Progress Report since last ECFA-DESY, Prague Nov

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Progress Report since last ECFA-DESY, Prague Nov
02 Aurore Savoy-Navarro, LPNHE-Universités de
Paris 6/IN2P3-CNRS
SiLC RD activity at LPNHE-Paris

• ? Sensor Electronics Test bench
• ? Si-Envelope CAD design
  progress Si-FCH
• ? More on cooling studies protos
• ? More on MC performance studies
• ? Work on the SiLC PRC proposal
• Visit http//lpnhe-lc.in2p3.fr

J.E. Augustin, M. Baubillier, M. Berggren,
W.Bertoli, B. Canton, Cl. Chapron, C. Carimalo,
W.DaSilva, D. Imbault, F.
Kapusta, H. Lebbolo, F. Rossel, D. Vincent, ASN.
And collaboration
of Geneva U, ETHZ, Peruggia U. teams
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1.- SENSOR ELECTRONICS TEST BENCH
Major step forward The prototype long ladder has
been built following the AMS recipes to build
long ladders ? Geneva U for assembling
mounting of the individual sensors that
constitutes the long ladder, ? ETHZurich_at_ CERN
bonded the sensors and the VFE
electronics, and also Peruggia U.
Paris-LPNHE contributions The prototyped long
ladder is a key-element for the test-bench It
enable us to start an extensive study of the
characteristics both of the long microstrips and
the VFE electronics linked to it ?
S and N evolution wrt strip and shaping time
length, with temperature etc
? and also testing various
VFEsgtdesign of new VFE This test
activity is starting now at the Lab
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Assembly procedure (AMS)
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Assembly procedure (AMS)
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Assembly procedure (AMS)
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Assembly procedure (AMS)
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Assembly procedure (AMS)
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Assembly procedure (AMS)
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Assembly procedure (AMS)
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AMS-01 Silicon precision cut
? 3.5 ?m
t1 t2 l1 l2
The distance between the reference marks on the
silicon and the edge after the cut gt
the precision of the cutting itself
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AMS-01 Silicon alignement
The residual of the ladder metrology (after
gluing)
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The Prototype ladder VFE outputs
The p-side, 110 ?-RO pitch
The leakage current of all strips of each
sensor were measured
Ladder is made of 7 AMS, 4 sensors 4.1x7.2
cm2, 300? thick Today and tomorrow first
measurements of the ladder on Geneva test bench
The n-side, 220? RO pitch
A lot was learnt by our technical team on
the details of the construction of long
ladder VALUABLE for the next times (from
handmadeto large scale fabrication)
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• The output-kapton design
• allows
• Variable lengths 28, 56,
• 112, and 224 cm strip-length
• Change VFE (cutting the
• kapton)
• First tests on VA-64-hdr
• VA-1(better noise perf., lower
• dynamic range wrt to other VA)

Next step design of a new VFE (in September)
gtfoundry Jan04
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2.- Progress on CAD design of the Si-envelope
The honeycomb structure
The ladder made of 6 sensors
The SET-drawer For 5 ladders
Detailed CATIA-based design of SET and
SIT
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Importance of the tracking at large angle?
growing interest on the Si-FCH design
The physics interest of the large angle region is
growing with the with the increase of Ecm.
Physics both standard and beyond standard (SUSY,
Xdim) is giving several appealing scenarios that
require a good measurement of tracks including
down to very low angles wrt beam axis.
The LPNHE-Paris team is interested in the Si-FCH
and is thus pursuying the study of the large
angle region in two ways 1) Physicists simus
(SGV and to be started GEANT4-based simu) ?
study of the design (XUV geometry, number of
layers, long ?strips ? How long?
etc.), ? and of detector performances of
Si-FCH (Momentum resolution,
occupancy). Details from TESLA beam needed as
input info. 2) CAD mechanical design studies ?
with as drawback to 1) def of geometry DB
for the Si-FCH in GEANT 4 simu.
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Si-FCH Design Performance studies with
SGV-based simulations
Low Pt region lt 25 GeV/c
High Pt region gt 25 GeV/c
4 XUV planes are
presently considered. Impulsion resolution
of TPCstraw tubes (100?m reso/pt) wrt
TPCSi-FCH
(25?m reso/pt) Si-FCH better than straw
tubes for large impulsion and when the
angle wrt beam increases
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Evolution of the Si-FCH design from projective
to XUV
Chicago Wkshp Jan02
Projectivegt short strips
Going from projective to XUV geometry
St-Malo April 02
XUV gt long strips possible thus less channels
easy to build
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New Si-FCH design based on long ladders
Single sided designs
XXXX UUUU VVVV
XUV-triplet
The region of cut (if any) and around beam
axis must be studied and carefully designed
to avoid dead regions
Double-sided (true or
false) with X UVUVUVUVX
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More on Cooling studies
Two approaches in parallel
Mechanical prototype
CAD dedicated simu package
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Comparisons between proto measurements and CAD
simus computations
Tunning the simulations with the measurement
results on the
mechanical prototype
New measurements on prototype surrounding it with
an epoxy structure (more stringent than reality)
that mimics the honeycomb struture
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Further progress on the simulation
studiesLC-Note to be submitted in about one
weekand on http//lpnhe-lc.in2p3.fr/lcnotes

• Studies are SGV-based (see presentation by M.
  Berggren at Simu session)
• Main outcomes of this present work
• ? Study on the best geometry design for the
  proposed SET device
• The SET detector should be made of 3
  layers, with one double
• sided, packed as closely as possible, and
  with the best possible
• point resolution. Making the detector as
  thin as possible is
• useful but a second priority wrt previous
  points.
• Momentum resolution with TPC with or without SET
  (next page)
• Same for the Si-FCH (see some transparencies
  above)
• Hit density in SET
• Hit density in Forward tracking being started
• Effect of SET device on gammas
• Remark Although a fast simu, SGV includes
  mulitple scattering, materials,
• spiralling of low Pt charged
  tracks etc. (see SGV Web site)

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Low Pt range up to 25 GeV/c
High Pt range up to 250 GeV/c
1GeV/c
4.5 GeV/c
Assumptions TPC reduced to 155cm, pt resolution
180 ?m Under these assumptions An improvement
up to 20 is observed at high momenta and, For
low momenta the 2 reso curves cross at 4.5 and 1
GeV/c (tracks lt 1 GeV/c do not reach the SET) gt
modest (lt5) deterioration between 1 and 4,5 with
SET, rising up to 10 at 1.5GeV/c
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Setting-up of the SiLC collaboration PRC

• Worldwide RD activity for Si-tracking at the LC
• from 2003 to end 2006,
• With as main objectives, generic RD on
• Si-sensors ( ?strips, SDD, new SS-sensors)
• VFE, readout and RT processing electronics
• Mechanics XXXXXthin detector
• Simus studies developments
• Test bench, including test beams
• Calibration Monitoring issues
• Submission of a proposal for the next PRC
• May 7th-8th

See asns presentation on March 31st at the
International LC tracking Muon Report VRVS
Conference NIKHEF, see tracking Website And
http//lpnhe-lc.in2p3.fr /
Click on Amsterdam31