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Title: The Emerging Electronic Design Automation


1
The Emerging Electronic Design Automation
  • Design Technology Needs for Supporting Emerging
    Reaches of Silicon
  • Rajesh Gupta, UC San Diego
  • gupta_at_ucsd.edu

http//www.cse.ucsd.edu/gupta
2
A Chip Is A Wonderful Thing!
  • A typical chip, circa 2006
  • 50 square millimeters
  • 50 million transistors
  • 1-10 GHz, 100-1000 MOP/sq mm, 10-100 MIPS/mW
  • 300 mm, 10,000 units/wafer, 20K wafers/month
  • 5 per part
  • Does not matter what you build
  • Processor, MEMS, Networking, Wireless, Memory
  • So there is a strong incentive to port your
    application, system, box to the chip

3
The Technology and Its Industry
4
The EDA Industry
  • Current EDA market
  • 1B Synthesis and verification
  • 400M synthesis, 400M verification, 200M
    Emulation
  • 2.7in PDA, IP and Design Services.
  • 8 Y-Y growth in Q2/2003
  • More like 6.0 for tool licenses (85 of revenue)
  • Revenue Drivers for EDA
  • Semiconductor RD spending
  • Design completion activity
  • Semiconductor capital expenditures (backend EDA
    tools)
  • Good chips and more chips lead to EDA growth

5
But it costs 20M to build one
Source IBS 2003
  • Not a problem, until you consider this

6
Disaggregation in Semis
  • Of the 72 distinct application markets that rely
    on value added IC designs (ASIC, ASSP, FPGA, SOC)
  • over 50 are less than 500M
  • 75 are less than 1B
  • Manufacturing is no longer a competitive
    advantage

Source IBS
7
Rising Fabless, Fablite
  • Currently at 20B
  • about 15 of the semiconductor market
  • going up to 50 by 2006
  • Design technology needs are not the same as those
    of high value part manufacturers
  • Example Baseband and CMOS Radio

Source Teresa Meng, Atheros
8
A Changing Industry
  • Structural Changes
  • Outsourcing Fabrication, Design Implementation
  • Technological Changes
  • New materials and devices being explored to
    overcome the roadmap brickwalls
  • The mega-investments into nanotechnology
  • History tells us that fundamental device
    discoveries happen within a relatively short
    period of time
  • All major components of IC today were invented
    within a 10-year period from the Shockley
    transistor in 1947
  • But a long development cycle for manufacturing
    (more on it later)

9
Dragging EDA Along With It
  • (Rapidly) Falling ASIC Starts
  • From 10K in 1996 to about 2K in 2005
  • Rise of FPGAs and Deep Deep Submicron Noise
  • Can lead to shrinking or at best stationary
    market in ICs
  • EDA moving from expansion to retention phase.
  • Desai, Industry Update, Nov 2003
  • More and more it is EDA consuming itself
  • Revenue reallocation within the same block
    Verification, Synthesis
  • Major portions of EDA revenues are business with
    itself
  • Basic value proposition is being lost
  • OTOH, Dataquest predicts 15 growth based on ESL
    expansion
  • The record there is not so good so far
  • Compilers, embedded systems, software
  • Embedded software is about a 1B
  • Are we becoming irrelevant?

10
What Must EDA Do?
  • A Three-Point Prescription
  • Understand the new silicon
  • Enable box makers expand reach of silicon
  • Understand that marketplace is not everything

11
The New Semi Characteristics
1
  • Highly application specific
  • domain specific IC design, focus on system level
  • Content increasingly determines processing
  • embedded intelligence through embedded software
  • Connection more important than processing
  • bandwidth delivery more important than
    computational efficiency

12
New Semi Challenges
1
  • Need streamlined/simplified system architectures
  • gain from scalability, adaptability, not from
    design complexity
  • The technology favors concurrency than speed
  • Design reuse, design closure and sign-off
  • make IP viable through software value add and
    platform ownership
  • Key technical challenges
  • Productivity, Power, Heterogeneous Integration,
    Test
  • Getting it right means many more systems
    capabilities through Software

