TRAP3 waferMCM production tests

1
TRAP3 wafer/MCM production tests

• Wafer test of TRAP3
• Measure the supply currents (not shown in the
  block diagrams).
• Test the digital part of the chip internally
  through the SCSN interface and pretrigger input.
• Apply stimuli to all ADC inputs (DDS on the block
  diagrams), read back through SCSN the event
  buffers and analyze RMS and ENOB of all ADCs.
• MCM test
• Measure the supply currents, the analog reference
  voltages.
• Apply stimuli to the PASA inputs and to the ADC
  direct inputs.
• Program test pulse in PASA.
• Digitize the PASA additional outputs using
  commercial ADCs at higher sampling rate 40 MHz.
• Digitize the PASA outputs by the trap ADCs,
  analyze the pulse shape, noise RMS (the later can
  be done on chip).
• Analyze the ENOB and RMS for the 3 direct ADC
  inputs.
• Send / receive data through the network links.
• Test the pretrigger and clock outputs.

2
TRAP3 wafer test
FPGA
SPI - serial interface, DDS direct digital
synthesis (fast DAC with built in LUT for sinus)
3
MCM production test
FPGA