Report from Florence

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Report from Florence

• TIB Modules Bonding

Mirko Brianzi Enrico Scarlini 01 Feb 2005
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Status
TIB Modules in Florence
L 3-4 L 1-2 L s-R L s-L TOT
Riceived 141 46 13 13 213
Bonded 132 46 13 13 204
ARC tested 131 46 13 13 203
LT tested 126 41 11 11 189
Bad 5 1 1 1 8
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Damaged APV channels

• In the post-bonding ARC test, 4 modules had the
  first channel of the first APV damaged.
• That channel correspond to the first pad touched
  by the bonder machine
• possible electrostatic discharge?
• still under investigation

4
Pull Test

• All Pull Test are made on extra bonds included
  the readout bonds for L3-4 modules.
• So we can set the best Loop Height for pull test
  and we dont need the correction factor.

5
Back

• Pad on the Back side is often not well glued and
  dirt.
• This is not a real problem
• because the bonding area is big
• and we can bond in a different
• position.

6
Bonding gold bias pad

• Adjusting some settings of the Bond Machine now
  we can better bond also critical Gold pads for
  the filter capacitor...
• ...anyway some modules are more difficult than
  others to be bonded because the gold quality is
  not constant.

7
Some Pictures
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Some Pictures
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Some Pictures
Classic Gold for Bonding
Gold on the module