13
Design Decisions Are Important
1
Source Teresa Meng
14
And Likelihood of Failure High
1
15
Engineering Moving Up
1
  • Chip Engineering Moving Up and Moving Down
  • Systems Engineering versus Silicon Engineering
  • Silicon Engineering Hot-buttons
  • Design for Manufacturing
  • Defect-tolerant Design
  • EDA has been so far supporting Silicon
    Engineering
  • With lip-service to System Engineering

16
Systems Engineering
1
  • Example Problem How to achieve high throughput
    in a SOC for wireless applications?
  • Can select a modem sub-system
  • that packs more bits/Hz, but it will tolerate
    less noise and be less robust so that link
    throughput may not improve
  • Can increase transmit power in RF subsystem
  • to improve robustness but this increases energy
    cost, reduces network capacity, and requires more
    expensive analog circuits (power amps)
  • Can reduce bits/frame
  • to tolerate higher bit error rates (BER) and
    provide more robustness, but this may increase
    overhead and queuing delays
  • Can increase precision in digital modem
  • to reduce noise, but this leads to wider on-chip
    busses and more power consumption
  • Getting it right (within engineering constraints)
    is the task of Systems Engineering

17
Expanding Semiconductor Use
2
18
Future Silicon Proliferation
2
  • From Computers, Communications to
  • Gaming, Robotics, Biomedical,
  • Going Forward Si Has Place in Major Human
    Endeavors
  • Communications Wireless, Sensor networks, open
    spectrum
  • Entertainment Virtual worlds, education,
    multimedia delivery
  • Medicine and Biology lab-on-chip, devices
    disability assists
  • Transportation automotive, avionics
  • Physical Sciences big science, life sciences
  • Exploration space, oceanic

19
Accelerating Proliferation
2
Near Future lt 5 years
Going Forward gt 5 years
20
Environmental Monitoring
2
  • Santa Margarita Ecological Reserve, SMER
  • 4,334 acre field station 50 miles NE of San Diego
    with variety of habitat, terrain
  • A testbed for 56 ongoing experiments including
    sensing
  • Hydrology (stream flow, temp, pH, O2,
    conductivity..)
  • Microclimate, fire hazard
  • Chemical, biological agents
  • High Performance Wireless Research and Education
    Network
  • 45 Mbps wireless backbone running across southern
    CA connecting
  • SMER, Mt. Palomar, IGPP/SIO seismic network
  • Real-time environmental monitoring
  • Seismic, oceanographic, hydrological, ecological
    data
  • http//hpwren.ucsd.edu

21
Santa Margarita Ecological Reserve
2
Water Chemistry Quality Stations
Source, Dan Cayan, UCSD SIO
22
Drive Integration BioChem Labs.
2
  • Crisis detection, evolutionary monitoring,
    genotyping
  • ComputationNetworkingSensing
  • In-package integration of microfluidic,
    communications, networking and processing
    subsystems
  • Remotely operated, reconfigurable laboratories
    for biochemical analysis
  • Sub-systems
  • Biofluidic sample preparation, transport,
    disposal
  • Chemical analysis, biological assays
  • In-situ monitoring, control, communication,
    adaptation

23
Going ForwardOn-Chip Chemistry
2
24
Drive IC Into Fabrics and Buildings
2
Ember radios and networks
Source Ember Networks
25
Systems Engineering through EDA
1
  • Consider Wireless SOC
  • Platforms OMAP, PCA, MXC
  • Basic theme
  • Merging hardware Heterogenous MP on-chip
  • Separating software
  • Communications, networking, applications
  • In the process, a lot of legacy stuff is left in
    as overheads
  • Multiple UI functions, fragmented memory system
    and shared memory processor locks

2
26
Multiple Heterogenous On-Chip
1
2
  • Software development is a challenge with evolving
    processors
  • Shared memory processing
  • Use OS and API support to provide a usable
    programming model
  • Divergent approaches
  • TI Integrate DSP, single programming environment
  • Intel, Motorola Separate Comm, Networking, App.
  • What is the right programming model for these
    systems?

