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Diffusion

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Random walk of an ensemble of particles from regions of high concentration to ... of HNO3 for silicon) that stains the p-type region darker than the n-type region, ... – PowerPoint PPT presentation

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Title: Diffusion


1
Diffusion 1
  • ECE/ChE 4752 Microelectronics Processing
    Laboratory

Gary S. May January 29, 2004
2
Outline
  • Introduction
  • Apparatus Chemistry
  • Ficks Law
  • Profiles
  • Characterization

3
Definition
  • Random walk of an ensemble of particles from
    regions of high concentration to regions of lower
    concentration
  • In general, used to introduce dopants in
    controlled amounts into semiconductors
  • Typical applications
  • Form diffused resistors
  • Form sources/drains in MOS devices
  • Form bases/emitters in bipolar transistors

4
Basic Process
  • Source material transported to surface by inert
    carrier
  • Decomposes and reacts with the surface
  • Dopant atoms deposited, dissolve in Si, begin to
    diffuse

5
Outline
  • Introduction
  • Apparatus Chemistry
  • Ficks Law
  • Profiles
  • Characterization

6
Schematic
7
Dopant Sources
  • Inert carrier gas N2
  • Dopant gases
  • P-type diborane (B2H6)
  • N-Type arsine (AsH3), phosphine (PH3)
  • Other sources
  • Solid BN, As2O3, P2O5
  • Liquid BBr3, AsCl3, POCl3

8
Solid Source
Example reaction 2As2O3 3Si ? 4As
3SiO2 (forms an oxide layer on the surface)
9
Liquid Source
  • Carrier bubbled through liquid transported as
    vapor to surface
  • Common practice saturate carrier with vapor so
    concentration is independent of gas flow
  • gt surface concentration set by temperature of
    bubbler diffusion system
  • Example 4BBr3 3O2 ? 2B2O3 6Br
  • gt preliminary reaction forms B2O3, which is
    deposited on the surface forms a glassy layer

10
Gas Source
  • Examples
  • a) B2H6 3O2 ? B2O3 3H2O (at 300 oC)
  • b) i) 4POCl3 3O2 ? 2P2O5 6Cl2
  • (oxygen is carrier gas that initiates
    preliminary reaction)
  • ii) 2P2O5 5Si ? 4P 5SiO2

11
Outline
  • Introduction
  • Apparatus Chemistry
  • Ficks Law
  • Profiles
  • Characterization

12
Diffusion Mechanisms
  • Vacancy atoms jump from one lattice site to the
    next.
  • Interstitial atoms jump from one interstitial
    site to the next.

13
Vacancy Diffusion
  • Also called substitutional diffusion
  • Must have vacancies available
  • High activation energy (Ea 3 eV ? hard)

14
Interstitial Diffusion
  • Interstitial between lattice sites
  • Ea 0.5 - 1.5 eV ? easier

15
First Law of Diffusion
  • F flux (of dopant atoms passing through a
    unit area/unit time)
  • C dopant concentration/unit volume
  • D diffusion coefficient or diffusivity
  • Dopant atoms diffuse away from a
    high-concentration region toward a
    lower-concentration region.

16
Conservation of Mass
  • 1st Law substituted into the 1-D continuity
    equation under the condition that no materials
    are formed or consumed in the host semiconductor

17
Ficks Law
  • When the concentration of dopant atoms is low,
    diffusion coefficient can be considered to be
    independent of doping concentration.

18
Temperature Effect
  • Diffusivity varies with temperature
  • D0 diffusion coefficient (in cm2/s)
    extrapolated to infinite temperature
  • Ea activation energy in eV

19
Outline
  • Introduction
  • Apparatus Chemistry
  • Ficks Law
  • Profiles
  • Characterization

20
Solving Ficks Law
  • 2nd order differential equation
  • Need one initial condition (in time)
  • Need two boundary conditions (in space)

21
Constant Surface Concentration
  • Infinite source diffusion
  • Initial condition C(x,0) 0
  • Boundary conditions
  • C(0, t) Cs
  • C(8, t) 0
  • Solution

22
Key Parameters
  • Complementary error function
  • Cs surface concentration (solid solubility)

23
Total Dopant
  • Total dopant per unit area
  • Represents area under diffusion profile

24
Example
  • For a boron diffusion in silicon at 1000 C, the
    surface concentration is maintained at 1019 cm3
    and the diffusion time is 1 hour. Find Q(t) and
    the gradient at x 0 and at a location where the
    dopant concentration reaches 1015 cm3.

SOLUTION The diffusion coefficient of boron at
1000 C is about 2 1014 cm2/s, so that the
diffusion length is
25
Example (cont.)
When C 1015 cm3, xj is given by
26
Constant Total Dopant
  • Limited source diffusion
  • Initial condition C(x,0) 0
  • Boundary conditions
  • C(8, t) 0
  • Solution

27
Example
  • Arsenic was pre-deposited by arsine gas, and the
    resulting dopant per unit area was 1014 cm2. How
    long would it take to drive the arsenic in to xj
    1 µm? Assume a background doping of Csub 1015
    cm-3, and a drive-in temperature of 1200 C. For
    As, D0 24 cm2/s and Ea 4.08 eV.

SOLUTION
28
Example (cont.)
  • t log t 10.09t 8350 0
  • The solution to this equation can be determined
    by the cross point of equation
  • y t log t and y 10.09t 8350.
  • Therefore, t 1190 seconds ( 20 minutes).

29
Diffusion Profiles
30
Pre-Deposition
  • Pre-deposition infinite source
  • xj junction depth (where C(x)Csub)

31
Drive-In
  • Drive-in limited source
  • After subsequent heat cycles

32
Multiple Heat Cycles
  • where
    (for n heat cycles)

33
Outline
  • Introduction
  • Apparatus Chemistry
  • Ficks Law
  • Profiles
  • Characterization

34
Junction Depth
  • Can be delineated by cutting a groove and etching
    the surface with a solution (100 cm3 HF and a few
    drops of HNO3 for silicon) that stains the p-type
    region darker than the n-type region, as
    illustrated above.

35
Junction Depth
  • If R0 is the radius of the tool used to form the
    groove, then xj is given by
  • In R0 is much larger than a and b, then

36
4-Point Probe
  • Used to determine resistivity

37
4-Point Probe
  • 1) Known current (I) passed through outer probes
  • 2) Potential (V) developed across inner probes
  • r (V/I)tF
  • where t wafer thickness
  • F correction factor (accounts for probe
    geometry)
  • OR Rs (V/I)F
  • where Rs sheet resistance (W/?)
  • gt r Rst

38
Resistivity
  • where s conductivity (W-1-cm-1)
  • r resistivity (W-cm)
  • mn electron mobility (cm2/V-s)
  • mp hole mobility (cm2/V-s)
  • q electron charge (coul)
  • n electron concentration (cm-3)
  • p hole concentration (cm-3)

39
Resistance
40
Sheet Resistance
  • 1 square above has resistance Rs (W/square)
  • Rs is measured with the 4-point probe
  • Count squares to get L/w
  • Resistance in W Rs(L/w)

41
Sheet Resistance (cont.)
  • Relates xj, mobility (m), and impurity
    distribution C(x)
  • For a given diffusion profile, the average
    resistivity ( Rsxj) is uniquely related to
    Cs and for an assumed diffusion profile.
  • Irvin curves relating Cs and have been
    calculated for simple diffusion profiles.

42
Irvin Curves
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