Introduction to MEMS

1
Introduction to MEMS

• Special topic course ECE 601
• Offered twice (Spring 2003, Fall 2004)
• Audience 1st and 2nd year graduate students
  starting research work undergraduate students
  (mostly senior) interested in innovative
  research students drawn from Elec. Comp. Eng.,
  Mech. Engr., Biomedical Engr., Physics, etc.
• Prerequisite General engineering background.
  Some knowledge of semiconductor physics and
  microfabrication is helpful.
• Style weekly lectures (150 minutes), design
  projects (3 small ones and one final project with
  class presentation), 3 lab demonstrations, one
  midterm
• References Micromachined Transducers Sourcebook,
  Gregory Kovacs, McGraw-Hill, 1998 Microsystem
  Design, Stephen Senturia, Kluwer Academic
  Publishers, 2000 literature reading.

Hongrui Jiang, ECE, U. Wisconsin - Madison
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Syllabus

• Introduction to MEMS and application.
• Review of basic IC fabrication techniques
• Basic MEMS techniques silicon micromachining -
  bulk and surface
• Other MEMS techniques bonding, sacrificial,
  metal plating, LIGA, DRIE, self assembly,
  liquid-phase polymerization, etc.
• Mechanics of simple MEMS structure cantilever,
  clamp-clamp flexure, folded beams, etc.
• Mechanical sensors and actuators case studies
  accelerometer, piezoresistive pressure sensor,
  etc.
• Thermal and magnetic transducers
• Microfluidics
• Micro power generation fuel cell, thin-film
  micro battery, mechanical to electric energy
  conversion
• Wireless sensing and telemetry techniques
• Surveys on optical MEMS, RF MEMS, BioMEMS,
  packaging, nano-scale technologies

Hongrui Jiang, ECE, U. Wisconsin - Madison