DO Timeline

1
Update on the D0 Run IIb Silicon Upgrade for the
Inner Layer Sensor PRR 8 August 03 George
Ginther University of Rochester On behalf of the
Run IIb Silicon Group
2
Detector Design

• Six layer silicon tracker, divided into two
  radial groups and two barrels
• Inner layers Layers 0 and 1
• 18mm lt R lt 39mm
• Axial readout only
• 50/58 mm readout for L0/L1
• Assembled into one unit
• Mounted on integrated support
• Outer layers Layers 2-5
• 53mm lt R lt 164 mm
• Axial and stereo readout
• 60 mm readout pitch
• Stave support structure
• Employs only single sided silicon
• Three sensor sizes ? L0 (2 chip) L1 (3 chip)
  L2-L5 (5 chip)
• All sensors have intermediate strips

3
Inner Layers

• 12 sided carbon fiber support structures
• Six sensors mounted on each side of the support
  structure

L1 Support Structure Assembly
Layer 0 pre-prototype with co-bonded grounding
flex circuits
4
Readout Schematics

• Layers 1-5 Hybrids mounted directly on silicon
• Layer 0 Hybrids connected to sensors via
  analog cables (to address space and thermal
  constraints)
• SVX4 chips mounted on hybrids employed in SVX2
  readout mode to facilitate reuse of Run IIa
  higher level readout infrastructure

Interface with current DAQ system
5
Inner Layer Sensors

• Layer 1 Sensors
• Prototypes
• 10 prototype Hamamatsu sensors ordered April 2002
  and delivered 21 Sept 2002
• Three sensors irradiated at KSU
• Ordered the remaining 3 prototype L1 sensors that
  Hamamatsu had on the shelf, and these arrived 16
  July 2003
• These sensors are of very high quality
• 144 production sensors installed in final
  assembly
• BOE includes 50 spare sensors --estimates based
  on 120 yen/
• 60.5K NRE and 94.0K for 216 sensors (and 30
  contingency)
• Layer 0 Sensors
• Prototypes
• Only ELMA sensors available
• 144 production sensors installed in final
  assembly
• BOE includes 50 spare sensors
• 54.8K NRE and 59.6K for 216 sensors (and 75
  contingency)

6
Update on Sensors

• Sensor studies completed
• Electrical characteristics of prototype L1
  sensors and test structures
• Irradiation studies reviewed and completed
• Flux normalization verified via foil activation
• Preparation for arrival of production sensors
• Certification of sensor probing sites
• Fermilab
• Kansas State University
• Stony Brook
• Rochester (new probing site currently under
  development)
• Visual and mechanical inspection prep
• Procedures and database setup
• Outer layer sensor order placed
• 130 sensors arrived on 1 August 2003
• QA evaluation in progress

7
Advances in Other Areas

• Second round SVX4 readout chip prototype
  approved, fabricated and currently under test
• Yield appears to be high and chip appears fully
  functional
• Hybrid and module burn-in test stands completed
• Prototype analog cables delivered and tested
• Prototype L0 hybrids delivered and tested
• Grounding scheme on hybrids revised
• Grounding scheme for inner layer support
  structures developed and being prototyped
• Fabrication fixtures prototyped and tested
• Mechanical grade pre-production stave fabricated
• Electrical grade pre-production stave in progress
• Carbon fiber (and autoclave) for stave shells
  ordered
• Bearings placed on z0 prototype bulkhead

8
Silicon Upgrade Status
9
Sensor Production Schedule

• Hamamatsu provided a sensor production schedule
  which includes L0 and L1 sensors
• Delivery of first batch of L2-5 sensors was
  almost on schedule

10
Sensor Delivery

• If delivery of L0 sensors is completed
• after 14 Sept 04, project misses DOE milestone
• by 14 Sept 04 should not cause module production
  slip
• If Hamamatsu L0 sensor production schedule just
  slips with the order date slip, then this order
  should be placed within 3 months to avoid module
  production slip
• Order for L2-L5 sensors took six weeks from PRR
  to release
• And, we have no prototype Hamamatsu L0 sensors,
  and would prefer to get a few asap for studies
• after 16 Sept 04 puts L0 sensors on critical path
• 2 days slack relative to current silicon ready to
  move date
• If delivery of L1 sensors is completed
• after 28 June 04, project misses DOE milestone
• by 24 June 04 should not cause module production
  slip
• If Hamamatsu L1 sensor production schedule just
  slips with order date slip, then this order
  should be placed within a month to avoid module
  production slip
• after 4 October 04 puts L1 sensors on critical
  path
• 14.2 weeks slack relative to current silicon
  ready to move date

11
Summary

• Excellent progress on prototyping and
  pre-production of the D0 Run IIb Silicon Upgrade
• Prototypes of all components of the design are in
  hand
• Pre-production for most parts in progress
• Remaining technical challenges are being
  addressed
• Have started placing production orders
• A strong, knowledgeable, experienced and very
  dedicated team is working hard (in a rather
  challenging climate) to produce the upgraded
  silicon detector that D0 needs to significantly
  enhance its performance throughout Run IIb
• The constraints on the project dictate that we
  continue to push ahead in spite of the uncertainty

12
Charge

• The Committee is requested to review the overall
  readiness for placing the production order for
  the inner layer sensors for the DZero Run IIb
  silicon detector. In particular, the project is
  requesting that the Committee evaluate the
  following items
• Whether the sensor specifications meet the
  technical requirements for Run IIb, recommending
  any changes that may be necessary. This should
  include, but not be limited to, consideration of
  results from radiation testing.
• The completeness and viability of the quality
  assurance program the project has in place to
  qualify the production-version inner layer
  sensors, including a review of
• Soundness of the logistics of the testing and
  qualification plans
• Technical specifications and criteria for quality
  assurance
• Adequacy of the resources, both labor and
  equipment, that have been requested in the
  project plan for testing and QA. Included here
  should be an evaluation as to whether the
  throughput of qualified sensors will be adequate
  to maintain the project schedule
• The adequacy of the plans for logging data from
  sensor testing.
• The overall technical readiness for placing the
  order, and the procurement readiness and
  strategy. If the Committee has any reservations
  here, it is requested that they describe what
  additional work should be done in order to meet
  proper readiness criteria.

13
Inner Layer Sensor PRR

• Thank you for the insights, constructive
  comments, and recommendations that resulted from
  your review of the Outer Layer Sensors
• Thanks for taking the time to help us in this
  important endeavor