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Mixed Signal Coupling in Integrated Circuits

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Docent Li-Rong Zheng & Prof. Hannu Tenhunen. Laboratory of Electronics and Computer Systems ... Ground-referenced and power referenced signals. Grounding ... – PowerPoint PPT presentation

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Title: Mixed Signal Coupling in Integrated Circuits


1
Grounding Principles in Mixed-Signal
Board Docent Li-Rong Zheng Prof. Hannu
Tenhunen Laboratory of Electronics and Computer
Systems Royal Institute of Technology
(KTH) SE-164 40 Kista, Sweden (lrzheng_at_imit.kth.se
)
2
Outline
  • Simultaneous switching noise (SSN)
  • Non-ideal return path
  • Ground-referenced and power referenced signals
  • Grounding principles

3
Simultaneous switching noise (SSN)
4
Simultaneous switching noise Component Level
5
Simultaneous Switching Noise Component and Board
level
6
Ground noise generation mechanism
7
CMOS output driver
8
Power Supply Noise and Signal Delay
9
Non-Ideal Return Path
10
Return Path of Signals
11
Signal Traversing a Ground gap
12
Modeling a signal traversing a gap
(in nH)
D in cm
13
Non-ideal Return Path
14
Signal that Change Reference Planes
15
Ground-Referenced and Power Referenced Signals
16
Ground Referenceand/or Power reference
Dual referenced signal reduces the current
through decoupling capacitor
17
Ground Reference or Power Reference
18
Ground Reference or Power Reference
6-9
19
Grounding Principles for Mixed-Signal Systems
20
Noise coupling through common impedance
21
Common earth-return current coupling
22
Single point vs. multipoint ground system
23
Single point ground systems
24
Hybrid ground systems
25
Ground loop
26
Functional ground layout
27
AC vs. DC ground loops
28
Inductance on ground loops (split-plane ground)
  • Ground return cannot image to signal flow path
    and will cause an extra inductance.
  • This inductance will cause switching noise
    voltage on ground (LdI/dt).
  • If other pins share the same ground, crosstalk is
    also introduced.
  • Common mode ground noise will result to common
    mode emission in case of drivers for cables/wires
    are connected to the same ground
  • Resulting current loop can generate differential
    mode emission

29
Inductance on ground loops (daugther cards)
30
Ground loop elimination techniques
31
I/O decoupling and shielding
32
I/O decoupling and shielding
33
Component placement on interconnect substrate
34
Quiet I/O ground
35
Reduction of loop areas
36
Use of image planes to reduce radiated emission
37
Grounding concepts
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