 45C1
59C2 to 50C1 Sector 5 Low Mass
Moves Open Positions for Sector 5 64C2
to 56C1 64, 65,
66, 72 65C2 to 57C1 66C2 to
58C1 72C2 to 63C1
SouthWest S3 36,37 S4 51,52 S5 64,65
AC
LV AWG D
21
LV AWG D
AC
Sector 1 Low Mass Moves Open Positions for
Sector 1 10C2 to 02C1 10,
11, 12, 18 11C2 to 03C1 12C2
to 04C1 18C2 to 09C1 Sector 2 Low Mass
Moves Open Positions for Sector 2 23C2
to 15C1 23, 24, 25,
31 24C2 to 16C1 25C2 to 17C1
31C2 to 22C1 Sector 6 Low Mass
Moves Open Positions for Sector 6 76C2
to 05C1 76, 77,
78, 79 77C2 to 69C1 78C2 to
70C1 79C2 to 71C1
SouthEast S1 10,11 S2 23,24 S6 76,77
22
SE_1 Mapping
IB
Sequencer
VRB
23
SEQ fibers

• Layer Zero utilizes VRB slots previously used by
  H-disks.
• H-disks were not used in the STT trigger.
• To integrate Layer Zero into the trigger, SEQ
  fibers need to be moved from the associated VRB
  crates to the splitters mounted on the wall in
  MCH2.
• Work in MCH2
• Reroute 2 fibers/VRB crate (24 total) to
  splitter.
• Install 2 fibers/splitter to VRB crates.

24
Prep Work Summary

• LV system
• Design and test filter.
• HV system
• Install 1 crate, order SHV cable.
• RTD system
• Design and test filter-shield.
• Readout
• SEQ-splitter fiber plant.