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IC Layout Techniques

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Metal1. Metal1. P mos. N mos. Gate. Sio2. Sio2. P Gate. Metal1 ... Metal1. Metal1. P mos. N mos. Gate. Sio2. Sio2. P N- Vdd. Vss. DRC (Design Rule Check) ... – PowerPoint PPT presentation

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Title: IC Layout Techniques


1
IC Layout Techniques
Saravanan Ramamoorthy
2
N Well
3
  • Source and Drain

4
  • Gate or poly

5
  • Metal 1 Contact

6
(No Transcript)
7
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8
(No Transcript)
9
DRC
  • (Design Rule Check)

10
  • RX Active region ( gate oxide and N-/P
    diffusion region )
  • NW N-Well region
  • PC Polysilicon line (gate of the
    transistor)
  • BP Area which are blocked from P
    source and drain implant
  • CA Square stud contact which contacts
    either RX or PC to M1
  • M1 First level thin metal layer
  • V1 Square vias for connecting M1 to M2

11
  • Minimum length and width of CA should be 0.2um

12
  • Minimum overlap of CA by M1 should be
    0.02um

13
  • Min overlap of CA by RX should be 0.1um

14
  • Min distance between CA should be 0.24um

15
  • Min distance between CA and PC should be 0.16um

16
  • Min PC width should be 0.18um

17
  • Min distance between PC should be 0.24um

18
  • Min distance from RX to PC and BP should be
    0.24um and 0.36um respectively

19
  • Min overlap of RX by N well should be 0.42um

20
  • Min distance between RX should be 0.26um

21
  • Min M1 width should be 0.24um

22
  • Min distance between M1 should be 0.2um

23
  • Min length and width for V1 should be 0.28um

24
  • Min M2 width should be 0.28um
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