27
ESL Technology Needs
1
  • These are needs that will turn technology
    capacity afforded by new chips into new systems
    capabilities
  • Components and Compositional Correctness
  • A posteriori validation is simply not possible
  • Software and Software Infrastructure
  • Hardware capabilities and constraints driving
    need for new software architecture
  • New awareness into software infrastructure
  • Energy, Location, Reactivity, Precision, Security

2
28
1 Compositional Correctness
1
  • Build Complete System Models
  • That includes the application and system software
  • Adapt, control and debug applications
  • Explore the full potential of SOC architectural
    platforms
  • e.g., by exploring applications, networking and
    communication subsystems together
  • How? Through Component Composition Framework
    (CCF)
  • Define compositional semantics
  • enable easy system construction and its formal
    validation
  • adequate, hierarchical and verifiable
    composition
  • Create Virtual System Architectures
  • Leverage advances in programming languages and
    verification.

2
29
2 Software and Its Infrastructure
1
  • Changes in structure of system software
  • OS moving towards micro-kernels
  • Services moved to processes (e.g., Nucleus,
    Symbian)
  • Still legacy remains memory, file semantics as
    unifying theme for communications.
  • Changes in division of labor among
  • Application, middleware, operating system
  • Compiler, runtime
  • Challenges in bringing new capabilities and
    contract into the system software

2
30
Consider Energy Awareness
1
  • What does it mean to be aware?
  • Services know about energy, power
  • File system, memory management, process
    scheduling
  • Make each of them energy aware
  • How does one make software to be aware?
  • Use reflectivity in software to build adaptive
    software
  • Ability to reason about and act upon itself (OS,
    MW)
  • Make middleware adaptive to respond to
    application requirements
  • and to dynamically smooth the imbalances between
    demand and availability of energy resource

2
31
What Must EDA Do?
  • A Three-Point Prescription
  • Understand the new silicon
  • Enable box makers expand reach of silicon
  • Understand that marketplace is not everything

32
EDA Technology and Marketplace
3
  • By and large EDA technology moves through
    startups and acquisitions
  • One of the few industries where the business
    plans do not always call for sustainable
    standalone business
  • The driver for EDA industry growth is
    Semiconductor RD
  • Major semi innovations happened in the industry
    labs.

33
Semi. RD Is Changing Rapidly
3
  • Shrinking, vanishing industry research
    laboratories
  • Industry resorting to consortia to carry out
    needed technology innovations and developments
  • Often with substantial government support
  • SEMATECH, SELETE, ASET, MEDIA, ITRI,
    HsinChuPark,

34
Sematech Experience EDATech
  • US Semiconductor industry gradually lost share
    starting late 70s
  • By 1985, it lost leadership. Semi equipment
    vendors were loosing share about 5 per year
  • Its fate was pretty much sealed until the
    industry and Reagan administration decided to do
    something about The Rising Sun
  • The industry worked hard to define a
    precompetitive space
  • Supported the supplier industry to semi houses
  • 100M per year, for 8 years until 1994
  • 800M investment by the government, 100M per
    year
  • By 1994, the industry assumed its leadership
    position.

35
Summary
  • The new Silicon comes out of the fab fast and
    furious
  • Our ability to implement and manufacture vastly
    exceeds our capability to architect, reason and
    validate the new generation of silicon systems
  • Our challenge is to make sure what goes into
    manufacturing has tremendous value-add to end
    application (systems)
  • Software is the defining IP
  • But it is a whole new ballgame new awareness,
    fangled, adaptive,
  • RD leadership necessary to turn Si advantage
    into new systems capabilities
  • New applications as reflected in new forms of
    computing
  • Cognitive, Mobile, Entertainment, Embedded,
    Wireless, Trusted/secure computing, and so on.
  • If left alone, the gap between our systems
    capabilities and new Si possibilities will
    continue to widen.

36
Questions to ponder
  • What is the right precompetitive space for EDA?
  • Frameworks
  • Backend backplane
  • Data format standards
  • Language, libraries, models, models of
    computation
  • What is the next big application space for Semis?
  • Lab-on-chip, smart fabrics, appliances, robotics
  • What are the training needs for the EDA
    professional? And where will the jobs be?
  • Systems engineering, Nanotechnology, Biology,
    Chemistry
  • What is Plan B for EDA?
  • How can EDA expand beyond supplier to Semis?
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